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MCIMX6S1AVM08AC

NXP Semiconductors

MCIMX6S1AVM08AC by NXP Semiconductors

MCIMX6S1AVM08AC by NXP Semiconductors is a 64-bit microprocessor with 16-bit address bus width, 32-bit external data bus width, and max clock frequency of 24 MHz. Ideal for automotive applications due to its low power mode, CMOS technology, and terminal finish of tin silver copper.

Median Price

$29.588

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 9,420 parts In-Stock

1+ parts

-

100+ parts

$26.300

1k+ parts

$23.530

10k+ parts

$22.140

9,420

-

$26.300

$23.530

$22.140

Verical

USA . 9,420 parts In-Stock

1+ parts

-

100+ parts

$32.875

1k+ parts

$29.413

10k+ parts

$27.675

9,420

-

$32.875

$29.413

$27.675

EBV Elektronik

Germany . 7,560 parts In-Stock

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7,560

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Avnet

USA . 60 parts In-Stock

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60

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Distributors (In-Stock)

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Nova Conductors

Japan . 15 parts In-Stock

1+ parts

$33.057

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-

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15

$33.057

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TME

Poland . 7,560 parts In-Stock

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-

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$35.060

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-

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7,560

-

$35.060

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Vyrian

USA . 7,492 parts In-Stock

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Anansix

USA . 2,537 parts In-Stock

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Digiode

USA . 2,267 parts In-Stock

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Flip Electronics

USA . 430 parts In-Stock

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430

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Manotoh

Italy . 11 parts In-Stock

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Distributors (Availability)

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One Stop Electronics

USA . 7,499 parts In-Stock

1+ parts

$1.000

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$1.000

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Ampacity Inc.

Singapore . 7,778 parts In-Stock

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$19.000

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$19.000

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Continental Prestige Electronics

USA . 684 parts In-Stock

1+ parts

$32.020

100+ parts

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10k+ parts

$31.380

684

$32.020

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$31.380

Microchip USA

USA . 2,698 parts In-Stock

1+ parts

$73.638

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2,698

$73.638

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Lixinc

USA . 11,892 parts In-Stock

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UNI Independent Distributors

Spain . 7,971 parts In-Stock

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Argo Parts USA

USA . 2,045 parts In-Stock

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Corphita

USA . 1,312 parts In-Stock

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1,312

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Netroflash

USA . 50 parts In-Stock

1+ parts

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$32.396

1k+ parts

$31.404

10k+ parts

$30.743

50

-

$32.396

$31.404

$30.743

Overview

Unlock unparalleled performance and efficiency with the MCIMX6S1AVM08AC microprocessor from NXP Semiconductors. Built with cutting-edge technology and a commitment to superior quality, this powerhouse is designed for a wide range of applications, from automotive to industrial. With integrated cache, low power mode, and a lightning-fast clock frequency of 24 MHz, customers can expect nothing but top-notch performance and reliability. Elevate your projects to new heights with the MCIMX6S1AVM08AC and experience the ultimate value it brings to your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and helps to protect the microprocessor from external elements, making it a reliable choice.

Integrated Cache: YES

The integrated cache allows for faster data access, enhancing the overall performance of the microprocessor.

Surface Mount: YES

The surface mount design makes installation easier and more efficient, saving time during assembly.

Maximum Supply Voltage: 1.5 V

With a high maximum supply voltage, this microprocessor can handle power fluctuations and operate reliably under varying conditions.

Address Bus Width: 16

The wide address bus width allows for efficient data transfer and processing, improving the speed and performance of the microprocessor.

Package Shape: SQUARE

The square package shape maximizes space utilization and makes it easy to integrate the microprocessor into various devices.

Bit Size: 64

The 64-bit architecture enables the microprocessor to handle complex calculations and tasks with ease, making it suitable for high-performance applications.

No. of Terminals: 624

The large number of terminals provides flexibility for connecting external components and peripherals, expanding the functionality of the microprocessor.

Package Style: GRID ARRAY, LOW PROFILE, FINE PITCH

This package style offers high density and precise connections, making it ideal for compact and complex electronic systems.

Minimum Supply Voltage: 1.275 V

With a low minimum supply voltage, this microprocessor operates efficiently while reducing power consumption, resulting in energy savings.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures the microprocessor can handle heat-intensive applications without compromising performance.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the microprocessor to function in extreme cold environments, expanding its range of applications.

Technical Specifications

Microprocessors MCIMX6S1AVM08AC attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Additional Features:

24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE

Address Bus Width:

16

Bit Size:

64

Boundary Scan:

YES

Maximum Clock Frequency:

24 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B624

JESD-609 Code:

e1

Length:

21 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

624

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.6 mm

Speed:

800 rpm

Maximum Supply Voltage:

1.5 V

Minimum Supply Voltage:

1.275 V

Nominal Supply Voltage:

1.35 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

21 mm

Peripheral IC Type:

Trade Compliance

MCIMX6S1AVM08AC Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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