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MPC880CVR66

NXP Semiconductors

MPC880CVR66 by NXP Semiconductors

NXP Semiconductors' MPC880CVR66 microprocessor features 32-bit address and external data bus width, with integrated cache and low power mode. Ideal for RISC-based applications, it operates at a speed of 66 rpm with a max supply voltage of 1.9 V. The package style is grid array, making it suitable for various electronic devices requiring high processing power in a compact form factor.

Median Price

$57.780

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

MPC880CVR66 by NXP Semiconductors
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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 184 parts In-Stock

1+ parts

-

100+ parts

$57.780

1k+ parts

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184

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$57.780

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Rochester

USA . 128 parts In-Stock

1+ parts

-

100+ parts

$42.550

1k+ parts

$38.070

10k+ parts

$35.830

128

-

$42.550

$38.070

$35.830

DigiKey

USA . 128 parts In-Stock

1+ parts

-

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128

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Flip Electronics (Authorized)

USA . 88 parts In-Stock

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88

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Verical

USA . 88 parts In-Stock

1+ parts

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100+ parts

$63.126

1k+ parts

-

10k+ parts

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88

-

$63.126

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$41.943

100+ parts

-

1k+ parts

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500

$41.943

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Digiode

USA . 3,187 parts In-Stock

1+ parts

$45.020

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3,187

$45.020

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Vyrian

USA . 7,917 parts In-Stock

1+ parts

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7,917

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Anansix

USA . 1,871 parts In-Stock

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1,871

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R&J Components

USA . 326 parts In-Stock

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326

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DigiKey Marketplace

USA . 184 parts In-Stock

1+ parts

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184

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Flip Electronics

USA . 88 parts In-Stock

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88

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 589 parts In-Stock

1+ parts

$10.828

100+ parts

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589

$10.828

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Ampacity Inc.

Singapore . 150 parts In-Stock

1+ parts

$40.280

100+ parts

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150

$40.280

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Semicontronic

India . 150 parts In-Stock

1+ parts

$40.280

100+ parts

$39.273

1k+ parts

$39.072

10k+ parts

-

150

$40.280

$39.273

$39.072

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Continental Prestige Electronics

USA . 1,971 parts In-Stock

1+ parts

$41.943

100+ parts

-

1k+ parts

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10k+ parts

$41.104

1,971

$41.943

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-

$41.104

Corphita

USA . 1,974 parts In-Stock

1+ parts

$42.651

100+ parts

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1,974

$42.651

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Vigor

Singapore . 160 parts In-Stock

1+ parts

$45.490

100+ parts

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160

$45.490

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Microchip USA

USA . 436 parts In-Stock

1+ parts

$47.975

100+ parts

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436

$47.975

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UNI Independent Distributors

Spain . 6,754 parts In-Stock

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6,754

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Argo Parts USA

USA . 3,710 parts In-Stock

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3,710

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Netroflash

USA . 500 parts In-Stock

1+ parts

-

100+ parts

$41.104

1k+ parts

$39.846

10k+ parts

$39.007

500

-

$41.104

$39.846

$39.007

Overview

Discover the cutting-edge MPC880CVR66 microprocessor by NXP Semiconductors, crafted with precision and reliability in mind. This powerful chip is designed to enhance performance across a range of applications, offering lightning-fast speed and efficiency. With integrated cache and low power mode, this microprocessor delivers unmatched value and benefits to customers seeking top-notch quality and high-performance technology. Unleash the true potential of your devices with the MPC880CVR66 and experience the difference that NXP Semiconductors brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material provides durability and protection for the microprocessor, ensuring longevity and reliability.

Integrated Cache: YES

Having integrated cache improves the speed and efficiency of the microprocessor by reducing the time needed to access frequently used data.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation of the microprocessor on a circuit board, saving time and space during assembly.

Maximum Supply Voltage: 1.9 V

Operating at a maximum supply voltage of 1.9V ensures efficient power consumption and prevents overheating of the microprocessor.

Address Bus Width: 32

A wide address bus width of 32 bits enables the microprocessor to access and process large amounts of memory efficiently.

Package Shape: SQUARE

The square package shape allows for easy integration and space-saving design in electronic devices using the microprocessor.

Bit Size: 32

With a 32-bit architecture, the microprocessor can handle complex calculations and data processing tasks with speed and precision.

Power Supplies (V): 1.8,3.3

Supporting multiple power supply voltages of 1.8V and 3.3V provides flexibility in designing and operating electronic systems with this microprocessor.

No. of Terminals: 357

Having 357 terminals allows for a high level of connectivity and integration with other components in the electronic system.

Package Style (Meter): GRID ARRAY

Grid array package style offers efficient thermal management and mechanical stability for the microprocessor, enhancing its overall performance.

Minimum Supply Voltage: 1.7 V

Operating at a minimum supply voltage of 1.7V ensures reliable performance even under low power conditions for the microprocessor.

Terminal Finish: TIN SILVER COPPER

Having a terminal finish of Tin Silver Copper provides excellent conductivity and resistance to corrosion, ensuring long-term reliability of connections.

Terminal Position: BOTTOM

Bottom terminal position allows for easy and secure mounting of the microprocessor on a circuit board, ensuring stable connections and signal transmission.

Maximum Seated Height: 2.52 mm

A maximum seated height of 2.52mm enables compact and slim designs for electronic devices using this microprocessor.

Width: 25 mm

Compact width of 25mm makes the microprocessor suitable for space-constrained applications and allows for flexibility in device design.

Boundary Scan: YES

Boundary scan capability allows for efficient testing and debugging of the microprocessor during the manufacturing process, ensuring quality control.

External Data Bus Width: 32

With an external data bus width of 32 bits, the microprocessor can transfer data quickly between external devices, improving overall performance.

Maximum Time At Peak Reflow Temperature (s): 30

Being able to withstand peak reflow temperatures for up to 30 seconds ensures reliable soldering and assembly of the microprocessor on a circuit board.

Peak Reflow Temperature °C: 245

The high peak reflow temperature of 245°C allows for secure soldering and reliable connections of the microprocessor during assembly.

Length: 25 mm

Compact length of 25mm enables versatile placement and integration of the microprocessor in various electronic devices and systems.

Peripheral IC Type: MICROPROCESSOR, RISC

The microprocessor with RISC architecture offers high performance and efficiency in processing instructions, making it ideal for compute-intensive tasks.

Technology: CMOS

CMOS technology ensures low power consumption and high speed operation, making the microprocessor energy-efficient and suitable for battery-powered devices.

Terminal Form: BALL

Having a terminal form of ball ensures reliable connections and easy installation of the microprocessor on a circuit board, enhancing overall system performance.

Nominal Supply Voltage: 1.8 V

Operating at a nominal supply voltage of 1.8V ensures stable and efficient performance of the microprocessor in various electronic applications.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27mm allows for precise and secure connections of the microprocessor on a circuit board, ensuring reliable signal transmission.

Format: FIXED POINT

Fixed-point format provides accurate and efficient representation of numerical data, enhancing the processing capabilities of the microprocessor.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, the microprocessor is suitable for use in various environmental conditions, ensuring reliability and longevity.

Speed: 66 rpm

Operating at a speed of 66 rpm, the microprocessor delivers fast and efficient performance in handling computational tasks and data processing.

Low Power Mode: YES

Having a low power mode allows the microprocessor to optimize its power consumption, extending battery life and reducing overall energy usage in portable devices.

Technical Specifications

Microprocessors MPC880CVR66 attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Address Bus Width:

32

Bit Size:

32

Boundary Scan:

YES

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B357

JESD-609 Code:

e1

Length:

25 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

357

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA357,19X19,50

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

Maximum Seated Height:

2.52 mm

Speed:

66 rpm

Sub-Category:

Microprocessors

Maximum Supply Voltage:

1.9 V

Minimum Supply Voltage:

1.7 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

25 mm

Peripheral IC Type:

Trade Compliance

MPC880CVR66 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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