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STM32MP135CAE3

STMicroelectronics

STM32MP135CAE3 by STMicroelectronics

STM32MP135CAE3 by STMicroelectronics is a 32-bit microprocessor with 172032 RAM words and 48 MHz clock frequency. It features 289 terminals, operates b/w -40 to 125 °C, and has low power mode for energy efficiency. Ideal for applications requiring high-speed processing in compact devices.

Median Price

$10.710

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 125 parts In-Stock

1+ parts

$4.759

100+ parts

-

1k+ parts

-

10k+ parts

-

125

$4.759

-

-

-

Verical

USA . 125 parts In-Stock

1+ parts

$4.759

100+ parts

-

1k+ parts

-

10k+ parts

-

125

$4.759

-

-

-

Farnell

UK . 170 parts In-Stock

1+ parts

$5.370

100+ parts

$4.570

1k+ parts

-

10k+ parts

-

170

$5.370

$4.570

-

-

Chip1Stop

Japan . 150 parts In-Stock

1+ parts

$6.730

100+ parts

-

1k+ parts

-

10k+ parts

-

150

$6.730

-

-

-

DigiKey

USA . 123 parts In-Stock

1+ parts

$10.710

100+ parts

$7.153

1k+ parts

$6.581

10k+ parts

$6.444

123

$10.710

$7.153

$6.581

$6.444

Mouser Electronics

USA . 94 parts In-Stock

1+ parts

$10.710

100+ parts

$7.160

1k+ parts

$6.430

10k+ parts

-

94

$10.710

$7.160

$6.430

-

Newark

USA . 130 parts In-Stock

1+ parts

$11.030

100+ parts

$7.370

1k+ parts

$6.780

10k+ parts

-

130

$11.030

$7.370

$6.780

-

RS (Exports)

UK . 119 parts In-Stock

1+ parts

$11.141

100+ parts

$9.062

1k+ parts

-

10k+ parts

-

119

$11.141

$9.062

-

-

Element14

Singapore . 170 parts In-Stock

1+ parts

$16.690

100+ parts

$11.910

1k+ parts

$11.680

10k+ parts

-

170

$16.690

$11.910

$11.680

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 484 parts In-Stock

1+ parts

$4.150

100+ parts

-

1k+ parts

-

10k+ parts

-

484

$4.150

-

-

-

Nova Conductors

Japan . 64 parts In-Stock

1+ parts

$9.029

100+ parts

-

1k+ parts

-

10k+ parts

-

64

$9.029

-

-

-

Vyrian

USA . 7,900 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,900

-

-

-

-

Anansix

USA . 2,057 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,057

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 154 parts In-Stock

1+ parts

$3.710

100+ parts

-

1k+ parts

-

10k+ parts

-

154

$3.710

-

-

-

Semicontronic

India . 154 parts In-Stock

1+ parts

$3.710

100+ parts

$3.617

1k+ parts

$3.599

10k+ parts

-

154

$3.710

$3.617

$3.599

-

Corphita

USA . 189 parts In-Stock

1+ parts

$3.931

100+ parts

-

1k+ parts

-

10k+ parts

-

189

$3.931

-

-

-

Continental Prestige Electronics

USA . 170 parts In-Stock

1+ parts

$7.610

100+ parts

$6.000

1k+ parts

-

10k+ parts

-

170

$7.610

$6.000

-

-

Argo Parts USA

USA . 4,791 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,791

-

-

-

-

Netroflash

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

$8.848

1k+ parts

$8.578

10k+ parts

$8.397

2,000

-

$8.848

$8.578

$8.397

Overview

Unlock the power of innovation with the STM32MP135CAE3 by STMicroelectronics. As a leader in microprocessor technology, STMicroelectronics presents a versatile and reliable solution for a wide range of applications. From smart devices to industrial automation, this microprocessor offers seamless performance and efficiency. With integrated cache and low power mode, customers can experience optimized functionality without compromising on power consumption. Embrace the future of technology with the STM32MP135CAE3 and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microprocessor, ensuring longevity and reliability.

Integrated Cache: YES

Having integrated cache improves the performance and speed of the microprocessor by reducing memory access times.

Maximum Supply Voltage: 1.38 V

Allows for efficient power usage while providing enough voltage for optimal performance.

On Chip Data RAM Width: 8

The wider data RAM width enhances the microprocessor's ability to process and store data efficiently.

Address Bus Width: 26

A wider address bus allows for increased memory addressing capabilities, improving the microprocessor's performance for memory-intensive tasks.

Package Shape: SQUARE

The square package shape offers a compact design that efficiently utilizes space in electronic devices.

Bit Size: 32

A 32-bit architecture provides improved computational capabilities, making the microprocessor suitable for handling complex tasks and calculations.

No. of Terminals: 289

The high number of terminals offers versatile connectivity options, enabling integration with various external devices and components.

Minimum Supply Voltage: 1.21 V

The low minimum supply voltage helps in reducing power consumption, making the microprocessor energy efficient.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, the microprocessor can withstand heat and operate efficiently in demanding environments.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a RISC (Reduced Instruction Set Computing) microprocessor enables efficient processing of instructions, enhancing overall performance.

Speed: 650 rpm

The high speed capability of 650 rpm allows for quick data processing and execution of tasks, contributing to improved performance.

Technical Specifications

Microprocessors STM32MP135CAE3 attributes and parameters. Explore more Microprocessors devices from STMicroelectronics

Specs

Address Bus Width:

26

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

48 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B289

Length:

14 mm

Low Power Mode:

YES

No. of DMA Channels:

56

No. of Serial I/Os:

10

No. of Terminals:

289

On Chip Data RAM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA289,17X17,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

RAM Words:

172032

Maximum Seated Height:

1.7 mm

Speed:

650 rpm

Maximum Supply Current:

239 mA

Maximum Supply Voltage:

1.38 V

Minimum Supply Voltage:

1.21 V

Nominal Supply Voltage:

1.25 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

14 mm

Peripheral IC Type:

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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