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X66AK2H06XAAW2

Texas Instruments

X66AK2H06XAAW2 by Texas Instruments

X66AK2H06XAAW2 by Texas Instruments is a microprocessor with 24-bit address bus, 16-bit external data bus, and max clock frequency of 156.25 MHz. It is ideal for applications requiring high-speed processing in a compact form factor, such as embedded systems and IoT devices.

Median Price

$32.696

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$32.696

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100

$32.696

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Vyrian

USA . 4,151 parts In-Stock

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4,151

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Digiode

USA . 172 parts In-Stock

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172

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 686 parts In-Stock

1+ parts

$1.000

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686

$1.000

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AZTECH Wire

Italy . 876 parts In-Stock

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$16.086

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876

$16.086

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Parana Technologies

USA . 1,886 parts In-Stock

1+ parts

$27.453

100+ parts

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$36.040

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1,886

$27.453

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$36.040

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DigiPath Technology Company

USA . 610 parts In-Stock

1+ parts

$30.229

100+ parts

$27.811

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610

$30.229

$27.811

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ChromeModa Solutions

Germany . 764 parts In-Stock

1+ parts

$30.846

100+ parts

$25.294

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764

$30.846

$25.294

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IDEA Electronic Components Group

UK . 63 parts In-Stock

1+ parts

$30.846

100+ parts

$29.304

1k+ parts

$27.761

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63

$30.846

$29.304

$27.761

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Corphita

USA . 4,009 parts In-Stock

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Microchip USA

USA . 2,483 parts In-Stock

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Overview

Unleash the power of innovation with the X66AK2H06XAAW2 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality microprocessors that are designed for cutting-edge applications. This versatile product offers unmatched value, benefits, and advantages to customers looking to enhance their technology solutions. Experience seamless performance and reliability with the X66AK2H06XAAW2, the ultimate choice for all your microprocessor needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the microprocessor easy to handle and resistant to damage during shipping and installation.

Integrated Cache: YES

Having an integrated cache improves the performance of the microprocessor by reducing the time it takes to access frequently used data, resulting in faster processing speeds.

Maximum Supply Voltage: 1.05 V

The maximum supply voltage of 1.05 V helps to optimize power consumption and prevent overheating, ensuring the microprocessor operates efficiently and reliably.

Address Bus Width: 24

With a wider address bus width of 24, the microprocessor can handle larger amounts of data and memory addresses, enabling it to support complex computing tasks and applications.

Package Shape: SQUARE

The square package shape allows for efficient use of space on circuit boards, making it easier to integrate the microprocessor into various electronic devices without sacrificing performance.

No. of Terminals: 1517

Having 1517 terminals provides ample connectivity options for peripheral devices and components, allowing for versatile integration and expansion capabilities.

Minimum Supply Voltage: 0.95 V

The low minimum supply voltage of 0.95 V helps to reduce power consumption and extend the battery life of devices powered by the microprocessor, making it an energy-efficient choice.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, the microprocessor can withstand high temperatures without compromising performance, ensuring reliability in various operating environments.

Minimum Operating Temperature: 0 °C

The minimum operating temperature of 0°C allows the microprocessor to function effectively in cold environments, making it suitable for use in a wide range of temperature conditions.

Terminal Position: BOTTOM

Having terminals positioned at the bottom simplifies the installation and connection process, making it easier for manufacturers to integrate the microprocessor into their products efficiently.

Maximum Seated Height: 3.75 mm

The compact maximum seated height of 3.75 mm saves space on circuit boards and allows for slim designs in electronic devices, enhancing the overall aesthetics and portability of products.

Width: 40 mm

With a width of 40 mm, the microprocessor is compatible with standard sizing requirements for circuit boards, facilitating seamless integration into a wide range of electronic devices.

Boundary Scan: YES

Having boundary scan capability enables efficient testing and debugging of the microprocessor during production, ensuring high-quality and reliable performance in end-user devices.

External Data Bus Width: 16

The external data bus width of 16 allows for efficient data transfer between the microprocessor and external devices, enhancing overall system performance and responsiveness.

Maximum Clock Frequency: 156.25 MHz

With a high maximum clock frequency of 156.25 MHz, the microprocessor can handle demanding computational tasks and processes at fast speeds, improving overall processing efficiency.

Length: 40 mm

The length of 40 mm is ideal for compact electronic devices where space is limited, ensuring the microprocessor can be seamlessly integrated without compromising performance.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a microprocessor with Reduced Instruction Set Computing (RISC) architecture, it offers enhanced performance and power efficiency, making it suitable for a wide range of computing applications.

Technology: CMOS

Using Complementary Metal-Oxide-Semiconductor (CMOS) technology provides low power consumption and high noise immunity, ensuring the microprocessor operates efficiently and reliably in various environments.

Nominal Supply Voltage: 1 V

The nominal supply voltage of 1 V provides stable power delivery to the microprocessor, ensuring consistent performance and reliability in electronic devices.

Terminal Pitch: 1 mm

Having a terminal pitch of 1 mm allows for precise and secure connections on circuit boards, reducing the risk of signal interference and ensuring stable communication between the microprocessor and external components.

Format: FLOATING POINT

Supporting floating-point operations enhances the microprocessor's ability to handle complex mathematical calculations with improved accuracy and efficiency, making it suitable for scientific and computational applications.

Speed: 1200 rpm

With a speed of 1200 revolutions per minute (rpm), the microprocessor offers fast processing capabilities, enabling quick execution of instructions and tasks in electronic devices.

Low Power Mode: YES

The low power mode feature allows the microprocessor to conserve energy when not performing high-intensity tasks, extending battery life and reducing power consumption in mobile and battery-operated devices.

Technical Specifications

Microprocessors X66AK2H06XAAW2 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

24

Boundary Scan:

YES

Maximum Clock Frequency:

156.25 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B1517

Length:

40 mm

Low Power Mode:

YES

No. of Terminals:

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Maximum Seated Height:

3.75 mm

Speed:

1200 rpm

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

40 mm

Peripheral IC Type:

Trade Compliance

X66AK2H06XAAW2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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