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X66AK2H12AAAW24

Texas Instruments

X66AK2H12AAAW24 by Texas Instruments

X66AK2H12AAAW24 by Texas Instruments is a microprocessor with 24-bit address bus width, 16-bit external data bus width, and max clock frequency of 156.25 MHz. It is ideal for applications requiring high-speed processing in a compact form factor, such as embedded systems and IoT devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,595 parts In-Stock

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Digiode

USA . 354 parts In-Stock

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354

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AZTECH Wire

Italy . 883 parts In-Stock

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$11.271

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883

$11.271

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One Stop Electronics

USA . 129 parts In-Stock

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$30.000

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129

$30.000

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Parana Technologies

USA . 1,299 parts In-Stock

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$46.297

100+ parts

$4,299.370

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$41.667

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1,299

$46.297

$4,299.370

$41.667

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DigiPath Technology Company

USA . 1,039 parts In-Stock

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$50.979

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1,039

$50.979

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ChromeModa Solutions

Germany . 4,121 parts In-Stock

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$52.019

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$42.656

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$52.019

$42.656

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IDEA Electronic Components Group

UK . 597 parts In-Stock

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$52.019

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$49.418

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$46.817

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597

$52.019

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Component Stockers USA

USA . 518 parts In-Stock

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$99.990

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Microchip USA

USA . 3,608 parts In-Stock

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Corphita

USA . 1,657 parts In-Stock

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Overview

Unleash the power of innovation with the X66AK2H12AAAW24 by Texas Instruments, a cutting-edge microprocessor designed to elevate performance and efficiency. Crafted with precision and expertise, this product boasts integrated cache and a high clock frequency for seamless operation. From automotive systems to industrial automation, this versatile device caters to a wide range of applications with ease. Experience the reliability and excellence that Texas Instruments is renowned for, while reaping the benefits of superior functionality and low power consumption. Upgrade your technology solutions today with the X66AK2H12AAAW24 for unparalleled performance and value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material makes the microprocessor lightweight and durable, ideal for portable devices.

Integrated Cache: YES

Integrated cache enhances the performance of the microprocessor by reducing memory access times and improving data processing speed.

Maximum Supply Voltage: 1.05 V

Operating at a maximum supply voltage of 1.05 V, the microprocessor consumes less power and produces less heat, making it energy-efficient.

Address Bus Width: 24

With a wide address bus width of 24, the microprocessor can access a large memory space, enabling it to handle complex computations and multitasking efficiently.

Package Shape: SQUARE

The square package shape allows for easy and compact integration of the microprocessor onto circuit boards, saving space in electronic devices.

No. of Terminals: 1517

A high number of terminals provide more connectivity options, allowing the microprocessor to interact with various peripheral devices and sensors.

Minimum Supply Voltage: 0.95 V

Operating at a minimum supply voltage of 0.95 V, the microprocessor can further reduce power consumption and extend battery life in mobile devices.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, the microprocessor can withstand heat better and remain stable during intensive computing tasks.

Minimum Operating Temperature: 0 °C

Operating at a minimum temperature of 0°C, the microprocessor is suitable for use in a wide range of environmental conditions without compromising performance.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy and secure soldering onto circuit boards, ensuring reliable electrical connections for the microprocessor.

Maximum Seated Height: 3.75 mm

With a low maximum seated height of 3.75 mm, the microprocessor can be integrated into slim devices without adding bulk or obstructing other components.

Width: 40 mm

Compact width of 40 mm allows the microprocessor to fit into small form factor devices, making it suitable for compact and space-constrained applications.

Boundary Scan: YES

Boundary scan capability enables efficient testing and debugging of the microprocessor during development and production, ensuring high quality and reliability.

External Data Bus Width: 16

With an external data bus width of 16, the microprocessor can transfer data between external devices at high speeds, enhancing overall system performance.

Maximum Clock Frequency: 156.25 MHz

Operating at a high maximum clock frequency of 156.25 MHz, the microprocessor can execute instructions quickly and handle demanding computational tasks efficiently.

Length: 40 mm

Convenient length of 40 mm allows the microprocessor to be easily integrated into standard-sized circuit boards and electronic devices.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a RISC-based microprocessor, it offers simplified instruction set and fast execution, making it suitable for high-performance computing applications.

Technology: CMOS

Utilizing CMOS technology, the microprocessor offers low power consumption, high speed operation, and compatibility with a wide range of electronic devices.

Terminal Form: BALL

Ball terminal form ensures reliable and secure electrical connections, making the microprocessor suitable for use in rugged and high-vibration environments.

Nominal Supply Voltage: 1 V

Operating at a nominal supply voltage of 1 V, the microprocessor strikes a balance between performance and power efficiency in various electronic devices.

Terminal Pitch: 1 mm

A small terminal pitch of 1 mm allows for high-density mounting of the microprocessor on circuit boards, optimizing space utilization and system design.

Format: FLOATING POINT

Supporting floating-point calculations, the microprocessor can handle complex mathematical operations accurately, making it suitable for scientific and engineering applications.

Speed: 1400 rpm

Operating at a speed of 1400 rpm, the microprocessor delivers swift data processing and multitasking capabilities, enhancing overall system responsiveness and performance.

Low Power Mode: YES

Low power mode feature enables the microprocessor to conserve energy when idle or during light computing tasks, prolonging battery life in portable devices.

Technical Specifications

Microprocessors X66AK2H12AAAW24 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 1200 GHZ

Address Bus Width:

24

Boundary Scan:

YES

Maximum Clock Frequency:

156.25 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B1517

Length:

40 mm

Low Power Mode:

YES

No. of Terminals:

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Maximum Seated Height:

3.75 mm

Speed:

1400 rpm

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

40 mm

Peripheral IC Type:

Trade Compliance

X66AK2H12AAAW24 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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