Loading...

MCF53721CVM240

NXP Semiconductors

MCF53721CVM240 by NXP Semiconductors

NXP Semiconductors' MCF53721CVM240 microprocessor features 32-bit architecture, 80 MHz clock frequency, and integrated cache. Ideal for industrial applications requiring low power consumption and high-speed processing in a compact square package with 196 terminals.

Median Price

$27.469

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

MCF53721CVM240 by NXP Semiconductors
Compare Share

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 9,450 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$27.469

10k+ parts

-

9,450

-

-

$27.469

-

EBV Elektronik

Germany . 630 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

630

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,140 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,140

-

-

-

-

Digiode

USA . 4,626 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,626

-

-

-

-

Flip Electronics

USA . 2,249 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,249

-

-

-

-

Anansix

USA . 1,723 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,723

-

-

-

-

TME

Poland . 650 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$38.240

10k+ parts

-

650

-

-

$38.240

-

Nova Conductors

Japan . 40 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

40

-

-

-

-

LIBRA Elektronik GmbH

Germany . 36 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

36

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 565 parts In-Stock

1+ parts

$3.000

100+ parts

-

1k+ parts

-

10k+ parts

-

565

$3.000

-

-

-

One Stop Electronics

USA . 402 parts In-Stock

1+ parts

$14.000

100+ parts

-

1k+ parts

-

10k+ parts

-

402

$14.000

-

-

-

Microchip USA

USA . 1,617 parts In-Stock

1+ parts

$46.028

100+ parts

-

1k+ parts

-

10k+ parts

-

1,617

$46.028

-

-

-

Corohmni

South Africa . 88 parts In-Stock

1+ parts

$78.400

100+ parts

-

1k+ parts

-

10k+ parts

-

88

$78.400

-

-

-

UNI Independent Distributors

Spain . 7,935 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,935

-

-

-

-

Argo Parts USA

USA . 5,676 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,676

-

-

-

-

Corphita

USA . 3,756 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,756

-

-

-

-

Continental Prestige Electronics

USA . 3,675 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,675

-

-

-

-

Robosynatics

Brazil . 1,512 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,512

-

-

-

-

Lucentia Tech

USA . 1,512 parts In-Stock

1+ parts

-

100+ parts

$82.389

1k+ parts

$80.707

10k+ parts

$80.707

1,512

-

$82.389

$80.707

$80.707

Aranea Global

USA . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

500

-

-

-

-

Perfect Parts

USA . 423 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

423

-

-

-

-

Overview

Upgrade your electronics with the MCF53721CVM240 from NXP Semiconductors. This high-quality microprocessor is perfect for a wide range of applications, offering integrated cache, high speed, and low power mode. With NXP Semiconductors' reputation for excellence in semiconductor manufacturing, you can trust that this product will deliver reliable performance. Experience the value and benefits of the MCF53721CVM240, designed to meet your needs and exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material provides durability and protection for the microprocessor, making it resistant to physical damage and environmental factors.

Integrated Cache: YES

Integrated cache helps improve the performance of the microprocessor by storing frequently accessed data and instructions, reducing the need to fetch them from slower memory locations.

Surface Mount: YES

Surface mount technology enables easy and efficient installation of the microprocessor onto circuit boards, saving space and enabling automated manufacturing processes.

Maximum Supply Voltage: 1.6 V

Operating within the maximum supply voltage range ensures stable performance and prevents damage to the microprocessor from overvoltage conditions.

Address Bus Width: 24

A wider address bus allows the microprocessor to access a larger memory space, enabling it to handle complex computations and data-intensive tasks efficiently.

Package Shape: SQUARE

Square package shape increases the stability and ease of mounting the microprocessor onto the circuit board, ensuring proper alignment and secure connection.

Bit Size: 32

Operating with a 32-bit architecture, the microprocessor can handle larger chunks of data at a time, improving processing speed and overall performance.

No. of Terminals: 196

Having a high number of terminals allows the microprocessor to interface with various components and peripherals, expanding its capabilities and compatibility.

Package Style (Meter): GRID ARRAY

Grid array package style provides a reliable and secure connection between the microprocessor and the circuit board, ensuring good signal integrity and reducing the risk of electrical issues.

Minimum Supply Voltage: 1.4 V

Operating within the minimum supply voltage range ensures that the microprocessor receives sufficient power for stable and reliable performance, even under low voltage conditions.

Maximum Operating Temperature: 85 °C

Operating at a maximum temperature of 85°C ensures that the microprocessor can withstand high-temperature environments without overheating or performance degradation.

Minimum Operating Temperature: -40 °C

Operating at a minimum temperature of -40°C ensures that the microprocessor can function in cold environments without experiencing performance issues or damage.

Terminal Finish: TIN SILVER COPPER

Terminal finish with Tin Silver Copper provides good conductivity, corrosion resistance, and reliability for the connections between the microprocessor and the circuit board.

Terminal Position: BOTTOM

Bottom terminal position allows for easy and secure mounting of the microprocessor onto the circuit board, ensuring proper alignment and connection for reliable operation.

Maximum Seated Height: 1.75 mm

With a maximum seated height of 1.75mm, the microprocessor can fit within slim and compact electronic devices, saving space and enabling sleek product designs.

Width: 15 mm

Compact width of 15mm enables easy integration of the microprocessor into various electronic devices and circuit boards, allowing for flexibility in product design and layout.

Boundary Scan: YES

Boundary scan feature allows for efficient testing and debugging of the microprocessor during production, ensuring high quality and reliability in the final product.

External Data Bus Width: 32

Operating with a 32-bit external data bus width enables the microprocessor to transfer data quickly between the processor and external memory or peripherals, enhancing overall performance.

Maximum Clock Frequency: 80 MHz

Having a maximum clock frequency of 80 MHz allows the microprocessor to execute instructions at a high speed, resulting in faster data processing and improved system performance.

Maximum Time At Peak Reflow Temperature (s): 40

The maximum time at peak reflow temperature of 40 seconds ensures that the microprocessor can undergo reflow soldering processes efficiently and reliably during manufacturing.

Peak Reflow Temperature °C: 260

Peak reflow temperature of 260°C enables the microprocessor to be soldered onto the circuit board securely, creating strong and durable connections for long-term use.

Length: 15 mm

Compact length of 15mm allows for easy integration of the microprocessor into electronic devices and circuit boards without taking up excessive space, enabling efficient product designs.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures that the microprocessor can operate reliably in harsh environmental conditions, making it suitable for industrial applications that require rugged performance.

Peripheral IC Type: MICROPROCESSOR, RISC

RISC architecture in the peripheral IC type ensures efficient and fast data processing, making the microprocessor suitable for handling complex calculations and applications with high performance demands.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and reliable performance for the microprocessor, making it energy-efficient and suitable for battery-powered devices.

Terminal Form: BALL

Ball terminal form provides reliable connections and easy installation of the microprocessor onto the circuit board, ensuring good electrical contact and stability during operation.

Nominal Supply Voltage: 1.5 V

Operating at the nominal supply voltage of 1.5V ensures stable and efficient performance of the microprocessor, providing the right level of power for optimal functionality.

Terminal Pitch: 1 mm

A terminal pitch of 1mm allows for close spacing of terminals on the microprocessor, enabling efficient connectivity and reliable signal transmission between the processor and the circuit board.

Format: FIXED POINT

Fixed-point format simplifies calculations and data processing for the microprocessor, offering precision and efficiency in handling numerical data and mathematical operations.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level of 3 indicates that the microprocessor can withstand moderate exposure to moisture during manufacturing and assembly processes without detrimental effects on performance.

Speed: 240 rpm

Operating at a speed of 240 rpm enables the microprocessor to execute instructions and process data quickly, allowing for efficient and responsive performance in various applications and tasks.

Low Power Mode: YES

Low power mode feature helps reduce energy consumption and heat generation in the microprocessor, enhancing battery life and overall efficiency in power-sensitive electronic devices.

Technical Specifications

Microprocessors MCF53721CVM240 attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Address Bus Width:

24

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

80 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B196

JESD-609 Code:

e1

Length:

15 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

196

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Speed:

240 rpm

Maximum Supply Voltage:

1.6 V

Minimum Supply Voltage:

1.4 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

15 mm

Peripheral IC Type:

Trade Compliance

MCF53721CVM240 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.1

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20