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MCF5208CVM166

NXP Semiconductors

MCF5208CVM166 by NXP Semiconductors

The NXP MCF5208CVM166 microprocessor features a 32-bit architecture with integrated cache and operates at a max clock frequency of 40 MHz. Ideal for industrial applications, it has a low power mode and supports boundary scan testing. With a temperature range from -40 to 85°C, this CMOS technology-based chip is suitable for various embedded systems requiring high performance in compact form factors.

Median Price

$29.501

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Verical

USA . 2,771 parts In-Stock

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Arrow

USA . 2,771 parts In-Stock

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DigiKey

USA . 848 parts In-Stock

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Mouser Electronics

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Future Electronics

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Avnet

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Nova Conductors

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Component Sense

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IBS Electronics

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NAC Semi

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Atlantic Semiconductor

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Semicontronic

India . 2,004 parts In-Stock

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$14.079

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Ampacity Inc.

Singapore . 1,797 parts In-Stock

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Aztec Data Supply Inc.

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Corphita

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Aranea Global

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Continental Prestige Electronics

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Corohmni

South Africa . 55 parts In-Stock

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Microchip USA

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Overview

Experience the power of innovation with the MCF5208CVM166 by NXP Semiconductors. This cutting-edge microprocessor offers unmatched performance and reliability, making it the ideal choice for a wide range of applications. From industrial automation to consumer electronics, this product delivers superior quality and efficiency. With its advanced features and low power mode, the MCF5208CVM166 provides exceptional value and benefits to customers looking to stay ahead in today's competitive market. Choose NXP Semiconductors for a seamless integration of technology into your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material allows for a lightweight and durable package, making it ideal for portable devices.

Integrated Cache: YES

With integrated cache, this microprocessor offers faster access to frequently used data, improving overall performance.

Surface Mount: YES

The surface mount capability makes installation and replacement of this microprocessor quick and efficient.

Maximum Supply Voltage: 1.6 V

Operating within a safe voltage range ensures the longevity and reliability of the microprocessor.

Address Bus Width: 24

A wider address bus allows for efficient communication between the microprocessor and other components in the system.

Package Shape: SQUARE

The square shape allows for easy mounting and integration into various electronic devices.

Bit Size: 32

A 32-bit size enables the microprocessor to handle complex calculations and data processing tasks effectively.

Power Supplies (V): 1.5,1.8/3.3

Compatibility with multiple power supply voltages offers flexibility in designing and implementing the microprocessor in different systems.

No. of Terminals: 196

Having a high number of terminals enables seamless connections with other components, ensuring reliable performance.

Package Style (Meter): GRID ARRAY, LOW PROFILE

The grid array and low profile design save space and offer efficient heat dissipation for better performance.

Minimum Supply Voltage: 1.4 V

The ability to operate at low supply voltages conserves energy and reduces heat generation, making it energy-efficient.

Maximum Operating Temperature: 85 °C

With a high operating temperature range, this microprocessor can withstand harsh environmental conditions.

Minimum Operating Temperature: -40 °C

The wide temperature range ensures the microprocessor's functionality even in extreme cold environments.

Terminal Finish: TIN SILVER COPPER

The terminal finish provides good conductivity and durability for reliable connections.

Terminal Position: BOTTOM

The bottom terminal position simplifies installation and ensures easy access for maintenance.

Maximum Seated Height: 1.6 mm

The low seated height enables compact design and efficient heat dissipation in tight spaces.

Width: 15 mm

The slim width allows for easy integration and placement in a variety of electronic devices.

Boundary Scan: YES

Boundary scan capability facilitates testing and debugging of the microprocessor during production and maintenance.

External Data Bus Width: 32

A wider external data bus width allows for faster data transfer and processing speed.

Maximum Clock Frequency: 40 MHz

The high clock frequency enables rapid execution of instructions, leading to improved overall performance.

Maximum Time At Peak Reflow Temperature (s): 40

This specification ensures that the microprocessor can withstand reflow soldering processes without damage.

Peak Reflow Temperature °C: 260

The peak reflow temperature tolerance ensures reliability during the soldering process.

Length: 15 mm

The compact length makes this microprocessor suitable for space-constrained applications.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh industrial environments.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a RISC microprocessor allows for efficient execution of reduced instruction sets, enhancing performance.

Technology: CMOS

CMOS technology provides low power consumption and high speed operation for efficient processing.

Terminal Form: BALL

The terminal form offers secure and reliable connections for optimal performance.

Nominal Supply Voltage: 1.5 V

Operating at a nominal supply voltage ensures stable and efficient performance.

Terminal Pitch: 1 mm

The tight terminal pitch allows for high-density mounting and space-saving design.

Format: FIXED POINT

The fixed-point format enables accurate and precise calculations for various applications.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level ensures proper handling and storage to prevent damage from moisture exposure.

Speed: 166.67 rpm

The high speed capability allows for quick data processing and efficient performance.

Low Power Mode: YES

The low power mode option conserves energy and extends battery life in power-sensitive applications.

Technical Specifications

Microprocessors MCF5208CVM166 attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Address Bus Width:

24

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

40 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B196

JESD-609 Code:

e1

Length:

15 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

196

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA196,14X14,40

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.5,1.8/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Speed:

166.67 rpm

Sub-Category:

Microprocessors

Maximum Supply Voltage:

1.6 V

Minimum Supply Voltage:

1.4 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

15 mm

Peripheral IC Type:

Trade Compliance

MCF5208CVM166 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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