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STM32MP131AAE3

STMicroelectronics

STM32MP131AAE3 by STMicroelectronics

STM32MP131AAE3 by STMicroelectronics is a 32-bit microprocessor with 172032 RAM words, 48 MHz clock frequency, and 56 DMA channels. It is ideal for low power applications in IoT devices, offering a wide operating temperature range from -40 to 125 °C. With integrated cache and boundary scan feature, it ensures efficient data processing and testing capabilities.

Median Price

$7.620

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 3,070 parts In-Stock

1+ parts

$6.159

100+ parts

$5.056

1k+ parts

$4.461

10k+ parts

-

3,070

$6.159

$5.056

$4.461

-

Mouser Electronics

USA . 529 parts In-Stock

1+ parts

$9.080

100+ parts

$6.080

1k+ parts

$4.830

10k+ parts

-

529

$9.080

$6.080

$4.830

-

Verical

USA . 3,070 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,070

-

-

-

-

Distributors (In-Stock)

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Digiode

USA . 4,882 parts In-Stock

1+ parts

$7.543

100+ parts

-

1k+ parts

-

10k+ parts

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4,882

$7.543

-

-

-

Vyrian

USA . 7,004 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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7,004

-

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-

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Anansix

USA . 471 parts In-Stock

1+ parts

-

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-

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471

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Nova Conductors

Japan . 59 parts In-Stock

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-

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59

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 305 parts In-Stock

1+ parts

$6.750

100+ parts

-

1k+ parts

-

10k+ parts

-

305

$6.750

-

-

-

Semicontronic

India . 182 parts In-Stock

1+ parts

$6.750

100+ parts

$6.581

1k+ parts

$6.548

10k+ parts

-

182

$6.750

$6.581

$6.548

-

Corphita

USA . 3,388 parts In-Stock

1+ parts

$7.146

100+ parts

-

1k+ parts

-

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3,388

$7.146

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AZTECH Wire

Italy . 391 parts In-Stock

1+ parts

$14.353

100+ parts

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391

$14.353

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Argo Parts USA

USA . 3,552 parts In-Stock

1+ parts

-

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3,552

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Continental Prestige Electronics

USA . 2,852 parts In-Stock

1+ parts

-

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2,852

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Bastille Electronics

Australia . 100 parts In-Stock

1+ parts

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100

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Overview

Unlock the power of innovation with the STM32MP131AAE3 by STMicroelectronics, a cutting-edge microprocessor designed to meet the highest standards of quality and performance. With integrated cache and low power mode, this versatile component offers seamless operation and efficiency for a wide range of applications. Whether you're designing IoT devices, industrial automation systems, or consumer electronics, this microprocessor delivers reliability and value that exceeds expectations. Trust in STMicroelectronics to bring your projects to life with the STM32MP131AAE3.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy package body material makes the product lightweight and durable, suitable for portable devices.

Integrated Cache: YES

Having integrated cache memory improves performance by reducing access time to frequently used data.

Maximum Supply Voltage: 1.38 V

Higher maximum supply voltage allows for increased processing power without risking damage to the microprocessor.

On Chip Data RAM Width: 8

Features an 8-bit data RAM width, which enhances data processing capabilities for better performance.

Address Bus Width: 26

A wider address bus width of 26 bits allows for larger memory addressing and more efficient data transfer.

Package Shape: SQUARE

The square package shape provides a more compact design, maximizing space efficiency in device integration.

Bit Size: 32

The 32-bit design enables the microprocessor to handle larger data sets and calculations, improving overall processing speed.

No. of Terminals: 289

With a greater number of terminals, the microprocessor can interface with a variety of external components and peripherals.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

This package style allows for a compact design with close terminal spacing, saving space and enabling high-density integration.

Minimum Supply Voltage: 1.21 V

Lower minimum supply voltage helps in reducing power consumption and heat generation, making the product energy-efficient.

Maximum Operating Temperature: 125 °C

High maximum operating temperature range ensures reliable performance under varying environmental conditions.

Minimum Operating Temperature: -40 °C

Wide temperature range enables the microprocessor to function in extreme cold conditions, offering flexibility in usage scenarios.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy mounting and connection on printed circuit boards, simplifying installation.

Maximum Seated Height: 1.7 mm

Low maximum seated height allows for slim device profiles and efficient heat dissipation.

RAM Words: 172032

Large RAM word capacity enables the storage of extensive data and instructions, enhancing the microprocessor's functionality.

Width: 14 mm

Compact width dimension makes the microprocessor suitable for space-constrained applications.

Boundary Scan: YES

Boundary scan support aids in testing and debugging the microprocessor during development and manufacturing processes.

External Data Bus Width: 16

An external data bus width of 16 bits allows for efficient data exchange with external devices or peripherals.

Maximum Clock Frequency: 48 MHz

High maximum clock frequency enables rapid execution of instructions, enhancing the overall processing speed of the microprocessor.

Length: 14 mm

Short length dimension contributes to a compact form factor, ideal for small-sized devices and applications.

Peripheral IC Type: MICROPROCESSOR, RISC

The microprocessor's RISC architecture enhances efficiency and performance for advanced computing tasks.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, contributing to energy efficiency and reliable operation.

Terminal Form: BALL

Having ball terminals simplifies the soldering process during installation, ensuring secure connections.

Maximum Supply Current: 239 mA

Higher maximum supply current capability supports increased processing demands for complex computing tasks.

Nominal Supply Voltage: 1.25 V

Having a stable nominal supply voltage ensures consistent performance and reliable operation of the microprocessor.

No. of DMA Channels: 56

A high number of DMA channels allow for efficient data transfer between memory and peripherals, improving overall data handling.

No. of Serial I/Os: 8

Multiple serial I/O interfaces provide versatile connectivity options for communicating with external devices or systems.

Terminal Pitch: 0.8 mm

Narrow terminal pitch spacing facilitates high-density mounting on PCBs, enhancing integration flexibility.

Format: FIXED POINT

Fixed-point format simplifies arithmetic operations and enhances computational efficiency for specific application requirements.

Speed: 650 rpm

Operating at a speed of 650 rpm ensures rapid data processing and seamless execution of tasks for diverse applications.

Low Power Mode: YES

Support for low power mode conserves energy consumption during idle or low-demand periods, promoting energy efficiency.

Technical Specifications

Microprocessors STM32MP131AAE3 attributes and parameters. Explore more Microprocessors devices from STMicroelectronics

Specs

Address Bus Width:

26

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

48 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B289

Length:

14 mm

Low Power Mode:

YES

No. of DMA Channels:

56

No. of Serial I/Os:

8

No. of Terminals:

289

On Chip Data RAM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA289,17X17,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

RAM Words:

172032

Maximum Seated Height:

1.7 mm

Speed:

650 rpm

Maximum Supply Current:

239 mA

Maximum Supply Voltage:

1.38 V

Minimum Supply Voltage:

1.21 V

Nominal Supply Voltage:

1.25 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

14 mm

Peripheral IC Type:

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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