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MCF5327CVM240

NXP Semiconductors

MCF5327CVM240 by NXP Semiconductors

The NXP Semiconductors MCF5327CVM240 is a 32-bit microprocessor with integrated cache and a max clock frequency of 80 MHz. It is commonly used in industrial applications due to its low power mode and temperature grade of INDUSTRIAL.

Median Price

$24.600

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 630 parts In-Stock

1+ parts

$24.600

100+ parts

$21.380

1k+ parts

$19.530

10k+ parts

-

630

$24.600

$21.380

$19.530

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Verical

USA . 630 parts In-Stock

1+ parts

$24.600

100+ parts

$21.380

1k+ parts

$19.530

10k+ parts

-

630

$24.600

$21.380

$19.530

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DigiKey

USA . 246 parts In-Stock

1+ parts

$39.400

100+ parts

$28.223

1k+ parts

-

10k+ parts

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246

$39.400

$28.223

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 97 parts In-Stock

1+ parts

$23.422

100+ parts

-

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97

$23.422

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Digiode

USA . 258 parts In-Stock

1+ parts

$27.379

100+ parts

-

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258

$27.379

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Vyrian

USA . 328 parts In-Stock

1+ parts

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328

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Anansix

USA . 279 parts In-Stock

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279

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Flip Electronics

USA . 265 parts In-Stock

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265

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$23.422

100+ parts

-

1k+ parts

-

10k+ parts

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1,000

$23.422

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-

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Continental Prestige Electronics

USA . 556 parts In-Stock

1+ parts

$23.422

100+ parts

-

1k+ parts

-

10k+ parts

$22.954

556

$23.422

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-

$22.954

Ampacity Inc.

Singapore . 453 parts In-Stock

1+ parts

$24.500

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-

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453

$24.500

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One Stop Electronics

USA . 387 parts In-Stock

1+ parts

$24.500

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387

$24.500

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Semicontronic

India . 143 parts In-Stock

1+ parts

$24.500

100+ parts

$23.888

1k+ parts

$23.765

10k+ parts

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143

$24.500

$23.888

$23.765

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Corphita

USA . 4,960 parts In-Stock

1+ parts

$25.938

100+ parts

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4,960

$25.938

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Vigor

Singapore . 2,500 parts In-Stock

1+ parts

$28.050

100+ parts

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2,500

$28.050

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Microchip USA

USA . 2,085 parts In-Stock

1+ parts

$51.415

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2,085

$51.415

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UNI Independent Distributors

Spain . 7,107 parts In-Stock

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7,107

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Argo Parts USA

USA . 1,050 parts In-Stock

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1,050

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iodParts Technologies Inc.

India . 150 parts In-Stock

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150

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Overview

Discover the cutting-edge MCF5327CVM240 microprocessor by NXP Semiconductors, a true game-changer in the world of technology. Designed with utmost precision and quality, this powerful device boasts an array of advantages that set it apart from the competition. Whether you're looking to enhance the performance of your industrial applications or add efficiency to your embedded systems, the MCF5327CVM240 delivers unmatched value, benefits, and advantages. With its integrated cache, high clock frequency, low power mode, and wide operating temperature range, this microprocessor ensures optimal functionality and reliability. Experience the future of innovation with NXP Semiconductors and the MCF5327CVM240.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY. This material provides durability and protects the microprocessor from external factors, making it a reliable choice for long-term usage.

Integrated Cache:

YES. The integrated cache enhances the microprocessor's performance by storing frequently accessed data closer to the CPU, resulting in faster operations and improved overall efficiency.

Surface Mount:

YES. The surface mount feature ensures easy installation and allows the microprocessor to be directly mounted on the surface of a printed circuit board, saving space and simplifying the assembly process.

Maximum Supply Voltage:

1.6 V. The high maximum supply voltage allows the microprocessor to handle demanding tasks and provides sufficient power for efficient processing, making it suitable for resource-intensive applications.

Address Bus Width:

24. The wide address bus width increases the microprocessor's memory addressing capacity, enabling it to access a large amount of data and handle complex computational tasks effectively.

Package Shape:

SQUARE. The square package shape provides a compact form factor, making it easy to integrate the microprocessor into various electronic devices, including space-constrained applications.

Bit Size:

32. The 32-bit architecture allows the microprocessor to process data in larger chunks, leading to improved performance and compatibility with a wide range of software applications.

No. of Terminals:

196. With a high number of terminals, the microprocessor offers versatile connectivity options and can interface with various external devices, enhancing its compatibility and functionality.

Package Style (Meter):

GRID ARRAY. The grid array package style ensures secure connections between the microprocessor and the circuit board, minimizing the risk of connection failures and enhancing overall reliability.

Minimum Supply Voltage:

1.4 V. The low minimum supply voltage enables the microprocessor to operate efficiently in power-constrained environments, resulting in energy-saving benefits and extended battery life.

Maximum Operating Temperature:

85 °C. The high maximum operating temperature allows the microprocessor to remain stable and perform reliably even under challenging thermal conditions, making it suitable for demanding industrial applications.

Minimum Operating Temperature:

40 °C. The microprocessor's ability to withstand low temperatures ensures consistent functionality in extreme environments, making it suitable for a wide range of applications, including automotive and aerospace.

Terminal Finish:

TIN SILVER COPPER. The terminal finish of tin, silver, and copper provides excellent conductivity and corrosion resistance, ensuring reliable electrical connections and preventing signal degradation.

Terminal Position:

BOTTOM. The microprocessor's bottom terminal position simplifies the PCB layout and allows for efficient heat dissipation, contributing to overall system cooling and stability.

Maximum Seated Height:

1.75 mm. The low maximum seated height enables the microprocessor to be integrated into thin and compact electronic devices without compromising their overall size and aesthetics.

Width:

15 mm. The microprocessor's compact width facilitates seamless integration into various electronic systems, making it suitable for miniaturized applications where space is limited.

Boundary Scan:

YES. The boundary scan feature allows for easy testing and debugging of the microprocessor's connectivity, ensuring faster and more accurate fault detection during the manufacturing and troubleshooting processes.

External Data Bus Width:

32. The wide external data bus width enables the microprocessor to handle large amounts of data transfers and support high-bandwidth communication, improving overall system performance and efficiency.

Maximum Clock Frequency:

80 MHz. The high maximum clock frequency allows the microprocessor to execute instructions at a faster rate, leading to improved processing speed and responsiveness in various applications.

Maximum Time At Peak Reflow Temperature (s):

40. The microprocessor's ability to withstand high reflow temperatures for extended periods ensures reliable soldering during the manufacturing process, resulting in robust product quality and long-lasting connections.

Peak Reflow Temperature °C:

260. The high peak reflow temperature enables efficient soldering and secure connections between the microprocessor and other components, ensuring reliable and durable operation in harsh environments.

Length:

15 mm. The microprocessor's compact length allows for easy integration and placement in various electronic systems, making it a versatile choice for applications with size constraints.

Temperature Grade:

INDUSTRIAL. The microprocessor's temperature grade indicates its ability to withstand harsh industrial environments with wide temperature ranges, ensuring consistent and reliable operation in demanding conditions.

Peripheral IC Type:

MICROPROCESSOR, RISC. The microprocessor's RISC architecture enhances its operational efficiency and execution speed, making it a suitable choice for embedded systems and applications requiring high-performance computing.

Technology:

CMOS. The CMOS (Complementary Metal-Oxide-Semiconductor) technology used in the microprocessor offers low power consumption, high integration, and improved noise immunity, making it an energy-efficient choice for various electronic devices.

Terminal Form:

BALL. The ball terminal form provides secure and reliable connections, simplifying the microprocessor's assembly process and ensuring stable performance in demanding applications.

Nominal Supply Voltage:

1.5 V. The microprocessor's nominal supply voltage ensures stable and efficient power delivery, contributing to improved overall performance and power consumption optimization.

Terminal Pitch:

1 mm. With a small terminal pitch, the microprocessor facilitates compact and densely packed circuit board designs, enabling miniaturization and space-saving solutions in electronic systems.

Format:

FIXED POINT. The fixed-point format of the microprocessor ensures accurate numerical calculations and precise data representation, making it ideal for applications that require precision and reliability.

Moisture Sensitivity Level (MSL):

3. The MSL level indicates the microprocessor's resistance to moisture absorption and sensitivity during storage and soldering processes, ensuring long-term reliability and preventing damage.

Speed:

240 rpm. The microprocessor's high speed capability allows for fast data processing and efficient execution of instructions, resulting in enhanced system performance and responsiveness.

Low Power Mode:

YES. The microprocessor's low power mode offers energy-saving benefits by reducing power consumption during idle or low-demand periods, increasing overall efficiency and extending battery life.

Technical Specifications

Microprocessors MCF5327CVM240 attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Address Bus Width:

24

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

80 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B196

JESD-609 Code:

e1

Length:

15 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

196

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Speed:

240 rpm

Maximum Supply Voltage:

1.6 V

Minimum Supply Voltage:

1.4 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

15 mm

Peripheral IC Type:

Trade Compliance

MCF5327CVM240 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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