Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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The NXP Semiconductors MCF5327CVM240 is a 32-bit microprocessor with integrated cache and a max clock frequency of 80 MHz. It is commonly used in industrial applications due to its low power mode and temperature grade of INDUSTRIAL.
Median Price
$24.600
Lifecycle Status
Suppliers In-Stock
8
In-Stock Inventory
1k+
Arrow
1+ parts
100+ parts
$21.380
1k+ parts
$19.530
10k+ parts
-
Verical
DigiKey
$39.400
$28.223
Nova Conductors
$23.422
Digiode
$27.379
Vyrian
Anansix
Flip Electronics
Netroflash
Continental Prestige Electronics
$22.954
Ampacity Inc.
$24.500
One Stop Electronics
Semicontronic
$23.888
$23.765
Corphita
$25.938
Vigor
$28.050
Microchip USA
$51.415
UNI Independent Distributors
Argo Parts USA
iodParts Technologies Inc.
PLASTIC/EPOXY. This material provides durability and protects the microprocessor from external factors, making it a reliable choice for long-term usage.
YES. The integrated cache enhances the microprocessor's performance by storing frequently accessed data closer to the CPU, resulting in faster operations and improved overall efficiency.
YES. The surface mount feature ensures easy installation and allows the microprocessor to be directly mounted on the surface of a printed circuit board, saving space and simplifying the assembly process.
1.6 V. The high maximum supply voltage allows the microprocessor to handle demanding tasks and provides sufficient power for efficient processing, making it suitable for resource-intensive applications.
24. The wide address bus width increases the microprocessor's memory addressing capacity, enabling it to access a large amount of data and handle complex computational tasks effectively.
SQUARE. The square package shape provides a compact form factor, making it easy to integrate the microprocessor into various electronic devices, including space-constrained applications.
32. The 32-bit architecture allows the microprocessor to process data in larger chunks, leading to improved performance and compatibility with a wide range of software applications.
196. With a high number of terminals, the microprocessor offers versatile connectivity options and can interface with various external devices, enhancing its compatibility and functionality.
GRID ARRAY. The grid array package style ensures secure connections between the microprocessor and the circuit board, minimizing the risk of connection failures and enhancing overall reliability.
1.4 V. The low minimum supply voltage enables the microprocessor to operate efficiently in power-constrained environments, resulting in energy-saving benefits and extended battery life.
85 °C. The high maximum operating temperature allows the microprocessor to remain stable and perform reliably even under challenging thermal conditions, making it suitable for demanding industrial applications.
40 °C. The microprocessor's ability to withstand low temperatures ensures consistent functionality in extreme environments, making it suitable for a wide range of applications, including automotive and aerospace.
TIN SILVER COPPER. The terminal finish of tin, silver, and copper provides excellent conductivity and corrosion resistance, ensuring reliable electrical connections and preventing signal degradation.
BOTTOM. The microprocessor's bottom terminal position simplifies the PCB layout and allows for efficient heat dissipation, contributing to overall system cooling and stability.
1.75 mm. The low maximum seated height enables the microprocessor to be integrated into thin and compact electronic devices without compromising their overall size and aesthetics.
15 mm. The microprocessor's compact width facilitates seamless integration into various electronic systems, making it suitable for miniaturized applications where space is limited.
YES. The boundary scan feature allows for easy testing and debugging of the microprocessor's connectivity, ensuring faster and more accurate fault detection during the manufacturing and troubleshooting processes.
32. The wide external data bus width enables the microprocessor to handle large amounts of data transfers and support high-bandwidth communication, improving overall system performance and efficiency.
80 MHz. The high maximum clock frequency allows the microprocessor to execute instructions at a faster rate, leading to improved processing speed and responsiveness in various applications.
40. The microprocessor's ability to withstand high reflow temperatures for extended periods ensures reliable soldering during the manufacturing process, resulting in robust product quality and long-lasting connections.
260. The high peak reflow temperature enables efficient soldering and secure connections between the microprocessor and other components, ensuring reliable and durable operation in harsh environments.
15 mm. The microprocessor's compact length allows for easy integration and placement in various electronic systems, making it a versatile choice for applications with size constraints.
INDUSTRIAL. The microprocessor's temperature grade indicates its ability to withstand harsh industrial environments with wide temperature ranges, ensuring consistent and reliable operation in demanding conditions.
MICROPROCESSOR, RISC. The microprocessor's RISC architecture enhances its operational efficiency and execution speed, making it a suitable choice for embedded systems and applications requiring high-performance computing.
CMOS. The CMOS (Complementary Metal-Oxide-Semiconductor) technology used in the microprocessor offers low power consumption, high integration, and improved noise immunity, making it an energy-efficient choice for various electronic devices.
BALL. The ball terminal form provides secure and reliable connections, simplifying the microprocessor's assembly process and ensuring stable performance in demanding applications.
1.5 V. The microprocessor's nominal supply voltage ensures stable and efficient power delivery, contributing to improved overall performance and power consumption optimization.
1 mm. With a small terminal pitch, the microprocessor facilitates compact and densely packed circuit board designs, enabling miniaturization and space-saving solutions in electronic systems.
FIXED POINT. The fixed-point format of the microprocessor ensures accurate numerical calculations and precise data representation, making it ideal for applications that require precision and reliability.
3. The MSL level indicates the microprocessor's resistance to moisture absorption and sensitivity during storage and soldering processes, ensuring long-term reliability and preventing damage.
240 rpm. The microprocessor's high speed capability allows for fast data processing and efficient execution of instructions, resulting in enhanced system performance and responsiveness.
YES. The microprocessor's low power mode offers energy-saving benefits by reducing power consumption during idle or low-demand periods, increasing overall efficiency and extending battery life.
Microprocessors MCF5327CVM240 attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors
Address Bus Width:
Bit Size:
Boundary Scan:
Maximum Clock Frequency:
External Data Bus Width:
Format:
Integrated Cache:
JESD-30 Code:
JESD-609 Code:
Length:
Low Power Mode:
Moisture Sensitivity Level (MSL):
No. of Terminals:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
Package Code:
Package Shape:
Package Style (Meter):
Peak Reflow Temperature (C):
Qualification:
Maximum Seated Height:
Speed:
Maximum Supply Voltage:
Minimum Supply Voltage:
Nominal Supply Voltage:
Surface Mount:
Technology:
Temperature Grade:
Terminal Finish:
Terminal Form:
Terminal Pitch:
Terminal Position:
Maximum Time At Peak Reflow Temperature (s):
Width:
Peripheral IC Type:
MCF5327CVM240 Peripheral ICs trade compliance attributes, and parameters.
ECCN
3A991.A.2
ECCN Governance
EAR
HTS
8542.31.00.01
SB
8542.31.00.00
NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.
Executive Director, President, CEO
Kurt Sievers
Executive VP, CFO
Bill Betz
Executive VP, Chief Sales Officer
Ron Martino
ICN8
Fabrication
Fab Initiation
1996
Netherlands
Nijmegen
Wafer Capacity
55,000
ATMC (Austin Tech & Mfg Center)
1995
USA
Austin
30,000
N/A
1989
Germany
Boeblingen
CHD
1993
Chandler
OHTC
1991
24,000
New Expansion Fab
2026
ECHO
2020
10,000
1N4148
Multicomp Pro
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Itt Semiconductor
AMS1117-3.3
Advanced Monolithic Systems
AMS1117-3.3 by Advanced Monolithic Systems is a fixed positive single output LDO regulator with 1A max output current, 3% voltage tolerance, and 1.3V dropout voltage. Ideal for applications requiring stable 3.3V supply in compact designs due to its small outline package and excellent load regulation of 0.025%.
ABS25-32.768KHZ-1-T
Abracon
Abracon's ABS25-32.768KHZ-1-T crystal oscillator offers 10 ppm frequency tolerance, 126% stability, and 50000 ohm series resistance. Ideal for applications requiring 0.032768 MHz nominal operating frequency, such as IoT devices and precision timing systems.
SS14
Yangzhou Yangjie Electronics
RECTIFIER DIODE; Surface Mount: YES; Technology: SCHOTTKY; No. of Phases: 1; Config: SINGLE; Maximum Operating Temperature: 125 Cel;
2N2222A
Microchip Technology
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Collector Current (IC): .8 A; Minimum Operating Temperature: -65 Cel; Terminal Position: BOTTOM;
BSS138
Infineon Technologies
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Maximum Drain Current (Abs) (ID): .2 A; Maximum Feedback Capacitance (Crss): 8 pF;
IRLML6401TRPBF
IRLML6401TRPBF by Infineon is a P-CHANNEL FET for SWITCHING applications. It features a 12V DS Breakdown Voltage, 34A IDM, and 0.05ohm RDS(on). With a small outline package style, it operates in an ambient temperature range of -55 to 150 °C.
Fairchild Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Operating Mode: ENHANCEMENT MODE; Qualification: Not Qualified;
DS18B20U+
Analog Devices
DS18B20U+ by Analog Devices is a 12-bit temperature sensor with 1-Wire interface. It operates b/w -55 to 125°C, offering ±0.5°C accuracy. Suitable for applications requiring digital output and surface mounting feature.
87832-1420
Molex
87832-1420 by Molex is a 14-contact board connector with 0.079" pitch, suitable for commercial applications. It features matte tin over nickel finish, glass-filled polyamide insulator, and polarization key for easy assembly. Withstanding voltage of 1400VAC and operating temperature range from -55 to 105°C make it reliable for various electronic devices.
MBRS3200T3G
Onsemi
MBRS3200T3G by Onsemi is a Schottky rectifier diode with a max output current of 3A and a max forward voltage of 0.59V. It operates in temperatures ranging from -65°C to 175°C, making it suitable for power applications. The diode has a peak repetitive reverse voltage of 200V and is designed for surface mount installation in electronic circuits.
EU2B-YS3203C
Idec
ROTARY SWITCH;
Crystalonics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
International Rectifier
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.3 W; Minimum Operating Temperature: -55 Cel; Avalanche Energy Rating (EAS): 33 mJ;
SMBJ18CA
Good-ark Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Maximum Repetitive Peak Reverse Voltage: 18 V; Nominal Breakdown Voltage: 21.05 V; Maximum Time At Peak Reflow Temperature (s): 10; JESD-609 Code: e3;
LL4148
Rugao Dachang Electronic
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
BAV99LT1G
BAV99LT1G by Onsemi is a series connected diode with 2 elements in a small outline package. It has a max reverse recovery time of 0.006 us and can handle up to 100V repetitive peak reverse voltage. Ideal for rectification applications, this diode operates b/w -65°C to 150°C temperature range.
LM555CM
Renesas Electronics
Analog Waveform Generation Functions; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
LM358N
STMicroelectronics
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
MPC8270ZQMIBA
NXP Semiconductors
The NXP Semiconductors MPC8270ZQMIBA is a 32-bit microprocessor with integrated cache and 64-bit external data bus width. It operates at a max clock frequency of 266 MHz, making it suitable for high-speed computing applications. With a package style of grid array and terminal finish of tin lead silver, this processor is ideal for commercial-grade systems requiring efficient processing power in a compact form factor.
CM8070104282327
Intel
MICROPROCESSOR;
MCF5475ZP266
Motorola
MICROPROCESSOR, RISC; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 388; Package Code: BGA; Package Shape: SQUARE;
MIMXRT1061DVL6B
MICROCONTROLLER, RISC; Maximum Time At Peak Reflow Temperature (s): 40; Terminal Finish: TIN SILVER COPPER; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e1; Peak Reflow Temperature (C): 260;
MCIMX31CVMN4C
The NXP Semiconductors MCIMX31CVMN4C microprocessor operates at 1.5V and 3.3V, with TIN SILVER COPPER terminal finish. It is a RISC-based MICROPROCESSOR compatible with I2C, SPI, UART, and USB buses. With 9 I/O lines, it finds applications in various embedded systems requiring high processing power and connectivity options.
SB80C188-12
Rochester Electronics
SB80C188-12 by Rochester Electronics is a 16-bit microprocessor with 20-bit address bus, clocking at 25 MHz. It operates b/w 0-70°C and supports low power mode. Widely used in commercial applications for its CMOS technology and thin profile flatpack package style.
XPC8240LZU200E
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 352; Package Code: LBGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;
MIMXRT1061DVJ6B
MICROCONTROLLER, RISC; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 40; Terminal Finish: TIN SILVER; JESD-609 Code: e2;
DM3730CBPD100
Texas Instruments
Texas Instruments DM3730CBPD100 microprocessor features 32-bit architecture, 1.2V supply voltage, and 54MHz clock frequency. Ideal for industrial applications requiring high-speed processing with low power consumption.
AV8063801149402SR0T6
Intel AV8063801149402SR0T6 is a 64-bit microprocessor with 1023 terminals in a grid array package. It features integrated cache, CMOS technology, and operates at 2800 rpm. Ideal for high-performance computing applications requiring fixed-point processing capabilities.
MIMXRT1052DVL6BR
MICROPROCESSOR, RISC; Maximum Time At Peak Reflow Temperature (s): 40; Terminal Finish: TIN SILVER COPPER; Peak Reflow Temperature (C): 260; JESD-609 Code: e1; Moisture Sensitivity Level (MSL): 3;
P4080NSE7PNC
The NXP Semiconductors P4080NSE7PNC microprocessor features integrated cache, 32-bit address bus width, and 16-bit external data bus width. It is ideal for applications requiring high processing speeds and low power consumption, such as networking equipment and industrial automation systems.
MCF5282CVF80
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;
MCF5272CVM66
The NXP Semiconductors MCF5272CVM66 microprocessor features a 32-bit architecture with integrated cache and operates at a max clock frequency of 66 MHz. It is designed for industrial applications requiring low power consumption, with a temperature range from -40 to 85°C. The package style is grid array, making it suitable for surface mount assembly in various electronic devices.
ATSAMA5D35A-CU
Atmel
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 324; Package Code: LFBGA; Package Shape: SQUARE;
MIMXRT555SFFOCR
MICROPROCESSOR, RISC; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3;
ATSAMA5D44B-CU
ATSAMA5D44B-CU by Microchip Technology is a 32-bit microprocessor with 131072 RAM words, 50 MHz clock frequency, and 32 DMA channels. Ideal for industrial applications, it features low power mode, floating point format, and RISC technology for efficient processing.
T1042NXN7PQB
T1042NXN7PQB by NXP Semiconductors is a 32-bit microprocessor with integrated cache and a max clock frequency of 133.3 MHz. It is commonly used in applications requiring high-speed processing, such as networking and telecommunications.
MCF54453VP266
MICROPROCESSOR; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 40;
MPC8309CVMAGDCA
Freescale Semiconductor
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 489; Package Code: LFBGA; Package Shape: SQUARE;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
MCF5282CVM66
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 256; Package Code: LFBGA; Package Shape: SQUARE;
MCF5282CVM80
MCF5329CVM240
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;
The NXP Semiconductors MCF5329CVM240 microprocessor features a 32-bit architecture, 80 MHz clock frequency, and integrated cache. Ideal for industrial applications requiring low power consumption and high-speed processing capabilities. With a temperature range of -40 to 85°C, it is suitable for various embedded systems.
MCF5372LCVM240
NXP Semiconductors' MCF5372LCVM240 microprocessor features 32-bit architecture, 80 MHz clock frequency, and integrated cache. Ideal for industrial applications requiring low power mode, with a temperature range of -40 to 85°C. Package style is grid array with 196 terminals in a square shape.
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 196; Package Code: BGA; Package Shape: SQUARE;
MCF5251VM140
The NXP Semiconductors MCF5251VM140 microprocessor features a 32-bit architecture, 24-bit address bus width, and integrated cache. It is suitable for applications requiring a max clock frequency of 140 MHz, such as embedded systems and industrial automation. With a low profile grid array package style and ball terminal form, it offers reliable performance in commercial-grade environments.
MICROPROCESSOR; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 225; Package Code: LFBGA; Package Shape: SQUARE;
MCF5372LCVM240J
MCF5372LCVM240J by Freescale is a 32-bit microprocessor with power supplies of 1.5V and 3.3V, suitable for industrial applications. It features a package style of grid array, operates b/w -40 to 85°C, and has a speed of 240 rpm. This surface-mount device with 196 terminals is ideal for RISC-based systems requiring high performance in harsh environments.
MCF54415CMJ250
MICROPROCESSOR; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;
NXP Semiconductors' MCF54415CMJ250 microprocessor features 32-bit architecture, integrated cache, and operates at a max clock frequency of 100 MHz. Ideal for industrial applications requiring low power consumption, it supports multiple power supplies and has a temperature range from -40 to 85°C.
MCF5329CVM240J
MCF5329CVM240J by Freescale Semiconductor is a 32-bit microprocessor with power supplies of 1.5V, 1.8/3.3V and a speed of 240rpm. It features a grid array package style with 256 terminals in a square shape, suitable for industrial applications requiring high processing capabilities and reliability at temperatures ranging from -40 to 85°C.
MCF5251CVM140R2
NXP Semiconductors' MCF5251CVM140R2 microprocessor features 32-bit architecture, 140 MHz clock frequency, and 24-bit address bus width. Ideal for industrial applications requiring high-speed processing with a max supply voltage of 1.32 V and operating temperature range from -40 to 85 °C.
MICROPROCESSOR; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 225; Package Code: LFBGA; Package Shape: SQUARE;
MCF5251CVM140
NXP Semiconductors' MCF5251CVM140 microprocessor features 32-bit architecture, 140 MHz clock frequency, and 24-bit address bus width. Ideal for industrial applications requiring high-speed processing in a compact square package with ball terminals.
MCF54418CMJ250
The NXP Semiconductors MCF54418CMJ250 microprocessor features a 32-bit architecture, integrated cache, and operates at a max clock frequency of 100 MHz. Ideal for industrial applications requiring low power consumption, it supports multiple power supplies (1.2V, 1.8V, 3.3V) and has a temperature range of -40 to 85°C.
MCF5485CVR200
The NXP Semiconductors MCF5485CVR200 is a 32-bit microprocessor with integrated cache, operating at a max frequency of 66.67 MHz. It features low power mode and boundary scan capabilities, making it ideal for industrial applications requiring high-speed processing in a compact square package.
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