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T4081NXN7PQB

NXP Semiconductors

T4081NXN7PQB by NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: HBGA; Package Shape: SQUARE; Integrated Cache: YES;

Median Price

$766.519

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 60 parts In-Stock

1+ parts

$681.350

100+ parts

$640.470

1k+ parts

$599.590

10k+ parts

-

60

$681.350

$640.470

$599.590

-

Verical

USA . 60 parts In-Stock

1+ parts

$851.688

100+ parts

$800.587

1k+ parts

$749.487

10k+ parts

-

60

$851.688

$800.587

$749.487

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,524 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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7,524

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Anansix

USA . 1,428 parts In-Stock

1+ parts

-

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1,428

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-

-

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Digiode

USA . 1,398 parts In-Stock

1+ parts

-

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1,398

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Cyclops Electronics Ltd

UK . 151 parts In-Stock

1+ parts

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151

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Flip Electronics

USA . 8 parts In-Stock

1+ parts

-

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8

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 1,170 parts In-Stock

1+ parts

$11.410

100+ parts

-

1k+ parts

-

10k+ parts

-

1,170

$11.410

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-

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Advanced Electronics

New Zealand . 19 parts In-Stock

1+ parts

$16.036

100+ parts

$14.593

1k+ parts

$13.150

10k+ parts

-

19

$16.036

$14.593

$13.150

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One Stop Electronics

USA . 1,384 parts In-Stock

1+ parts

$35.000

100+ parts

-

1k+ parts

-

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1,384

$35.000

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Microchip USA

USA . 1,592 parts In-Stock

1+ parts

$767.555

100+ parts

-

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1,592

$767.555

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Component Stockers USA

USA . 3 parts In-Stock

1+ parts

$8,828.740

100+ parts

-

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3

$8,828.740

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UNI Independent Distributors

Spain . 7,682 parts In-Stock

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-

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7,682

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Corphita

USA . 2,423 parts In-Stock

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2,423

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Technical Specifications

Microprocessors T4081NXN7PQB attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Address Bus Width:

16

Boundary Scan:

YES

Maximum Clock Frequency:

133.3 MHz

External Data Bus Width:

64

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B1932

JESD-609 Code:

e1

Length:

45 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG

Peak Reflow Temperature (C):

250

Maximum Seated Height:

3.33 mm

Speed:

1500 rpm

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

45 mm

Peripheral IC Type:

Trade Compliance

T4081NXN7PQB Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.1

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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