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XAM3517AZCN

Texas Instruments

XAM3517AZCN by Texas Instruments

XAM3517AZCN by Texas Instruments is a Microprocessor with 32-bit External Data Bus, 15-bit Address Bus, and integrated cache. It operates at a max clock frequency of 59 MHz and supports low power mode. Ideal for applications requiring high-speed processing in compact devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Vyrian

USA . 8,316 parts In-Stock

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Digiode

USA . 810 parts In-Stock

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810

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Nova Conductors

Japan . 18 parts In-Stock

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LWI Electronics Inc

India . 2 parts In-Stock

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Ampacity Inc.

Singapore . 185 parts In-Stock

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$1.000

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$1.000

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Semicontronic

India . 1,254 parts In-Stock

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$4.000

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$3.900

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$3.880

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$3.880

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One Stop Electronics

USA . 352 parts In-Stock

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$6.000

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AZTECH Wire

Italy . 388 parts In-Stock

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$17.666

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388

$17.666

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Parana Technologies

USA . 973 parts In-Stock

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$37.380

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973

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DigiPath Technology Company

USA . 277 parts In-Stock

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$41.160

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$37.867

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$41.160

$37.867

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ChromeModa Solutions

Germany . 2,387 parts In-Stock

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$42.000

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$34.440

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$42.000

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IDEA Electronic Components Group

UK . 1,201 parts In-Stock

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$42.000

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$39.900

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$37.800

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Advanced Electronics

New Zealand . 47 parts In-Stock

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$59.463

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$56.490

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47

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Corohmni

South Africa . 46 parts In-Stock

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$68.417

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Continental Prestige Electronics

USA . 1,705 parts In-Stock

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Corphita

USA . 944 parts In-Stock

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Argo Parts USA

USA . 750 parts In-Stock

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750

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Bastille Electronics

Australia . 120 parts In-Stock

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120

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Overview

Elevate your projects with the XAM3517AZCN by Texas Instruments, a top-of-the-line microprocessor designed for maximum performance and efficiency. Crafted by the trusted manufacturer, Texas Instruments, this processor boasts integrated cache, surface mount capability, and a wide address bus width of 15. Perfect for a variety of applications, this powerful processor offers unparalleled value, benefits, and advantages to customers looking to elevate their designs to the next level. Trust in Texas Instruments for quality you can rely on.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the microprocessor easy to handle and resistant to damage.

Integrated Cache: YES

The integrated cache allows for faster data access, improving overall performance of the microprocessor.

Maximum Supply Voltage: 1.248 V

Operating within this voltage range ensures stable and efficient performance of the microprocessor.

Address Bus Width: 15

A wider address bus allows for greater memory addressing capabilities, enhancing the overall processing power of the microprocessor.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

This package style provides a compact and efficient design, saving space and improving thermal performance.

Maximum Clock Frequency: 59 MHz

With a high maximum clock frequency, this microprocessor can handle demanding tasks and deliver quick responses.

Peripheral IC Type: MICROPROCESSOR, RISC

Using RISC (Reduced Instruction Set Computing) architecture, this microprocessor can execute instructions efficiently, resulting in faster performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this microprocessor energy efficient and reliable.

Speed: 600 rpm

With a speed of 600 rpm, this microprocessor can handle tasks quickly and efficiently, making it suitable for a wide range of applications.

Low Power Mode: YES

The low power mode option allows the microprocessor to conserve energy when not running at full capacity, reducing overall power consumption.

Technical Specifications

Microprocessors XAM3517AZCN attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

15

Boundary Scan:

YES

Maximum Clock Frequency:

59 MHz

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B491

Length:

17 mm

Low Power Mode:

YES

No. of Terminals:

491

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Maximum Seated Height:

1.3 mm

Speed:

600 rpm

Maximum Supply Voltage:

1.248 V

Minimum Supply Voltage:

1.152 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Width:

17 mm

Peripheral IC Type:

Trade Compliance

XAM3517AZCN Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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