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XAM3359ZCZ60

Texas Instruments

XAM3359ZCZ60 by Texas Instruments

XAM3359ZCZ60 by Texas Instruments is a 32-bit microprocessor with integrated cache, operating at a max clock frequency of 26 MHz. It features low power mode and boundary scan capabilities, making it ideal for applications requiring high-speed processing in compact devices. The package style is grid array with a terminal pitch of 0.8 mm, suitable for various embedded systems where space efficiency is crucial.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,952 parts In-Stock

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Digiode

USA . 1,018 parts In-Stock

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1,018

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 501 parts In-Stock

1+ parts

$10.614

100+ parts

-

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501

$10.614

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One Stop Electronics

USA . 531 parts In-Stock

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$20.000

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531

$20.000

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Parana Technologies

USA . 2,126 parts In-Stock

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$28.763

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$51.519

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2,126

$28.763

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$51.519

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DigiPath Technology Company

USA . 526 parts In-Stock

1+ parts

$31.672

100+ parts

$29.138

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526

$31.672

$29.138

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ChromeModa Solutions

Germany . 6,997 parts In-Stock

1+ parts

$32.318

100+ parts

$26.501

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6,997

$32.318

$26.501

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IDEA Electronic Components Group

UK . 138 parts In-Stock

1+ parts

$32.318

100+ parts

$30.702

1k+ parts

$29.086

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138

$32.318

$30.702

$29.086

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Corphita

USA . 3,917 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the XAM3359ZCZ60 by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-quality microprocessors that are perfect for a wide range of applications. From consumer electronics to industrial automation, this product offers unmatched performance and reliability. Experience seamless operation, low power consumption, and exceptional speed with the XAM3359ZCZ60. Elevate your projects to the next level with this state-of-the-art microprocessor from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection to the microprocessor, ensuring long-term reliability.

Integrated Cache: YES

Integrated cache helps in improving the processing speed by storing frequently accessed data closer to the processor, reducing latency.

Maximum Supply Voltage: 1.15 V

Higher maximum supply voltage allows for efficient performance without risking damage to the microprocessor.

Package Shape: SQUARE

Square package shape allows for efficient use of space and easy integration into various devices.

No. of Terminals: 324

Having a higher number of terminals enables the microprocessor to connect with more external components, expanding its capabilities.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microprocessor energy-efficient and reliable.

Maximum Clock Frequency: 26 MHz

High maximum clock frequency ensures fast processing speeds, making the microprocessor suitable for demanding applications.

Technical Specifications

Microprocessors XAM3359ZCZ60 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

26 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B324

JESD-609 Code:

e1

Length:

15 mm

Low Power Mode:

YES

No. of Terminals:

324

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Maximum Seated Height:

1.4 mm

Speed:

600 rpm

Maximum Supply Voltage:

1.15 V

Minimum Supply Voltage:

1.06 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

15 mm

Peripheral IC Type:

Trade Compliance

XAM3359ZCZ60 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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