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XAM3359ZCZA27

Texas Instruments

XAM3359ZCZA27 by Texas Instruments

XAM3359ZCZA27 by Texas Instruments is a 32-bit microprocessor with integrated cache and low power mode. It operates at a max clock frequency of 26 MHz, suitable for industrial applications requiring high-speed processing in a compact form factor. With boundary scan support and CMOS technology, it offers reliable performance in various embedded systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,029 parts In-Stock

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7,029

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Digiode

USA . 4,128 parts In-Stock

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4,128

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 249 parts In-Stock

1+ parts

$5.000

100+ parts

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249

$5.000

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AZTECH Wire

Italy . 457 parts In-Stock

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$17.666

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457

$17.666

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Parana Technologies

USA . 254 parts In-Stock

1+ parts

$68.643

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254

$68.643

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DigiPath Technology Company

USA . 2,140 parts In-Stock

1+ parts

$75.584

100+ parts

$69.538

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2,140

$75.584

$69.538

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ChromeModa Solutions

Germany . 1,032 parts In-Stock

1+ parts

$77.127

100+ parts

$63.244

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1,032

$77.127

$63.244

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IDEA Electronic Components Group

UK . 727 parts In-Stock

1+ parts

$77.127

100+ parts

$73.271

1k+ parts

$69.414

10k+ parts

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727

$77.127

$73.271

$69.414

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Corphita

USA . 4,407 parts In-Stock

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Overview

Unlock the full potential of your electronic devices with the XAM3359ZCZA27 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments guarantees top-notch quality and reliability. This microprocessor is perfect for a wide range of applications, providing seamless performance and efficiency. With integrated cache and low power mode, this product offers unparalleled value and benefits to customers looking for exceptional speed and functionality in their devices. Upgrade your technology with the XAM3359ZCZA27 and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the microprocessor easy to handle and long-lasting.

Integrated Cache: YES

Having integrated cache means faster access to commonly used data, improving overall performance.

Surface Mount: YES

Surface mount technology allows for easier and more compact installation on circuit boards.

Maximum Supply Voltage: 1.15 V

This voltage limit ensures safe and efficient operation without risking damage to the microprocessor.

Package Shape: SQUARE

The square shape is space-efficient and makes it easier to align the microprocessor on the circuit board.

Bit Size: 32

A 32-bit architecture allows for handling larger chunks of data at once, improving performance for a variety of applications.

No. of Terminals: 324

Having a high number of terminals allows for more connectivity options and flexibility in designing circuits.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

This package style offers high density and reliability, making it suitable for advanced circuit designs.

Minimum Supply Voltage: 1.06 V

Even at lower voltages, this microprocessor can operate efficiently, reducing power consumption and heat generation.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature, this microprocessor can withstand demanding usage conditions without overheating.

Minimum Operating Temperature: -40 °C

The ability to operate at low temperatures makes this microprocessor suitable for a wide range of environments.

Terminal Finish: TIN SILVER COPPER

This terminal finish offers good conductivity and corrosion resistance, ensuring reliable connections over time.

Terminal Position: BOTTOM

Bottom terminal position facilitates easier installation and maintenance of the microprocessor in a circuit.

Maximum Seated Height: 1.4 mm

A low seated height allows for a more compact overall design of the circuit board, saving space.

Width: 15 mm

The compact width of this microprocessor makes it suitable for use in smaller devices and applications.

Boundary Scan: YES

Boundary scan capability aids in testing and debugging the microprocessor during development and maintenance.

Maximum Clock Frequency: 26 MHz

With a high clock frequency, this microprocessor can execute instructions quickly and handle demanding tasks efficiently.

Length: 15 mm

The compact length of this microprocessor contributes to a space-efficient design of the circuit board.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable operation in harsh environmental conditions.

Peripheral IC Type: MICROPROCESSOR, RISC

This microprocessor is designed for specific applications and optimized for reduced instruction set computing (RISC) architectures.

Technology: CMOS

CMOS technology offers low power consumption and high-speed performance, making this microprocessor energy-efficient.

Terminal Form: BALL

Ball terminals provide a reliable and secure connection to the circuit board for stable operation.

Nominal Supply Voltage: 1.1 V

With a nominal supply voltage, this microprocessor operates efficiently without drawing excessive power.

Terminal Pitch: 0.8 mm

A fine terminal pitch allows for high-density integration on the circuit board, enabling complex designs.

Format: FIXED POINT

Fixed-point format simplifies arithmetic operations and improves accuracy in calculations for various applications.

Speed: 275 rpm

A high speed rating enables fast data processing and responsive performance in real-time applications.

Low Power Mode: YES

The low power mode option helps in conserving energy and prolonging battery life in portable devices.

Technical Specifications

Microprocessors XAM3359ZCZA27 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

26 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B324

JESD-609 Code:

e1

Length:

15 mm

Low Power Mode:

YES

No. of Terminals:

324

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Maximum Seated Height:

1.4 mm

Speed:

275 rpm

Maximum Supply Voltage:

1.15 V

Minimum Supply Voltage:

1.06 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

15 mm

Peripheral IC Type:

Trade Compliance

XAM3359ZCZA27 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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