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XAM3358ZCED60

Texas Instruments

XAM3358ZCED60 by Texas Instruments

XAM3358ZCED60 by Texas Instruments is a 32-bit microprocessor with integrated cache and low power mode. It operates at a max clock frequency of 26 MHz, suitable for industrial applications requiring high-speed processing in a compact form factor. With boundary scan support and CMOS technology, it offers reliable performance in various embedded systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,939 parts In-Stock

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3,939

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Vyrian

USA . 3,482 parts In-Stock

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3,482

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Distributors (Availability)

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AZTECH Wire

Italy . 470 parts In-Stock

1+ parts

$16.264

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470

$16.264

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One Stop Electronics

USA . 1,096 parts In-Stock

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$33.000

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$33.000

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Parana Technologies

USA . 1,099 parts In-Stock

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$54.100

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1,099

$54.100

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IDEA Electronic Components Group

UK . 2,240 parts In-Stock

1+ parts

$60.786

100+ parts

$57.747

1k+ parts

$54.707

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-

2,240

$60.786

$57.747

$54.707

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ChromeModa Solutions

Germany . 1,666 parts In-Stock

1+ parts

$60.786

100+ parts

$49.845

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1,666

$60.786

$49.845

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Corphita

USA . 4,024 parts In-Stock

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4,024

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DigiPath Technology Company

USA . 473 parts In-Stock

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$54.805

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473

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$54.805

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Overview

Elevate your electronic designs with the XAM3358ZCED60 from Texas Instruments. As a leading manufacturer of high-quality microprocessors, Texas Instruments delivers superior performance and reliability in every product. Ideal for a wide range of applications, this microprocessor offers unparalleled value to customers looking for cutting-edge technology. Experience the benefits of integrated cache, low power mode, and boundary scan capabilities, all in a compact and efficient package. Trust Texas Instruments to provide innovative solutions that drive your projects forward.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and cost-effective, making the product reliable and affordable.

Integrated Cache: YES

Having integrated cache helps improve processing speed and efficiency.

Maximum Supply Voltage: 1.15 V

Allows for higher performance capabilities without risking damage from excessive voltage.

Package Shape: SQUARE

Square package shape allows for efficient use of space and easy integration into circuit designs.

No. of Terminals: 298

Having a high number of terminals allows for greater connectivity and functionality.

Maximum Operating Temperature: 90 °C

Can operate effectively in high temperature environments without overheating.

Minimum Operating Temperature: -40 °C

Can operate in very low temperature conditions without compromising performance.

Peripheral IC Type: MICROPROCESSOR, RISC

RISC architecture allows for efficient and streamlined processing, enhancing overall performance.

Technology: CMOS

CMOS technology provides low power consumption and high speed operation.

Format: FIXED POINT

Fixed point format simplifies programming and calculations for the user.

Technical Specifications

Microprocessors XAM3358ZCED60 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

26 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B298

JESD-609 Code:

e1

Length:

13 mm

Low Power Mode:

YES

No. of Terminals:

298

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Maximum Seated Height:

1.3 mm

Speed:

600 rpm

Maximum Supply Voltage:

1.15 V

Minimum Supply Voltage:

1.06 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Width:

13 mm

Peripheral IC Type:

Trade Compliance

XAM3358ZCED60 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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