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XAM3358ZCE60

Texas Instruments

XAM3358ZCE60 by Texas Instruments

XAM3358ZCE60 by Texas Instruments is a 32-bit microprocessor with integrated cache and low power mode. It operates at a max clock frequency of 26 MHz, suitable for applications requiring high-speed processing in compact devices. With a package style of grid array and terminal pitch of 0.65 mm, it is ideal for space-constrained designs in consumer electronics and IoT devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,961 parts In-Stock

1+ parts

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4,961

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Digiode

USA . 2,500 parts In-Stock

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2,500

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 698 parts In-Stock

1+ parts

$6.000

100+ parts

-

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698

$6.000

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AZTECH Wire

Italy . 686 parts In-Stock

1+ parts

$11.588

100+ parts

-

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686

$11.588

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Parana Technologies

USA . 231 parts In-Stock

1+ parts

$31.219

100+ parts

$2,899.114

1k+ parts

$28.097

10k+ parts

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231

$31.219

$2,899.114

$28.097

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DigiPath Technology Company

USA . 1,147 parts In-Stock

1+ parts

$34.375

100+ parts

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1,147

$34.375

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ChromeModa Solutions

Germany . 3,084 parts In-Stock

1+ parts

$35.077

100+ parts

$28.763

1k+ parts

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10k+ parts

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3,084

$35.077

$28.763

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IDEA Electronic Components Group

UK . 1,397 parts In-Stock

1+ parts

$35.077

100+ parts

$33.323

1k+ parts

$31.569

10k+ parts

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1,397

$35.077

$33.323

$31.569

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Corphita

USA . 3,791 parts In-Stock

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3,791

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Overview

Unlock unparalleled performance and innovation with the XAM3358ZCE60 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers cutting-edge microprocessors that redefine possibilities. Ideal for a wide range of applications, this product offers customers unmatched value, benefits, and advantages. Experience seamless integration, enhanced speed, and low power consumption with the XAM3358ZCE60. Elevate your projects to new heights with this game-changing technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and cost-effective, making the microprocessor easy to handle and affordable.

Integrated Cache: YES

Having integrated cache improves the efficiency and speed of the microprocessor by reducing the need to access external memory frequently.

Maximum Supply Voltage: 1.15 V

This voltage level ensures the microprocessor operates within safe limits and prevents overheating or damage.

Package Shape: SQUARE

The square shape of the package allows for efficient use of space and easy placement on circuit boards.

Bit Size: 32

A 32-bit architecture allows for faster processing and handling of data, making the microprocessor suitable for a wide range of applications.

No. of Terminals: 298

Having a high number of terminals provides flexibility in connecting the microprocessor to other components in a system.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

This package style ensures efficient heat dissipation, low profile for space-saving designs, and fine pitch for compact layout.

Minimum Supply Voltage: 1.06 V

The low minimum supply voltage allows for energy-efficient operation and extended battery life in portable devices.

Maximum Operating Temperature: 90 °C

With a high maximum operating temperature, this microprocessor can handle demanding tasks without overheating or performance degradation.

Minimum Operating Temperature: 0 °C

The ability to operate at low temperatures makes this microprocessor suitable for use in various environments including industrial and automotive applications.

Terminal Finish: TIN SILVER COPPER

This finish provides good conductivity, corrosion resistance, and solderability, ensuring reliable connections and long-lasting performance.

Terminal Position: BOTTOM

Bottom terminal position allows for easy and secure mounting of the microprocessor on the circuit board.

Maximum Seated Height: 1.3 mm

The low seated height enables the microprocessor to be used in slim and compact devices with limited space.

Width: 13 mm

The compact width of the microprocessor allows for efficient layout and placement in tight spaces on a circuit board.

Boundary Scan: YES

Having boundary scan capability allows for efficient testing and debugging of the microprocessor during production and maintenance.

Maximum Clock Frequency: 26 MHz

With a high clock frequency, this microprocessor can perform tasks quickly and handle high-speed data processing efficiently.

Length: 13 mm

The short length of the microprocessor enables it to be used in compact devices while maintaining a high level of performance.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a RISC (Reduced Instruction Set Computing) microprocessor allows for efficient execution of instructions, resulting in faster operation and reduced power consumption.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with various digital systems, making this microprocessor energy-efficient and versatile.

Terminal Form: BALL

Ball terminal form provides good connectivity and easy soldering, ensuring reliable connections and simplified assembly.

Nominal Supply Voltage: 1.1 V

Having a stable nominal supply voltage ensures consistent and reliable performance of the microprocessor under varying operating conditions.

Terminal Pitch: 0.65 mm

A small terminal pitch allows for high-density packaging, enabling more components to be integrated into a limited space.

Format: FIXED POINT

Having a fixed-point format simplifies arithmetic operations and enhances computational efficiency in applications where floating-point precision is not required.

Speed: 600 rpm

With a high speed rating, this microprocessor can deliver fast data processing and response times, making it suitable for applications requiring quick computations.

Low Power Mode: YES

The low power mode feature allows the microprocessor to conserve energy and extend battery life in portable devices when operating at reduced performance levels.

Technical Specifications

Microprocessors XAM3358ZCE60 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

26 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B298

JESD-609 Code:

e1

Length:

13 mm

Low Power Mode:

YES

No. of Terminals:

298

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Maximum Seated Height:

1.3 mm

Speed:

600 rpm

Maximum Supply Voltage:

1.15 V

Minimum Supply Voltage:

1.06 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Width:

13 mm

Peripheral IC Type:

Trade Compliance

XAM3358ZCE60 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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