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XAM3358ZCE50

Texas Instruments

XAM3358ZCE50 by Texas Instruments

XAM3358ZCE50 by Texas Instruments is a 32-bit microprocessor with integrated cache and operates at a max clock frequency of 26 MHz. It features low power mode, boundary scan, and CMOS technology. Ideal for applications requiring high-speed processing in compact devices like IoT sensors and embedded systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,503 parts In-Stock

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Digiode

USA . 2,027 parts In-Stock

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2,027

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Distributors (Availability)

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AZTECH Wire

Italy . 616 parts In-Stock

1+ parts

$6.718

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616

$6.718

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One Stop Electronics

USA . 993 parts In-Stock

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$13.000

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993

$13.000

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Parana Technologies

USA . 10 parts In-Stock

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$30.895

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$69.477

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10

$30.895

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$69.477

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DigiPath Technology Company

USA . 1,463 parts In-Stock

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$34.019

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1,463

$34.019

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ChromeModa Solutions

Germany . 1,751 parts In-Stock

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$34.713

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$28.465

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1,751

$34.713

$28.465

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IDEA Electronic Components Group

UK . 986 parts In-Stock

1+ parts

$34.713

100+ parts

$32.977

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$31.242

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986

$34.713

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$31.242

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Corphita

USA . 1,595 parts In-Stock

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Overview

Experience the unparalleled performance and reliability of the XAM3358ZCE50 by Texas Instruments, a leading name in microprocessors. Ideal for a wide range of applications, this high-quality product offers customers exceptional value with its integrated cache, low power mode, and maximum clock frequency of 26 MHz. Trust in Texas Instruments to deliver cutting-edge technology and innovative solutions that meet your needs. Elevate your projects with the XAM3358ZCE50 and unlock endless possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material is lightweight and durable, making the product easy to handle and ensuring longevity.

Integrated Cache: YES

Having integrated cache improves data access speeds and overall performance of the microprocessor.

Surface Mount: YES

Surface mount technology allows for easy installation and replacement of the microprocessor on circuit boards.

Maximum Supply Voltage: 1.15 V

Operating at a maximum supply voltage of 1.15V ensures efficient power usage and prevents overheating of the product.

Package Shape: SQUARE

Square package shape provides stable and secure mounting on the circuit board.

Bit Size: 32

Having a 32-bit architecture enables the microprocessor to handle larger amounts of data and perform complex calculations.

No. of Terminals: 298

Having 298 terminals allows for reliable connectivity with other components in the system, enhancing overall performance.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Grid array, low profile, and fine pitch package style ensures efficient heat dissipation and compact design.

Minimum Supply Voltage: 1.06 V

Operating at a minimum supply voltage of 1.06V optimizes power efficiency and extends the product's lifespan.

Maximum Operating Temperature: 90 °C

Being able to operate at a maximum temperature of 90°C ensures reliability in various environmental conditions.

Minimum Operating Temperature: 0 °C

The ability to operate at a minimum temperature of 0°C allows for usage in a wide range of environments.

Terminal Finish: TIN SILVER COPPER

Having a terminal finish of tin silver copper provides corrosion resistance and ensures reliable electrical connections.

Terminal Position: BOTTOM

Bottom terminal position makes it easier to mount and connect the microprocessor on the circuit board.

Maximum Seated Height: 1.3 mm

Having a maximum seated height of 1.3mm allows for slim and compact device design.

Width: 13 mm

With a width of 13mm, the microprocessor can fit into compact electronic devices.

Boundary Scan: YES

Boundary scan feature allows for easier testing and debugging of the microprocessor during development and production.

Maximum Clock Frequency: 26 MHz

A maximum clock frequency of 26 MHz ensures fast data processing and high-speed operation of the microprocessor.

Length: 13 mm

Having a length of 13mm ensures compatibility with various circuit board layouts and designs.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a RISC microprocessor enables efficient and faster execution of instructions, making it suitable for high-performance applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microprocessor energy-efficient and reliable.

Terminal Form: BALL

Having a ball terminal form allows for easy and secure soldering of the microprocessor on the circuit board.

Nominal Supply Voltage: 1.1 V

Operating at a nominal supply voltage of 1.1V ensures stable performance and power efficiency.

Terminal Pitch: 0.65 mm

With a terminal pitch of 0.65mm, the microprocessor offers high-density packaging and efficient connectivity with other components.

Format: FIXED POINT

Fixed-point format simplifies arithmetic operations and enhances the performance of the microprocessor in numerical calculations.

Speed: 500 rpm

With a speed of 500 rpm, the microprocessor can handle rapid data processing and real-time computing tasks effectively.

Low Power Mode: YES

Having a low power mode option allows for improved energy efficiency and longer battery life in battery-powered devices.

Technical Specifications

Microprocessors XAM3358ZCE50 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

26 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B298

JESD-609 Code:

e1

Length:

13 mm

Low Power Mode:

YES

No. of Terminals:

298

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Maximum Seated Height:

1.3 mm

Speed:

500 rpm

Maximum Supply Voltage:

1.15 V

Minimum Supply Voltage:

1.06 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Width:

13 mm

Peripheral IC Type:

Trade Compliance

XAM3358ZCE50 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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