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XAM3358ZCE72

Texas Instruments

XAM3358ZCE72 by Texas Instruments

XAM3358ZCE72 by Texas Instruments is a 32-bit microprocessor with integrated cache and low power mode. It operates at a max clock frequency of 26 MHz, suitable for applications requiring high-speed processing in compact devices. With a package style of grid array and terminal pitch of 0.65 mm, it is ideal for space-constrained designs in consumer electronics and IoT devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,215 parts In-Stock

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6,215

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Digiode

USA . 1,653 parts In-Stock

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1,653

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Distributors (Availability)

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AZTECH Wire

Italy . 767 parts In-Stock

1+ parts

$10.688

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767

$10.688

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One Stop Electronics

USA . 1,095 parts In-Stock

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$32.000

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$32.000

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Parana Technologies

USA . 1,648 parts In-Stock

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$33.755

100+ parts

$3,134.667

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$30.380

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1,648

$33.755

$3,134.667

$30.380

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DigiPath Technology Company

USA . 2,067 parts In-Stock

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$37.168

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2,067

$37.168

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ChromeModa Solutions

Germany . 6,527 parts In-Stock

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$37.927

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$31.100

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6,527

$37.927

$31.100

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IDEA Electronic Components Group

UK . 2,241 parts In-Stock

1+ parts

$37.927

100+ parts

$36.031

1k+ parts

$34.134

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2,241

$37.927

$36.031

$34.134

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Corphita

USA . 636 parts In-Stock

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Overview

Unleash the power of cutting-edge technology with the XAM3358ZCE72 by Texas Instruments. As a leader in microprocessor innovation, Texas Instruments delivers unparalleled quality and reliability in every product. This microprocessor boasts integrated cache and low power mode, making it ideal for a wide range of applications. From industrial automation to consumer electronics, the XAM3358ZCE72 offers unmatched performance and efficiency. Experience the ultimate value and benefits that only Texas Instruments can provide, revolutionize your designs today with the XAM3358ZCE72.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and cost-effective, making the product reliable and affordable.

Integrated Cache: YES

Integrated cache improves performance by reducing memory access time, making the processor faster.

Surface Mount: YES

Surface mount technology allows for compact and efficient designs, saving space in electronic devices.

Maximum Supply Voltage: 1.15 V

Operating within a specific voltage range ensures stability and prevents damage to the processor.

Package Shape: SQUARE

The square shape is ideal for easy mounting and efficient use of space in electronic applications.

Bit Size: 32

A 32-bit processor can handle larger chunks of data at once, improving overall performance and speed.

No. of Terminals: 298

Having a high number of terminals enables connectivity to various components, expanding the capabilities of the processor.

Minimum Supply Voltage: 1.06 V

Operating at a low minimum supply voltage helps in reducing power consumption and heat generation.

Maximum Operating Temperature: 90 °C

With a high maximum operating temperature, the processor can withstand heat stress without performance degradation.

Minimum Operating Temperature: 0 °C

The ability to operate at low temperatures ensures stable performance in various environmental conditions.

Terminal Finish: TIN SILVER COPPER

This finish provides good conductivity and corrosion resistance, ensuring reliable connections.

Terminal Position: BOTTOM

Bottom terminal position simplifies assembly and makes it easier to integrate the processor into circuit boards.

Maximum Seated Height: 1.3 mm

A low seated height allows for slim and compact device designs, enhancing portability and aesthetics.

Width: 13 mm

The compact width makes the processor suitable for small form factor devices where space is limited.

Boundary Scan: YES

Boundary scan capability simplifies testing and debugging of the processor during manufacturing and maintenance.

Maximum Clock Frequency: 26 MHz

A high clock frequency enables faster data processing, enhancing overall performance of the processor.

Length: 13 mm

The short length of the processor contributes to space-saving designs in electronic products.

Peripheral IC Type: MICROPROCESSOR, RISC

A RISC microprocessor is optimized for efficient data processing and reduced instruction set complexity.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the processor energy efficient and reliable.

Terminal Form: BALL

Ball terminals provide secure connections and are suitable for advanced manufacturing processes like flip-chip assembly.

Nominal Supply Voltage: 1.1 V

Operating at a nominal supply voltage that is close to the maximum ensures stable and efficient performance.

Terminal Pitch: 0.65 mm

A small terminal pitch allows for high-density packaging and enables more terminals in a compact space.

Format: FIXED POINT

Fixed-point format simplifies mathematical operations and improves accuracy in data processing tasks.

Speed: 720 rpm

High rotational speed enhances performance in applications that require fast data processing and response times.

Low Power Mode: YES

The low power mode helps in reducing energy consumption and heat generation during idle or low-intensity operation.

Technical Specifications

Microprocessors XAM3358ZCE72 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

26 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B298

JESD-609 Code:

e1

Length:

13 mm

Low Power Mode:

YES

No. of Terminals:

298

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Maximum Seated Height:

1.3 mm

Speed:

720 rpm

Maximum Supply Voltage:

1.15 V

Minimum Supply Voltage:

1.06 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Width:

13 mm

Peripheral IC Type:

Trade Compliance

XAM3358ZCE72 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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