Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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IBM25PPC970MP7TR25AFT by Ibm Microelectronics is a 64-bit microprocessor with integrated cache, operating at a max clock frequency of 700 MHz. It features low power mode and boundary scan capabilities, making it suitable for high-performance computing applications requiring fast processing speeds and efficient power consumption.
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The ceramic and metal-sealed cofired package body material provides excellent durability and heat dissipation, making this microprocessor suitable for high-performance applications.
The integrated cache improves processing speed by storing frequently accessed data, enhancing overall system performance.
The surface mount capability allows for easy and secure installation on circuit boards, simplifying the manufacturing process.
The high maximum supply voltage ensures stable operation and power efficiency in various operating conditions.
The square package shape optimizes space utilization on the circuit board, enabling compact and efficient system design.
The 64-bit architecture enables the microprocessor to handle large amounts of data and execute complex instructions quickly and efficiently.
The high number of terminals allows for seamless connectivity and communication with other components in the system, enhancing overall functionality.
The grid array package style provides uniform contact points for reliable electrical connections, ensuring consistent performance and signal integrity.
The low minimum supply voltage helps in reducing power consumption and increasing energy efficiency during operation.
The bottom terminal position simplifies the installation process and facilitates better heat dissipation, improving overall thermal performance.
The low maximum seated height enables the microprocessor to fit in slim devices or compact spaces without compromising on performance or functionality.
The moderate width size allows for easy integration into various applications, providing flexibility in system design and layout.
The boundary scan feature helps in diagnosing and debugging circuit board issues quickly and accurately, ensuring reliable operation and easy maintenance.
The high maximum clock frequency enables fast data processing and execution, making the microprocessor suitable for demanding computing tasks and real-time applications.
The compact length size offers versatility in system integration and space-saving benefits, allowing for efficient use of board real estate.
The microprocessor with RISC architecture offers efficient and streamlined data processing, enhancing performance and system responsiveness.
The CMOS technology provides low power consumption, high-speed operation, and reliable performance, making this microprocessor a cost-effective and energy-efficient choice.
The ball terminal form ensures secure and reliable electrical connections, preventing signal interference and enhancing overall system stability.
The nominal supply voltage provides a balanced level of power for optimal performance and efficiency in various operating conditions.
The small terminal pitch size allows for dense packing and high connectivity in compact electronic devices, enhancing overall system functionality and performance.
The floating-point format allows for accurate and efficient numerical calculations, making the microprocessor suitable for mathematical and scientific applications that require precision and speed.
The high speed capability enables rapid data processing and execution, making the microprocessor ideal for high-performance computing tasks and real-time applications.
The low power mode feature helps in reducing energy consumption and heat generation during idle or low-load operation, enhancing overall energy efficiency and prolonging battery life in mobile devices.
Microprocessors IBM25PPC970MP7TR25AFT attributes and parameters. Explore more Microprocessors devices from Ibm Microelectronics
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IBM25PPC970MP7TR25AFT Peripheral ICs trade compliance attributes, and parameters.
ECCN
3A991.A.2
ECCN Governance
EAR
HTS
8542.31.00.01
SB
8542.31.00.00
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SMBJ18CA
Littelfuse
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
OPA2227UA
Burr-Brown Corporation
OPERATIONAL AMPLIFIER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
2N7002
Philips Semiconductors
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Moisture Sensitivity Level (MSL): 1; Maximum Operating Temperature: 150 Cel;
LL4148-GS08
Telefunken Microelectronics
RECTIFIER DIODE; Surface Mount: YES; JESD-609 Code: e0; No. of Elements: 1; Maximum Operating Temperature: 175 Cel; Maximum Non Repetitive Peak Forward Current: 2 A;
Alpha & Omega Semiconductor
2N2222A
Microchip Technology
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Collector Current (IC): .8 A; Minimum Operating Temperature: -65 Cel; Terminal Position: BOTTOM;
M39029/56-351
Defense Logistics Agency
CONNECTOR ACCESSORY; MIL Conformity: YES; Contact Gender: FEMALE; Mating Contacts: M39029/58-363; Removal Tool Sources: MILITARY; Alternate Contact Sources: MILITARY;
1N4148WS
Sinyork
RECTIFIER DIODE; Surface Mount: YES; Maximum Forward Voltage (VF): 1 V; No. of Elements: 1; Maximum Output Current: .2 A; Config: SINGLE;
NC7WZ07P6X
Fairchild Semiconductor
BUFFER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 6; Package Code: TSSOP; Package Shape: RECTANGULAR;
BAV99
Onsemi
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
Sangdest Microelectronics (Nanjing)
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
BSS138BKW,115
Nexperia
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Terminal Finish: TIN; No. of Terminals: 3; Additional Features: LOGIC LEVEL COMPATIBLE;
STM32H743ZIT6
STMicroelectronics
STM32H743ZIT6 by STMicroelectronics is a 32-bit microcontroller with integrated cache and a max supply voltage of 3.6V. It is commonly used in industrial applications, offering features such as 21 timers, CAN and USB connectivity, and low power mode.
LM2675M-ADJ/NOPB
National Semiconductor
SWITCHING REGULATOR; Temperature Grade: AUTOMOTIVE; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
NE555/D
General Electric Solid State
Analog Waveform Generation Functions; Temperature Grade: COMMERCIAL; Maximum Operating Temperature: 70 Cel; Technology: BIPOLAR; Package Equivalence Code: DIE OR CHIP; Qualification: Not Qualified;
DS18B20Z
Dallas Semiconductor
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Shape or Style: RECTANGULAR; Housing: PLASTIC; Maximum Accuracy (Cel): 0.50;
FDLL4148
FDLL4148 by Onsemi is a single rectifier diode with a max reverse recovery time of 0.004 us. With a max forward voltage of 1V and output current of 0.2A, it is ideal for applications requiring fast switching speeds in electronic circuits. The diode's glass package body material and isolated case connection make it suitable for surface mount designs operating at temperatures up to 175°C.
Multicomp Pro
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Diode Element Material: SILICON; Technology: AVALANCHE; Maximum Repetitive Peak Reverse Voltage: 18 V; Nominal Breakdown Voltage: 21.05 V;
Leshan Radio
MIMXRT1015DAF5B
NXP Semiconductors
MICROPROCESSOR, RISC; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3;
LUPXA255A0C200
Intel
Intel LUPXA255A0C200 microprocessor features 32-bit architecture, 26-bit address bus, and operates at a max clock frequency of 3.6864 MHz. Ideal for low power applications with integrated cache and boundary scan capabilities.
APX81131UG-7
Diodes Incorporated
APX81131UG-7 by Diodes Incorporated is a small outline microprocessor with 4 terminals, operating b/w -40 to 85°C. It has a supply voltage range of 1.1V to 5.5V and uses CMOS technology for industrial applications requiring fixed-point processing in compact spaces.
STM32MP157AAA3T
STM32MP157AAA3T by STMicroelectronics is a 32-bit microprocessor with 64 MHz clock frequency, 448 terminals, and 1.25 V max supply voltage. Ideal for industrial applications requiring low power consumption and high-speed processing in a compact form factor.
Z0840006PSC
Zilog
MICROPROCESSOR; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 40; Package Code: DIP; Package Shape: RECTANGULAR;
ATSAMA5D36A-CNR
The Microchip Technology ATSAMA5D36A-CNR microprocessor features 32-bit architecture, 131072 RAM words, and a max clock frequency of 48 MHz. Ideal for industrial applications requiring high-speed processing and low power consumption. With 39 DMA channels and 10 serial I/Os, it offers versatile connectivity options in a compact square package.
MPC8321ECVRADDCA
NXP Semiconductors' MPC8321ECVRADDCA is a 32-bit microprocessor with integrated cache, operating at a max clock frequency of 66.67 MHz. This CMOS technology chip features low power mode and boundary scan capabilities, making it ideal for applications requiring high-speed processing in compact devices.
STM32MP157AAA3
STM32MP157AAA3 by STMicroelectronics is a 32-bit microprocessor with a max clock frequency of 64 MHz. It has 724992 RAM words and operates in an industrial temperature grade range (-40 to 125 °C). This microprocessor is commonly used in applications requiring high-speed processing and reliable performance.
DM388AAAR11F
Texas Instruments
Texas Instruments DM388AAAR11F microprocessor features 32-bit architecture, 609 terminals, and 655360 RAM words. With a clock frequency of 30 MHz, it is suitable for applications requiring high-speed processing such as embedded systems and IoT devices. The processor's low power mode and integrated cache make it ideal for energy-efficient designs in various industries.
CM8064601538900SR183
MICROPROCESSOR;
MIMXRT1166XVM5A
MICROPROCESSOR, RISC; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260;
MPC8321VRADDCA
The NXP Semiconductors MPC8321VRADDCA microprocessor features a 32-bit architecture, integrated cache, and max clock frequency of 66.67 MHz. Ideal for low power applications, it is designed for use in microprocessor-based systems requiring high-speed processing capabilities with a package style of grid array.
MPC860TVR80D4
The NXP Semiconductors MPC860TVR80D4 is a 32-bit microprocessor with integrated cache, operating at a max clock frequency of 50 MHz. It features a low power mode and is suitable for applications requiring high-speed processing in compact devices. With a terminal pitch of 1.27 mm and boundary scan capability, it offers efficient performance in various electronic systems.
MCF5327CVM240
The NXP Semiconductors MCF5327CVM240 is a 32-bit microprocessor with integrated cache and a max clock frequency of 80 MHz. It is commonly used in industrial applications due to its low power mode and temperature grade of INDUSTRIAL.
STM32MP135DAE7
STM32MP135DAE7 by STMicroelectronics is a 32-bit microprocessor with 172032 RAM words and 48 MHz max clock frequency. Ideal for low power applications, it features 56 DMA channels and operates b/w -40 to 105 °C.
Z84C0008PEG
IXYS Corporation
Z84C0008PEG by IXYS Corp is an 8-bit microprocessor with 16-bit address bus, operating at max 8 MHz clock frequency. Ideal for industrial applications, it has a supply voltage range of 4.5-5.5 V and operates in temperature range -40 to 100 °C.
MIMXRT1024DAG5A
NXP's MIMXRT1024DAG5A microprocessor features 32-bit architecture, 262144 RAM words, and a max clock frequency of 24 MHz. Ideal for low power applications with its integrated cache, it offers 3.6V max supply voltage and operates b/w 0-95°C.
MPC8280CZUUPEA
Freescale Semiconductor
MICROPROCESSOR, RISC; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 480; Package Code: LBGA; Package Shape: SQUARE;
MPC8270CVRMIBA,557
NXP Semiconductors' MPC8270CVRMIBA,557 microprocessor features 32-bit address bus width, 64-bit external data bus width, and a max clock frequency of 266 MHz. Ideal for applications requiring high-speed processing such as networking equipment and industrial automation systems.
AM3354BZCZD80
AM3354BZCZD80 by Texas Instruments is a 32-bit microprocessor with 131072 RAM words and 16-bit external data bus width. It operates at a max clock frequency of 26 MHz, suitable for industrial applications requiring low power mode and boundary scan capability. The package style is grid array, low profile, fine pitch with a terminal pitch of 0.8 mm.
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IBM25PPC750FX-GB0133T
Ibm Microelectronics
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 292; Package Code: BGA; Package Shape: SQUARE; Length: 21.02 mm;
IBM25PPC970FX6TB105RT
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 576; Package Code: BGA; Package Shape: SQUARE; Terminal Pitch: 1 mm;
IBM25PPC970FX6TB185RT
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 576; Package Code: BGA; Package Shape: SQUARE; Maximum Seated Height: 3.168 mm;
IBM25PPC970FX6TB186ET
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 576; Package Code: BGA; Package Shape: SQUARE; Minimum Supply Voltage: 1.05 V;
IBM25PPC970FX6TB267ET
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 576; Package Code: BGA; Package Shape: SQUARE; Nominal Supply Voltage: 1.15 V;
IBM25PPC970FX6TB429RT
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 576; Package Code: BGA; Package Shape: SQUARE; Format: FLOATING POINT;
IBM25PPC970FX6TR055RT
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 576; Package Code: BGA; Package Shape: SQUARE; Terminal Finish: TIN SILVER COPPER;
IBM25PPC970FX6TR075RT
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 576; Package Code: BGA; Package Shape: SQUARE; Power Supplies (V): 1;
IBM25PPC970FX6TR348RT
IBM25PPC970FX6UB185RT
IBM25PPC970FX6UB428ET
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 576; Package Code: BGA; Package Shape: SQUARE; Integrated Cache: YES;
IBM25PPC970FX6UB429RT
IBM25PPC970FX6UR185RT
IBM25PPC970FX6UR267ET
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 576; Package Code: BGA; Package Shape: SQUARE; External Data Bus Width: 44;
IBM25PPC970FX6UR428ET
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 576; Package Code: BGA; Package Shape: SQUARE; Maximum Supply Voltage: 1.3 V;
IBM25PPC970MP7TR02AFT
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 575; Package Code: BGA; Package Shape: SQUARE; Maximum Seated Height: 2.23 mm;
IBM25PPC970MP7TR06AFT
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 575; Package Code: BGA; Package Shape: SQUARE; JESD-30 Code: S-CBGA-B575;
IBM25PPC970MP7TR21AFT
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 575; Package Code: BGA; Package Shape: SQUARE; Terminal Position: BOTTOM;
IBM25PPC970MP7TR31AFT
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 575; Package Code: BGA; Package Shape: SQUARE; Terminal Pitch: 1 mm;
IBM25PPC970FX5SB101ET
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 576; Package Code: BGA; Package Shape: SQUARE; Package Body Material: CERAMIC, METAL-SEALED COFIRED;
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