Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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IBM25PPC970MP7TR25AFT by Ibm Microelectronics is a 64-bit microprocessor with integrated cache, operating at a max clock frequency of 700 MHz. It features low power mode and boundary scan capabilities, making it suitable for high-performance computing applications requiring fast processing speeds and efficient power consumption.
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The ceramic and metal-sealed cofired package body material provides excellent durability and heat dissipation, making this microprocessor suitable for high-performance applications.
The integrated cache improves processing speed by storing frequently accessed data, enhancing overall system performance.
The surface mount capability allows for easy and secure installation on circuit boards, simplifying the manufacturing process.
The high maximum supply voltage ensures stable operation and power efficiency in various operating conditions.
The square package shape optimizes space utilization on the circuit board, enabling compact and efficient system design.
The 64-bit architecture enables the microprocessor to handle large amounts of data and execute complex instructions quickly and efficiently.
The high number of terminals allows for seamless connectivity and communication with other components in the system, enhancing overall functionality.
The grid array package style provides uniform contact points for reliable electrical connections, ensuring consistent performance and signal integrity.
The low minimum supply voltage helps in reducing power consumption and increasing energy efficiency during operation.
The bottom terminal position simplifies the installation process and facilitates better heat dissipation, improving overall thermal performance.
The low maximum seated height enables the microprocessor to fit in slim devices or compact spaces without compromising on performance or functionality.
The moderate width size allows for easy integration into various applications, providing flexibility in system design and layout.
The boundary scan feature helps in diagnosing and debugging circuit board issues quickly and accurately, ensuring reliable operation and easy maintenance.
The high maximum clock frequency enables fast data processing and execution, making the microprocessor suitable for demanding computing tasks and real-time applications.
The compact length size offers versatility in system integration and space-saving benefits, allowing for efficient use of board real estate.
The microprocessor with RISC architecture offers efficient and streamlined data processing, enhancing performance and system responsiveness.
The CMOS technology provides low power consumption, high-speed operation, and reliable performance, making this microprocessor a cost-effective and energy-efficient choice.
The ball terminal form ensures secure and reliable electrical connections, preventing signal interference and enhancing overall system stability.
The nominal supply voltage provides a balanced level of power for optimal performance and efficiency in various operating conditions.
The small terminal pitch size allows for dense packing and high connectivity in compact electronic devices, enhancing overall system functionality and performance.
The floating-point format allows for accurate and efficient numerical calculations, making the microprocessor suitable for mathematical and scientific applications that require precision and speed.
The high speed capability enables rapid data processing and execution, making the microprocessor ideal for high-performance computing tasks and real-time applications.
The low power mode feature helps in reducing energy consumption and heat generation during idle or low-load operation, enhancing overall energy efficiency and prolonging battery life in mobile devices.
Microprocessors IBM25PPC970MP7TR25AFT attributes and parameters. Explore more Microprocessors devices from Ibm Microelectronics
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IBM25PPC970MP7TR25AFT Peripheral ICs trade compliance attributes, and parameters.
ECCN
3A991.A.2
ECCN Governance
EAR
HTS
8542.31.00.01
SB
8542.31.00.00
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SS14
Taitron Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
DS18B20Z+
Analog Devices
DS18B20Z+ by Analog Devices is a 12-bit temperature sensor with 1-Wire interface. It operates b/w -55 to 125°C, with ±0.5°C accuracy. Suitable for applications requiring digital output and surface mounting feature.
LM555CN
Onsemi
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
CRG0805F10K
TE Connectivity
TE Connectivity's CRG0805F10K is a 10000 ohm fixed resistor with 1% tolerance. It operates b/w -55 to 155 °C and has a power dissipation of 0.125 W. Ideal for surface mount applications in various electronic circuits due to its compact size and high temperature rating.
MS3V-T1R32.768KHZ+/-20PPM12.5PF
Golledge Electronics
MS3V-T1R32.768KHZ+/-20PPM12.5PF by Golledge Electronics is a crystal oscillator with 20 ppm frequency tolerance, 126% stability, and 12.5 pF load capacitance. It is ideal for applications requiring precise timing in temperature-sensitive environments due to its -40 to 85 °C operating range.
OPA2227UA
Texas Instruments
OPA2227UA by Texas Instruments is a dual operational amplifier with low-offset voltage of 200 uV and bias current of 0.01 uA. It operates at temperatures ranging from -40 to 85 °C, making it suitable for industrial applications requiring precise signal amplification. With a unity gain bandwidth of 8000 kHz, this op amp is ideal for high-frequency circuit designs.
M24308/2-1F
Souriau
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Mating Info.: MULTIPLE MATING PARTS AVAILABLE; Body or Shell Style: RECEPTACLE; MIL Conformity: YES;
1N4148
STMicroelectronics
RECTIFIER DIODE; Surface Mount: NO; Maximum Output Current: .15 A; Maximum Operating Temperature: 200 Cel; Config: SINGLE; Terminal Finish: Tin/Lead (Sn/Pb);
Forward International Electronics
RECTIFIER DIODE; Surface Mount: YES; Maximum Operating Temperature: 150 Cel; No. of Elements: 1; No. of Phases: 1; Maximum Output Current: 1 A;
MBRS340T3G
MBRS340T3G by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.5V and output current of 4A. It operates b/w -65°C to 150°C, making it suitable for various applications requiring high-speed switching and low power loss in a small outline package. The diode's matte tin terminal finish and dual position make it ideal for surface mount PCB designs.
MBR0540T1G
MBR0540T1G by Onsemi is a Schottky rectifier diode with max. forward voltage of 0.62V and max. output current of 0.5A, ideal for applications requiring high efficiency power conversion in small outline packages. Operating temp range: -55 to 150°C, with peak reflow temp at 260°C, making it suitable for various electronic devices needing reliable rectification performance in compact designs.
LM7805CT
National Semiconductor
FIXED POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Package Code: TO-220; Terminal Form: THROUGH-HOLE; Maximum Input Voltage Absolute: 35 V; Maximum Voltage Tolerance: 5 %;
RC0402JR-070RL
Yageo
Yageo's RC0402JR-070RL is a SMT fixed resistor with 0 ohm resistance, rated for temperatures from -55 to 155 °C. It features METAL GLAZE/THICK FILM tech, WRAPAROUND terminals, and 0.0625 W power dissipation. Ideal for jumper applications in electronics requiring compact surface mount components.
ERJ3GEY0R00V
Panasonic
ERJ3GEY0R00V by Panasonic is a SMT fixed resistor with 0 ohm resistance, suitable for jumper applications. It features a metal glaze/thick film technology, rated for temperatures b/w -55 to 155 °C. With a compact rectangular construction and matte tin over nickel terminal finish, it is ideal for surface mount installations in various electronic devices.
ULN2803A
Motorola
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; Terminal Position: DUAL; JESD-30 Code: R-PDIP-T18;
BAV99WT1G
Fairchild Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148WT
Surge Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Daco Semiconductor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
2N7002
Inter F E T
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Maximum Drain-Source On Resistance: 7.5 ohm; Maximum Drain Current (Abs) (ID): .115 A;
MPC8347EVVAJDB
Freescale Semiconductor
MICROPROCESSOR; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 672; Package Code: LBGA; Package Shape: SQUARE;
MIMXRT1052DVL6BR
NXP Semiconductors
MICROPROCESSOR, RISC; Maximum Time At Peak Reflow Temperature (s): 40; Terminal Finish: TIN SILVER COPPER; Peak Reflow Temperature (C): 260; JESD-609 Code: e1; Moisture Sensitivity Level (MSL): 3;
STM32MP151CAB3
MICROPROCESSOR, RISC; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Peak Reflow Temperature (C): NOT SPECIFIED;
MPC8358ECZQAGDGA
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 668; Package Code: HBGA; Package Shape: SQUARE; Surface Mount: YES;
14305R-2000
Dialog Semiconductor
14305R-2000 by Dialog Semiconductor is a Microprocessor with 48 terminals, operating at 3.3V nominal voltage and up to 10 MHz clock frequency. Ideal for industrial applications requiring CMOS technology, it features a compact square package style with boundary scan capability.
MCIMX6U7CVM08AC
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE; External Data Bus Width: 32;
STM32MP131AAG3
STM32MP131AAG3 by STMicroelectronics is a 32-bit microprocessor with integrated cache and 8-bit on-chip data RAM. It features a max clock frequency of 48 MHz, suitable for low power applications in various industries like IoT and embedded systems. With a terminal pitch of 0.5 mm and boundary scan capability, it offers high performance in a compact form factor.
MCF5474VR266
MICROPROCESSOR; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 388; Package Code: BGA; Package Shape: SQUARE;
MCF5485CVR200
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 388; Package Code: BGA; Package Shape: SQUARE;
AM3352BZCE30
AM3352BZCE30 by Texas Instruments is a 32-bit microprocessor with integrated cache and 131072 RAM words. It operates at a max clock frequency of 26 MHz, suitable for low power applications. The package style is grid array, making it ideal for compact designs in various electronic devices.
W65C02S6TPLG-14
Western Design Center
Microprocessors;
AT91SAM9G45-CU-999
Microchip Technology
Microchip AT91SAM9G45-CU-999 is a 32-bit microprocessor with 8-bit RAM, 26-bit address bus, and 32-bit external data bus. It operates at up to 50 MHz clock frequency and features integrated cache for enhanced performance. Ideal for low power applications due to its min supply voltage of 0.9 V and max seated height of 1.2 mm.
MPC860SRVR50D4
The NXP Semiconductors MPC860SRVR50D4 microprocessor features a 32-bit address and external data bus width, with a max clock frequency of 50 MHz. It is designed for low power mode applications, with integrated cache and boundary scan capabilities. Ideal for use in RISC-based systems requiring high-speed processing within a compact form factor.
MPC860TCZQ66D4
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 357; Package Code: BGA; Package Shape: SQUARE; Maximum Clock Frequency: 50 MHz;
21281-DB
Intel
The Intel 21281-DB microprocessor features a 32-bit address bus width, integrated cache, and operates at a max clock frequency of 3.68 MHz. It is commonly used in commercial applications requiring low power consumption and high processing speeds.
STM32MP157CAC3
MICROPROCESSOR, RISC; Peak Reflow Temperature (C): NOT SPECIFIED; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
SAM9X60D5M-I/4FB
SAM9X60D5M-I/4FB by Microchip Technology is a microprocessor with 16 DMA channels, 50 MHz clock frequency, and 1.8V nominal voltage. Ideal for industrial applications requiring low power mode, it features a CMOS technology, 233 terminals in a grid array package style, and operates b/w -40 to 85 °C temperature range.
ATSAMA5D27C-LD2G-CUR
ATSAMA5D27C-LD2G-CUR by Microchip: 16-bit, 24MHz clock, 32-word RAM. Ideal for industrial applications requiring low power consumption and high-speed processing. Features integrated cache, 51 DMA channels, and operates b/w -40 to 85°C.
MCF53281CVM240
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;
MPC8313CVRADDC
The NXP Semiconductors MPC8313CVRADDC is a 32-bit microprocessor with integrated cache, operating at a max frequency of 66.67 MHz. It features a 32-bit external data bus width and supports low power mode, making it ideal for industrial applications requiring high-speed processing in compact form factors.
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IBM25PPC750FX-GB0133T
Ibm Microelectronics
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 292; Package Code: BGA; Package Shape: SQUARE; Length: 21.02 mm;
IBM25PPC970FX6TB105RT
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 576; Package Code: BGA; Package Shape: SQUARE; Terminal Pitch: 1 mm;
IBM25PPC970FX6TB185RT
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 576; Package Code: BGA; Package Shape: SQUARE; Maximum Seated Height: 3.168 mm;
IBM25PPC970FX6TB186ET
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 576; Package Code: BGA; Package Shape: SQUARE; Minimum Supply Voltage: 1.05 V;
IBM25PPC970FX6TB267ET
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 576; Package Code: BGA; Package Shape: SQUARE; Nominal Supply Voltage: 1.15 V;
IBM25PPC970FX6TB429RT
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 576; Package Code: BGA; Package Shape: SQUARE; Format: FLOATING POINT;
IBM25PPC970FX6TR055RT
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 576; Package Code: BGA; Package Shape: SQUARE; Terminal Finish: TIN SILVER COPPER;
IBM25PPC970FX6TR075RT
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 576; Package Code: BGA; Package Shape: SQUARE; Power Supplies (V): 1;
IBM25PPC970FX6TR348RT
IBM25PPC970FX6UB185RT
IBM25PPC970FX6UB428ET
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 576; Package Code: BGA; Package Shape: SQUARE; Integrated Cache: YES;
IBM25PPC970FX6UB429RT
IBM25PPC970FX6UR185RT
IBM25PPC970FX6UR267ET
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 576; Package Code: BGA; Package Shape: SQUARE; External Data Bus Width: 44;
IBM25PPC970FX6UR428ET
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 576; Package Code: BGA; Package Shape: SQUARE; Maximum Supply Voltage: 1.3 V;
IBM25PPC970MP7TR02AFT
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 575; Package Code: BGA; Package Shape: SQUARE; Maximum Seated Height: 2.23 mm;
IBM25PPC970MP7TR06AFT
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 575; Package Code: BGA; Package Shape: SQUARE; JESD-30 Code: S-CBGA-B575;
IBM25PPC970MP7TR21AFT
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 575; Package Code: BGA; Package Shape: SQUARE; Terminal Position: BOTTOM;
IBM25PPC970MP7TR31AFT
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 575; Package Code: BGA; Package Shape: SQUARE; Terminal Pitch: 1 mm;
IBM25PPC970FX5SB101ET
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 576; Package Code: BGA; Package Shape: SQUARE; Package Body Material: CERAMIC, METAL-SEALED COFIRED;
Supply Digital Components
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