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IBM25PPC970FX6UR185RT

Ibm Microelectronics

IBM25PPC970FX6UR185RT by Ibm Microelectronics

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 576; Package Code: BGA; Package Shape: SQUARE; Terminal Finish: TIN SILVER COPPER;

Median Price

-

Lifecycle Status

Suppliers In-Stock

0

In-Stock Inventory

< 1k

Technical Specifications

Microprocessors IBM25PPC970FX6UR185RT attributes and parameters. Explore more Microprocessors devices from Ibm Microelectronics

Specs

Address Bus Width:

44

Bit Size:

64

Boundary Scan:

YES

Maximum Clock Frequency:

300 MHz

External Data Bus Width:

44

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-CBGA-B576

JESD-609 Code:

e1

Length:

25 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

576

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

BGA

Package Equivalence Code:

BGA576,24X24,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Power Supplies (V):

1

Qualification:

Not Qualified

Maximum Seated Height:

2.808 mm

Speed:

1600 rpm

Sub-Category:

Microprocessors

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

25 mm

Peripheral IC Type:

Trade Compliance

IBM25PPC970FX6UR185RT Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Ibm Microelectronics

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