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OMAP3530ECBBAR

Texas Instruments

OMAP3530ECBBAR by Texas Instruments

OMAP3530ECBBAR by Texas Instruments is a microprocessor with integrated cache and 8-bit data RAM. It features a max clock frequency of 38.4 MHz, suitable for industrial applications requiring high-speed processing. With low power mode and boundary scan capabilities, it offers efficient performance in compact devices.

Median Price

$53.856

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,985 parts In-Stock

1+ parts

$53.856

100+ parts

$47.872

1k+ parts

$35.200

10k+ parts

-

1,985

$53.856

$47.872

$35.200

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 270 parts In-Stock

1+ parts

$51.163

100+ parts

-

1k+ parts

-

10k+ parts

-

270

$51.163

-

-

-

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$52.800

100+ parts

-

1k+ parts

-

10k+ parts

-

10

$52.800

-

-

-

Vyrian

USA . 6,938 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,938

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 113 parts In-Stock

1+ parts

$18.760

100+ parts

-

1k+ parts

-

10k+ parts

-

113

$18.760

-

-

-

Parana Technologies

USA . 171 parts In-Stock

1+ parts

$40.695

100+ parts

-

1k+ parts

-

10k+ parts

-

171

$40.695

-

-

-

DigiPath Technology Company

USA . 2,362 parts In-Stock

1+ parts

$44.810

100+ parts

$41.226

1k+ parts

-

10k+ parts

-

2,362

$44.810

$41.226

-

-

ChromeModa Solutions

Germany . 5,290 parts In-Stock

1+ parts

$45.725

100+ parts

$37.494

1k+ parts

-

10k+ parts

-

5,290

$45.725

$37.494

-

-

IDEA Electronic Components Group

UK . 1,865 parts In-Stock

1+ parts

$45.725

100+ parts

$43.439

1k+ parts

$41.152

10k+ parts

-

1,865

$45.725

$43.439

$41.152

-

Ampacity Inc.

Singapore . 1,924 parts In-Stock

1+ parts

$45.780

100+ parts

-

1k+ parts

-

10k+ parts

-

1,924

$45.780

-

-

-

Corphita

USA . 1,807 parts In-Stock

1+ parts

$48.470

100+ parts

-

1k+ parts

-

10k+ parts

-

1,807

$48.470

-

-

-

Continental Prestige Electronics

USA . 4,567 parts In-Stock

1+ parts

$52.800

100+ parts

-

1k+ parts

-

10k+ parts

$51.744

4,567

$52.800

-

-

$51.744

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$52.800

100+ parts

$51.744

1k+ parts

-

10k+ parts

-

1,000

$52.800

$51.744

-

-

Corohmni

South Africa . 537 parts In-Stock

1+ parts

$63.902

100+ parts

-

1k+ parts

-

10k+ parts

-

537

$63.902

-

-

-

Microchip USA

USA . 2,503 parts In-Stock

1+ parts

$102.210

100+ parts

$100.430

1k+ parts

$99.550

10k+ parts

$98.660

2,503

$102.210

$100.430

$99.550

$98.660

Argo Parts USA

USA . 1,824 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,824

-

-

-

-

Overview

Unleash the power of cutting-edge technology with the OMAP3530ECBBAR by Texas Instruments. As a leader in microprocessors, Texas Instruments delivers top-quality products that are designed to meet the demands of today's advanced applications. With integrated cache and a wide range of power supplies, this processor offers unmatched performance and reliability. Ideal for industrial use, the OMAP3530ECBBAR boasts a variety of features including boundary scan and low power mode, making it a versatile solution for a wide range of projects. Trust Texas Instruments to provide you with the tools you need to succeed in the ever-evolving world of technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good durability and protection for the microprocessor, ensuring longevity and stability in various operating conditions.

Integrated Cache: YES

Having integrated cache improves the processing speed and efficiency of the microprocessor, making it ideal for handling complex tasks.

Surface Mount: YES

Allows for easy installation and integration on circuit boards, saving space and reducing overall system size.

Maximum Supply Voltage: 1.35 V

Operates efficiently within a low voltage range, reducing power consumption and heat generation.

Address Bus Width: 26

With a wide address bus width, the microprocessor can handle larger memory addresses, improving data processing capabilities.

Maximum Operating Temperature: 85 °C

Capable of operating at high temperatures, suitable for industrial environments where heat dissipation is important.

Peripheral IC Type: MICROPROCESSOR, RISC

Utilizing RISC architecture enhances the microprocessor's performance by simplifying instruction execution and improving efficiency.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor technology offers low power consumption, high noise immunity, and fast switching speeds, making the microprocessor energy-efficient and reliable.

Technical Specifications

Microprocessors OMAP3530ECBBAR attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

26

Boundary Scan:

YES

Maximum Clock Frequency:

38.4 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B515

JESD-609 Code:

e1

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

32

No. of Terminals:

515

On Chip Data RAM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA515,28X28,16

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.1,1.8,3.3

Qualification:

Not Qualified

RAM Words:

65536

Maximum Seated Height:

.9 mm

Speed:

600 rpm

Sub-Category:

Graphics Processors

Maximum Supply Voltage:

1.35 V

Minimum Supply Voltage:

.985 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

12 mm

Peripheral IC Type:

Trade Compliance

OMAP3530ECBBAR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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