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OMAP3525ECUS

Texas Instruments

OMAP3525ECUS by Texas Instruments

OMAP3525ECUS by Texas Instruments is a microprocessor with 423 terminals in a square package. It operates at temperatures from 0 to 90°C and has power supplies of 1.1V, 1.2V, and more. This CMOS technology chip is ideal for applications requiring high-speed processing in compact devices.

Median Price

$40.998

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,500 parts In-Stock

1+ parts

$40.998

100+ parts

$36.443

1k+ parts

$26.796

10k+ parts

-

1,500

$40.998

$36.443

$26.796

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 570 parts In-Stock

1+ parts

$38.948

100+ parts

-

1k+ parts

-

10k+ parts

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570

$38.948

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-

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Vyrian

USA . 5,349 parts In-Stock

1+ parts

-

100+ parts

-

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-

10k+ parts

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5,349

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-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 190 parts In-Stock

1+ parts

$14.350

100+ parts

-

1k+ parts

-

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190

$14.350

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$25.810

100+ parts

$25.552

1k+ parts

$24.520

10k+ parts

-

1,000

$25.810

$25.552

$24.520

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Corphita

USA . 1,543 parts In-Stock

1+ parts

$36.898

100+ parts

-

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1,543

$36.898

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Parana Technologies

USA . 438 parts In-Stock

1+ parts

$47.658

100+ parts

-

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10k+ parts

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438

$47.658

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-

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DigiPath Technology Company

USA . 332 parts In-Stock

1+ parts

$52.477

100+ parts

$48.279

1k+ parts

-

10k+ parts

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332

$52.477

$48.279

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ChromeModa Solutions

Germany . 4,667 parts In-Stock

1+ parts

$53.548

100+ parts

$43.909

1k+ parts

-

10k+ parts

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4,667

$53.548

$43.909

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IDEA Electronic Components Group

UK . 1,322 parts In-Stock

1+ parts

$53.548

100+ parts

$50.871

1k+ parts

$48.193

10k+ parts

-

1,322

$53.548

$50.871

$48.193

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Microchip USA

USA . 1,828 parts In-Stock

1+ parts

$90.260

100+ parts

$88.690

1k+ parts

$87.900

10k+ parts

$87.120

1,828

$90.260

$88.690

$87.900

$87.120

Overview

Unleash the power of cutting-edge technology with the OMAP3525ECUS by Texas Instruments. As a leader in microprocessor innovation, Texas Instruments delivers top-quality products that are trusted by industry professionals worldwide. The OMAP3525ECUS is a versatile solution for a wide range of applications, providing unmatched performance and reliability. Experience seamless operation and enhanced efficiency with this advanced microprocessor. Upgrade your systems today and discover the endless possibilities with the OMAP3525ECUS from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the microprocessor lightweight and durable, ensuring easy handling and longevity.

Surface Mount: YES

The surface mount capability allows for easy and efficient installation of the microprocessor on a circuit board, reducing assembly time and complexity.

Power Supplies (V): 1.1, 1.2, 1.8, 1.8/3

The availability of multiple power supply options provides flexibility in power management, allowing the microprocessor to operate efficiently in various voltage ranges.

No. of Terminals: 423

With a high number of terminals, the microprocessor can support a wide range of functions and interfaces, making it suitable for complex computing tasks.

Maximum Operating Temperature: 90 °C

The high maximum operating temperature ensures reliability and stability of the microprocessor even under intense heat conditions, making it suitable for demanding environments.

Technology: CMOS

The CMOS technology used in the microprocessor enables low power consumption and high performance, making it an energy-efficient choice for various applications.

Technical Specifications

Microprocessors OMAP3525ECUS attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B423

JESD-609 Code:

e1

Length:

16 mm

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

423

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA423,24X24,25

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.1,1.2,1.8,1.8/3

Qualification:

Not Qualified

Maximum Seated Height:

1.4 mm

Speed:

600 rpm

Sub-Category:

Graphics Processors

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Trade Compliance

OMAP3525ECUS Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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