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OMAP3525ECBBA

Texas Instruments

OMAP3525ECBBA by Texas Instruments

OMAP3525ECBBA by Texas Instruments is a MICROPROCESSOR with RISC technology. It operates at 600 rpm speed and supports power supplies of 1.1V, 1.2V, 1.8V, and 1.8/3V. This processor is ideal for industrial applications requiring high performance in a compact package with a max operating temperature of 105°C.

Median Price

$48.807

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,600 parts In-Stock

1+ parts

$48.807

100+ parts

$43.384

1k+ parts

$31.900

10k+ parts

-

1,600

$48.807

$43.384

$31.900

-

Rochester

USA . 1,512 parts In-Stock

1+ parts

-

100+ parts

$45.930

1k+ parts

$41.100

10k+ parts

$38.680

1,512

-

$45.930

$41.100

$38.680

DigiKey

USA . 1,512 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,512

-

-

-

-

Verical

USA . 1,512 parts In-Stock

1+ parts

-

100+ parts

$57.413

1k+ parts

$51.375

10k+ parts

$48.350

1,512

-

$57.413

$51.375

$48.350

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,215 parts In-Stock

1+ parts

$42.094

100+ parts

-

1k+ parts

-

10k+ parts

-

1,215

$42.094

-

-

-

DigiKey Marketplace

USA . 840 parts In-Stock

1+ parts

$46.080

100+ parts

-

1k+ parts

-

10k+ parts

-

840

$46.080

-

-

-

Vyrian

USA . 6,056 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,056

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 700 parts In-Stock

1+ parts

$13.015

100+ parts

$11.844

1k+ parts

$10.672

10k+ parts

-

700

$13.015

$11.844

$10.672

-

Corphita

USA . 4,162 parts In-Stock

1+ parts

$39.879

100+ parts

-

1k+ parts

-

10k+ parts

-

4,162

$39.879

-

-

-

Parana Technologies

USA . 164 parts In-Stock

1+ parts

$64.772

100+ parts

-

1k+ parts

-

10k+ parts

-

164

$64.772

-

-

-

DigiPath Technology Company

USA . 935 parts In-Stock

1+ parts

$71.322

100+ parts

$65.617

1k+ parts

-

10k+ parts

-

935

$71.322

$65.617

-

-

ChromeModa Solutions

Germany . 6,104 parts In-Stock

1+ parts

$72.778

100+ parts

$59.678

1k+ parts

-

10k+ parts

-

6,104

$72.778

$59.678

-

-

IDEA Electronic Components Group

UK . 1,777 parts In-Stock

1+ parts

$72.778

100+ parts

$69.139

1k+ parts

$65.500

10k+ parts

-

1,777

$72.778

$69.139

$65.500

-

Microchip USA

USA . 2,529 parts In-Stock

1+ parts

$105.980

100+ parts

$104.140

1k+ parts

$103.220

10k+ parts

$102.300

2,529

$105.980

$104.140

$103.220

$102.300

QUARKTWIN TECHNOLOGY LTD

USA . 22,974 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

22,974

-

-

-

-

Metaverse IC Inc.

Canada . 1,100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,100

-

-

-

-

Overview

Upgrade your technology with the OMAP3525ECBBA by Texas Instruments, a cutting-edge microprocessor designed to deliver top-notch performance in a variety of applications. With Texas Instruments' reputation for reliability and innovation, you can trust that this powerful processor will exceed your expectations. Whether you're working on IoT devices, automotive systems, or industrial automation, the OMAP3525ECBBA offers unparalleled value, efficiency, and versatility. Stay ahead of the curve and unleash the full potential of your projects with this exceptional product.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and thermal resistance, making the product suitable for a wide range of operating temperatures.

Surface Mount: YES

Surface mount technology allows for easier and more efficient assembly of the product onto circuit boards.

Power Supplies (V): 1.1,1.2,1.8,1.8/3

Support for multiple power supply voltages allows for flexibility in system design and compatibility with various applications.

No. of Terminals: 515

The large number of terminals enables connectivity to a wide range of external components and peripherals.

Maximum Seated Height: 0.9 mm

Low profile design helps in minimizing space requirements and allows for compact and space-efficient product integration.

Temperature Grade: INDUSTRIAL

Industrial grade temperature range ensures reliable operation in harsh environments and industrial applications.

Peripheral IC Type: MICROPROCESSOR, RISC

RISC architecture enables high performance and efficient processing, making it suitable for a variety of computing tasks.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, contributing to efficient operation and longer battery life.

Speed: 600 rpm

High processing speed of 600 rpm ensures smooth and responsive performance for demanding computing tasks.

Technical Specifications

Microprocessors OMAP3525ECBBA attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B515

JESD-609 Code:

e1

Length:

12 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

515

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA515,28X28,16

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.1,1.2,1.8,1.8/3

Qualification:

Not Qualified

Maximum Seated Height:

.9 mm

Speed:

600 rpm

Sub-Category:

Graphics Processors

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Peripheral IC Type:

Trade Compliance

OMAP3525ECBBA Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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