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OMAP3530ECUSA

Texas Instruments

OMAP3530ECUSA by Texas Instruments

OMAP3530ECUSA by Texas Instruments is a MICROPROCESSOR with RISC technology, operating at 720 rpm speed. It features a package style of GRID ARRAY and LOW PROFILE, with a terminal pitch of 0.65 mm. Ideal for INDUSTRIAL applications requiring high performance in compact designs.

Median Price

$53.856

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,011 parts In-Stock

1+ parts

$53.856

100+ parts

$47.872

1k+ parts

$35.200

10k+ parts

-

1,011

$53.856

$47.872

$35.200

-

Rochester

USA . 1,115 parts In-Stock

1+ parts

-

100+ parts

$50.680

1k+ parts

$45.350

10k+ parts

$42.680

1,115

-

$50.680

$45.350

$42.680

DigiKey

USA . 1,115 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,115

-

-

-

-

Verical

USA . 1,069 parts In-Stock

1+ parts

-

100+ parts

$63.350

1k+ parts

$56.688

10k+ parts

$53.350

1,069

-

$63.350

$56.688

$53.350

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,434 parts In-Stock

1+ parts

$46.446

100+ parts

-

1k+ parts

-

10k+ parts

-

3,434

$46.446

-

-

-

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$52.150

100+ parts

-

1k+ parts

-

10k+ parts

-

100

$52.150

-

-

-

Vyrian

USA . 1,031 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,031

-

-

-

-

Chip Stock

USA . 282 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

282

-

-

-

-

Sensible Micro Corp

USA . 40 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

40

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,020 parts In-Stock

1+ parts

$13.826

100+ parts

-

1k+ parts

$14.311

10k+ parts

-

1,020

$13.826

-

$14.311

-

DigiPath Technology Company

USA . 244 parts In-Stock

1+ parts

$15.224

100+ parts

$14.006

1k+ parts

-

10k+ parts

-

244

$15.224

$14.006

-

-

ChromeModa Solutions

Germany . 3,320 parts In-Stock

1+ parts

$15.535

100+ parts

$12.739

1k+ parts

-

10k+ parts

-

3,320

$15.535

$12.739

-

-

IDEA Electronic Components Group

UK . 475 parts In-Stock

1+ parts

$15.535

100+ parts

$14.758

1k+ parts

$13.982

10k+ parts

-

475

$15.535

$14.758

$13.982

-

Advanced Electronics

New Zealand . 16 parts In-Stock

1+ parts

$35.666

100+ parts

$32.456

1k+ parts

$29.246

10k+ parts

-

16

$35.666

$32.456

$29.246

-

Ampacity Inc.

Singapore . 1,025 parts In-Stock

1+ parts

$41.560

100+ parts

-

1k+ parts

-

10k+ parts

-

1,025

$41.560

-

-

-

Corphita

USA . 2,400 parts In-Stock

1+ parts

$44.001

100+ parts

-

1k+ parts

-

10k+ parts

-

2,400

$44.001

-

-

-

Component Stockers USA

USA . 1,958 parts In-Stock

1+ parts

$49.670

100+ parts

$46.690

1k+ parts

$42.220

10k+ parts

-

1,958

$49.670

$46.690

$42.220

-

Netroflash

USA . 100 parts In-Stock

1+ parts

$52.150

100+ parts

-

1k+ parts

$49.543

10k+ parts

$48.500

100

$52.150

-

$49.543

$48.500

Corohmni

South Africa . 189 parts In-Stock

1+ parts

$84.772

100+ parts

-

1k+ parts

-

10k+ parts

-

189

$84.772

-

-

-

Kepictronics

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,000

-

-

-

-

Perfect Parts

USA . 1,045 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,045

-

-

-

-

Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

-

-

-

-

Futuretech Components

Singapore . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

500

-

-

-

-

EMSNET (Excess)

USA . 20 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

20

-

-

-

-

Overview

Upgrade your electronics with the OMAP3530ECUSA by Texas Instruments, a top-of-the-line microprocessor that delivers unparalleled performance and reliability. Manufactured by the trusted industry leader, this processor is perfect for a wide range of applications, from smartphones to industrial machinery. Experience seamless operation and cutting-edge technology with the OMAP3530ECUSA, providing value and benefits that will exceed your expectations. Trust Texas Instruments to provide you with the best in quality and innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the package lightweight and durable, which is ideal for portable or small electronic devices.

Surface Mount: YES

Surface mount technology allows for easy and reliable installation on the surface of a circuit board, saving space and reducing assembly time.

Power Supplies (V): 1.1,1.2,1.8,1.8/3

The multiple power supply options provide flexibility for different voltage requirements in various applications.

No. of Terminals: 423

The high number of terminals allows for a greater connection density, enabling more functionalities and features in the microprocessor.

Maximum Operating Temperature: 105 °C

The high operating temperature range ensures reliability and performance in various environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for use in cold environments without compromising performance.

Terminal Finish: TIN SILVER COPPER

The terminal finish provides corrosion resistance and ensures a reliable connection over the lifespan of the product.

Width: 16 mm

The compact width allows for space-efficient integration into tight designs or small electronic devices.

Technology: CMOS

CMOS technology offers low power consumption and high speed, making it a suitable choice for energy-efficient and high-performance applications.

Moisture Sensitivity Level (MSL): 4

The moisture sensitivity level indicates the level of protection against moisture, ensuring the reliability and longevity of the microprocessor in humid environments.

Technical Specifications

Microprocessors OMAP3530ECUSA attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B423

JESD-609 Code:

e1

Length:

16 mm

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

423

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA423,24X24,25

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.1,1.2,1.8,1.8/3

Qualification:

Not Qualified

Maximum Seated Height:

1.4 mm

Speed:

720 rpm

Sub-Category:

Graphics Processors

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Trade Compliance

OMAP3530ECUSA Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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