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OMAP3525ECUSA

Texas Instruments

OMAP3525ECUSA by Texas Instruments

OMAP3525ECUSA by Texas Instruments is a microprocessor with 423 terminals in a square package. It operates at temperatures ranging from -40 to 105°C, featuring a speed of 600 rpm and power supplies of 1.1-1.8V. Ideal for industrial applications requiring a low-profile, fine-pitch grid array package style.

Median Price

$48.807

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 985 parts In-Stock

1+ parts

$48.807

100+ parts

$43.384

1k+ parts

$31.900

10k+ parts

-

985

$48.807

$43.384

$31.900

-

Rochester

USA . 31,543 parts In-Stock

1+ parts

-

100+ parts

$45.930

1k+ parts

$41.100

10k+ parts

$38.680

31,543

-

$45.930

$41.100

$38.680

DigiKey

USA . 31,543 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

31,543

-

-

-

-

Verical

USA . 27,546 parts In-Stock

1+ parts

-

100+ parts

$57.413

1k+ parts

$51.375

10k+ parts

$48.350

27,546

-

$57.413

$51.375

$48.350

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 143 parts In-Stock

1+ parts

$42.094

100+ parts

-

1k+ parts

-

10k+ parts

-

143

$42.094

-

-

-

Vyrian

USA . 2,969 parts In-Stock

1+ parts

$44.310

100+ parts

-

1k+ parts

-

10k+ parts

-

2,969

$44.310

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 247 parts In-Stock

1+ parts

$25.398

100+ parts

-

1k+ parts

$26.023

10k+ parts

-

247

$25.398

-

$26.023

-

DigiPath Technology Company

USA . 495 parts In-Stock

1+ parts

$27.966

100+ parts

$25.729

1k+ parts

-

10k+ parts

-

495

$27.966

$25.729

-

-

ChromeModa Solutions

Germany . 6,063 parts In-Stock

1+ parts

$28.537

100+ parts

$23.400

1k+ parts

-

10k+ parts

-

6,063

$28.537

$23.400

-

-

IDEA Electronic Components Group

UK . 1,130 parts In-Stock

1+ parts

$28.537

100+ parts

$27.110

1k+ parts

$25.683

10k+ parts

-

1,130

$28.537

$27.110

$25.683

-

Corphita

USA . 2,878 parts In-Stock

1+ parts

$39.879

100+ parts

-

1k+ parts

-

10k+ parts

-

2,878

$39.879

-

-

-

Microchip USA

USA . 1,065 parts In-Stock

1+ parts

$105.980

100+ parts

$104.140

1k+ parts

$103.220

10k+ parts

$102.300

1,065

$105.980

$104.140

$103.220

$102.300

Overview

Experience the cutting-edge performance and reliability of the OMAP3525ECUSA by Texas Instruments, a leader in microprocessor technology. With a sleek square package design and advanced CMOS technology, this powerful processor offers a wide range of applications in industries such as telecommunications, automotive, and consumer electronics. Trust in the quality and innovation of Texas Instruments to deliver exceptional value, efficiency, and seamless integration with the OMAP3525ECUSA. Upgrade your products with this high-speed, low-profile microprocessor and stay ahead of the competition.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy package is lightweight and durable, making it suitable for various applications while also providing good protection for the microprocessor inside.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and reducing manufacturing costs.

Package Shape: SQUARE

Square shape helps in optimizing space on the PCB and allows for efficient heat dissipation.

Power Supplies (V): 1.1, 1.2, 1.8, 1.8/3

Support for multiple voltage options provides flexibility in design and allows for compatibility with a wide range of system requirements.

No. of Terminals: 423

High number of terminals enable connectivity with other components, peripherals, and interfaces, maximizing the functionality of the microprocessor.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Multiple package styles offer versatility in mounting options and enable the microprocessor to be incorporated into various design configurations.

Maximum Operating Temperature: 105 °C

High maximum operating temperature ensures stable performance even in demanding industrial environments.

Minimum Operating Temperature: -40 °C

Wide temperature range allows the microprocessor to operate reliably in both extreme cold and hot conditions.

Terminal Finish: TIN SILVER COPPER

Tin silver copper finish provides excellent conductivity, corrosion resistance, and solderability for reliable connections.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB layout and routing, making it easier to integrate the microprocessor into the system design.

Maximum Seated Height: 1.4 mm

Low seated height helps in reducing overall system profile and enables compact and slim device designs.

Width: 16 mm

Compact width facilitates efficient placement of the microprocessor on the PCB, optimizing board space and layout.

Maximum Time At Peak Reflow Temperature (s): 30

Short time at peak reflow temperature minimizes thermal stress on the microprocessor during assembly, ensuring the reliability of solder joints.

Peak Reflow Temperature °C: 260

High peak reflow temperature enables lead-free soldering process for RoHS compliance and robust mechanical connections.

Length: 16 mm

Compact length makes the microprocessor suitable for space-constrained applications without compromising on performance.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh environments and industrial applications with stringent temperature requirements.

Peripheral IC Type: MICROPROCESSOR, RISC

RISC architecture enhances processing speed and efficiency, making the microprocessor suitable for high-performance computing tasks.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and reliability, making the microprocessor energy-efficient and suitable for battery-powered devices.

Terminal Form: BALL

Ball terminal form enables high-density interconnects, fine pitch design, and reliable connections, enhancing the overall performance of the microprocessor.

Terminal Pitch: 0.65 mm

Narrow terminal pitch allows for high-density packaging, precise PCB layout, and miniaturization of electronic devices while ensuring signal integrity.

Moisture Sensitivity Level (MSL): 4

MSL 4 indicates that the microprocessor has a moderate sensitivity to moisture, requiring standard handling and storage practices to prevent damage during assembly and operation.

Speed: 600 rpm

High speed of 600 rpm enables quick data processing and efficient multitasking, making the microprocessor suitable for demanding computational tasks.

Technical Specifications

Microprocessors OMAP3525ECUSA attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B423

JESD-609 Code:

e1

Length:

16 mm

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

423

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA423,24X24,25

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.1,1.2,1.8,1.8/3

Qualification:

Not Qualified

Maximum Seated Height:

1.4 mm

Speed:

600 rpm

Sub-Category:

Graphics Processors

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Trade Compliance

OMAP3525ECUSA Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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