Loading...

IBM25PPC970FX5SB101ET

Ibm Microelectronics

IBM25PPC970FX5SB101ET by Ibm Microelectronics

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 576; Package Code: BGA; Package Shape: SQUARE; Package Body Material: CERAMIC, METAL-SEALED COFIRED;

Median Price

-

Lifecycle Status

Suppliers In-Stock

0

In-Stock Inventory

< 1k

Technical Specifications

Microprocessors IBM25PPC970FX5SB101ET attributes and parameters. Explore more Microprocessors devices from Ibm Microelectronics

Specs

Address Bus Width:

44

Bit Size:

64

Boundary Scan:

YES

Maximum Clock Frequency:

300 MHz

External Data Bus Width:

44

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-CBGA-B576

Length:

25 mm

Low Power Mode:

YES

No. of Terminals:

576

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Qualification:

Not Qualified

Maximum Seated Height:

3.137 mm

Speed:

1400 rpm

Maximum Supply Voltage:

1 V

Minimum Supply Voltage:

.9 V

Nominal Supply Voltage:

.95 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

25 mm

Peripheral IC Type:

Trade Compliance

IBM25PPC970FX5SB101ET Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Ibm Microelectronics

This site can’t be reached

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.