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XPC860SRZP66C1

Motorola

XPC860SRZP66C1 by Motorola

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 357; Package Code: BGA; Package Shape: SQUARE; Width: 25 mm;

Median Price

-

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

< 1k

Distributors (In-Stock)

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Bristol Electronics

USA . 132 parts In-Stock

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Dan-Mar Components

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ComSIT Distribution GmbH

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Electronics Depot

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Pegasus Components GmbH

Germany . 39 parts In-Stock

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Component Electronics Inc.

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Lantek

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J2 Sourcing AB

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Mil-Aero Solutions, Inc.

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Prism Electronics

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Odi Ramu Company

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Technical Specifications

Microprocessors XPC860SRZP66C1 attributes and parameters. Explore more Microprocessors devices from Motorola

Specs

Address Bus Width:

32

Bit Size:

32

Maximum Clock Frequency:

66 MHz

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B357

JESD-609 Code:

e0

Length:

25 mm

No. of Terminals:

357

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA357,19X19,50

Package Shape:

Package Style (Meter):

GRID ARRAY

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

2.05 mm

Speed:

66 rpm

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

3.465 V

Minimum Supply Voltage:

3.135 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Width:

25 mm

Peripheral IC Type:

Trade Compliance

XPC860SRZP66C1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Motorola

Motorola Solutions, Inc., is an American video equipment, telecommunications equipment, software, systems and services provider that succeeded Motorola, Inc., following the spinoff of the mobile phone division into Motorola Mobility in 2011. The company is headquartered in Chicago, Illinois.

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