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XAM5748ABZXEA

Texas Instruments

XAM5748ABZXEA by Texas Instruments

XAM5748ABZXEA by Texas Instruments is a Microprocessor with 32-bit External Data Bus, 16-bit Address Bus, and integrated cache. It operates at a max clock frequency of 38.4 MHz and supports low power mode. Ideal for industrial applications requiring high-speed processing in a compact package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,452 parts In-Stock

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3,452

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Digiode

USA . 1,695 parts In-Stock

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1,695

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 833 parts In-Stock

1+ parts

$12.315

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833

$12.315

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One Stop Electronics

USA . 1,041 parts In-Stock

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$31.000

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1,041

$31.000

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Parana Technologies

USA . 1,026 parts In-Stock

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$58.854

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$58.854

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DigiPath Technology Company

USA . 681 parts In-Stock

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$64.805

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681

$64.805

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ChromeModa Solutions

Germany . 1,597 parts In-Stock

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$66.128

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$54.225

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1,597

$66.128

$54.225

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IDEA Electronic Components Group

UK . 1,189 parts In-Stock

1+ parts

$66.128

100+ parts

$62.822

1k+ parts

$59.515

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1,189

$66.128

$62.822

$59.515

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Corphita

USA . 1,961 parts In-Stock

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Overview

Unleash the power of innovation with the XAM5748ABZXEA by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality microprocessors that offer unmatched performance and reliability. Ideal for a wide range of applications, this cutting-edge product provides customers with enhanced speed, efficiency, and capabilities. Say goodbye to limitations and hello to endless possibilities with the XAM5748ABZXEA - the ultimate solution for all your processing needs. Elevate your projects to new heights and experience the true value and benefits that only Texas Instruments can provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and cost-effective.

Integrated Cache: YES

Having an integrated cache enhances the processor's performance by reducing memory latency and increasing data access speed.

Maximum Supply Voltage: 1.2 V

The low maximum supply voltage helps in reducing power consumption and heat generation, making the processor energy-efficient.

Address Bus Width: 16

A wider address bus width allows the processor to access a larger memory space, improving overall performance.

Package Shape: SQUARE

The square package shape offers better space utilization and ease of mounting on circuit boards.

No. of Terminals: 760

Having a high number of terminals provides ample connectivity options for various peripherals and components.

Minimum Supply Voltage: 1.11 V

The low minimum supply voltage ensures stable operation while still maintaining energy efficiency.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature allows the processor to function reliably in harsh industrial environments.

Peripheral IC Type: MICROPROCESSOR, RISC

The RISC architecture of the processor enables efficient and fast data processing, making it suitable for a wide range of applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the reliability and efficiency of the processor.

Nominal Supply Voltage: 1.15 V

The nominal supply voltage provides a balance between power consumption and performance, ensuring optimal operation of the processor.

Low Power Mode: YES

The presence of a low-power mode allows the processor to operate efficiently while conserving energy, ideal for applications requiring power savings.

Technical Specifications

Microprocessors XAM5748ABZXEA attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

16

Boundary Scan:

YES

Maximum Clock Frequency:

38.4 MHz

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B760

Low Power Mode:

YES

No. of Terminals:

760

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Speed:

1500 rpm

Maximum Supply Voltage:

1.2 V

Minimum Supply Voltage:

1.11 V

Nominal Supply Voltage:

1.15 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Position:

BOTTOM

Peripheral IC Type:

Trade Compliance

XAM5748ABZXEA Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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