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XAM5706ACBDJEA

Texas Instruments

XAM5706ACBDJEA by Texas Instruments

XAM5706ACBDJEA by Texas Instruments is a microprocessor with 32-bit external data bus width, operating at up to 38.4 MHz clock frequency. It features a low power mode and industrial temperature grade, making it suitable for applications requiring high-speed processing in harsh environments. The package style is grid array with 538 terminals, ideal for compact designs that demand efficient thermal management.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,314 parts In-Stock

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Digiode

USA . 3,465 parts In-Stock

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3,465

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Distributors (Availability)

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AZTECH Wire

Italy . 607 parts In-Stock

1+ parts

$10.557

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607

$10.557

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Parana Technologies

USA . 365 parts In-Stock

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$21.523

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$21.907

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365

$21.523

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$21.907

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DigiPath Technology Company

USA . 1,877 parts In-Stock

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$23.699

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$23.699

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ChromeModa Solutions

Germany . 2,479 parts In-Stock

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$24.183

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$19.830

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2,479

$24.183

$19.830

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IDEA Electronic Components Group

UK . 796 parts In-Stock

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$24.183

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$22.974

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$21.765

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796

$24.183

$22.974

$21.765

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One Stop Electronics

USA . 467 parts In-Stock

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$31.000

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467

$31.000

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Corphita

USA . 2,332 parts In-Stock

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Overview

Unleash the power of cutting-edge technology with the XAM5706ACBDJEA by Texas Instruments. As a leader in microprocessor manufacturing, Texas Instruments delivers unparalleled quality and reliability. This versatile microprocessor is perfect for a wide range of applications, offering customers exceptional value and performance. From industrial automation to consumer electronics, this product provides the speed, efficiency, and low power consumption needed to take your projects to the next level. Experience the difference with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, making it suitable for portable devices.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly of the product on PCBs, saving space and reducing production costs.

Maximum Supply Voltage: 1.2 V

The low maximum supply voltage helps in reducing power consumption and heat generation, making the product more energy-efficient.

Address Bus Width: 16

The 16-bit address bus width provides sufficient memory addressing capability for a wide range of applications, enhancing the product's versatility.

Package Shape: SQUARE

The square package shape helps in efficient utilization of PCB space, enabling a compact design for the product.

No. of Terminals: 538

The high number of terminals allows for a greater degree of connectivity and functionality in the product, catering to diverse application requirements.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, and fine pitch package style offers enhanced signal integrity, thermal performance, and miniaturization for the product.

Minimum Supply Voltage: 1.11 V

The low minimum supply voltage ensures reliable operation even at low power levels, making the product suitable for battery-powered devices.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature range ensures the product can withstand harsh environmental conditions, enhancing its durability and reliability.

Minimum Operating Temperature: -40 °C

The wide minimum operating temperature range enables the product to function in extreme cold conditions, increasing its usability in various environments.

Terminal Position: BOTTOM

The bottom terminal position facilitates easy and secure mounting of the product on the PCB, ensuring stable connectivity and efficient heat dissipation.

Maximum Seated Height: 1.298 mm

The low maximum seated height allows for a compact design of the product, enabling slim and sleek devices to be built around it.

Width: 17 mm

The compact width of the product makes it suitable for space-constrained applications, where miniaturization is a key requirement.

Boundary Scan: YES

The boundary scan feature enables efficient testing and debug capabilities for the product, enhancing its reliability and ease of use during manufacturing.

External Data Bus Width: 32

The wide 32-bit external data bus width allows for high-speed data transfer and processing, improving overall system performance.

Maximum Clock Frequency: 38.4 MHz

The high maximum clock frequency enables rapid execution of instructions, making the product suitable for demanding real-time applications.

Length: 17 mm

The compact length of the product contributes to its overall small form factor, enabling the design of sleek and portable devices.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures the product can operate reliably in harsh industrial environments, making it suitable for rugged applications.

Peripheral IC Type: MICROPROCESSOR, RISC

The RISC microprocessor architecture offers efficient and optimized performance for a wide range of computing tasks, enhancing the product's processing capabilities.

Technology: CMOS

The CMOS technology used in the product provides low power consumption and high noise immunity, making it an energy-efficient and reliable choice for various applications.

Terminal Form: BALL

The ball terminal form ensures secure and reliable connections, reducing the risk of signal interference or disconnection in the product.

Nominal Supply Voltage: 1.15 V

The nominal supply voltage provides a balanced performance with respect to power efficiency and processing speed, making the product suitable for a wide range of applications.

Terminal Pitch: 0.65 mm

The fine terminal pitch allows for high-density mounting of the product, enabling a compact layout on the PCB and efficient use of space.

Format: FLOATING POINT

The floating-point format enhances the product's ability to perform complex mathematical calculations with high precision and accuracy, making it suitable for scientific and computational applications.

Speed: 1000 rpm

The high-speed capability of the product enables rapid data processing and execution of tasks, making it ideal for time-sensitive applications requiring quick responses.

Low Power Mode: YES

The low power mode feature allows the product to operate in an energy-efficient manner, conserving battery life and reducing overall power consumption.

Technical Specifications

Microprocessors XAM5706ACBDJEA attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

16

Boundary Scan:

YES

Maximum Clock Frequency:

38.4 MHz

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B538

Length:

17 mm

Low Power Mode:

YES

No. of Terminals:

538

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Maximum Seated Height:

1.298 mm

Speed:

1000 rpm

Maximum Supply Voltage:

1.2 V

Minimum Supply Voltage:

1.11 V

Nominal Supply Voltage:

1.15 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Width:

17 mm

Peripheral IC Type:

Trade Compliance

XAM5706ACBDJEA Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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