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XAM5728AABCXE

Texas Instruments

XAM5728AABCXE by Texas Instruments

XAM5728AABCXE by Texas Instruments is a Microprocessor with 32-bit External Data Bus, 16-bit Address Bus, and 38.4 MHz Max Clock Frequency. Ideal for low power applications in consumer electronics, automotive systems, and industrial automation due to its CMOS technology and floating point format.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,890 parts In-Stock

1+ parts

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2,890

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Vyrian

USA . 2,615 parts In-Stock

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2,615

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Distributors (Availability)

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One Stop Electronics

USA . 578 parts In-Stock

1+ parts

$4.000

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578

$4.000

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AZTECH Wire

Italy . 426 parts In-Stock

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$6.765

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426

$6.765

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Parana Technologies

USA . 431 parts In-Stock

1+ parts

$64.200

100+ parts

$5,961.958

1k+ parts

$57.780

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431

$64.200

$5,961.958

$57.780

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DigiPath Technology Company

USA . 976 parts In-Stock

1+ parts

$70.692

100+ parts

$65.037

1k+ parts

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976

$70.692

$65.037

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ChromeModa Solutions

Germany . 5,939 parts In-Stock

1+ parts

$72.135

100+ parts

$59.151

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5,939

$72.135

$59.151

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IDEA Electronic Components Group

UK . 1,753 parts In-Stock

1+ parts

$72.135

100+ parts

$68.528

1k+ parts

$64.922

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1,753

$72.135

$68.528

$64.922

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Corphita

USA . 3,610 parts In-Stock

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3,610

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Microchip USA

USA . 217 parts In-Stock

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217

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Overview

Experience the power and efficiency of the XAM5728AABCXE by Texas Instruments, a cutting-edge microprocessor that offers unparalleled performance and reliability. Manufactured by a trusted industry leader, this microprocessor is perfect for a wide range of applications, from consumer electronics to industrial automation. With advanced features and innovative technology, this product delivers exceptional value and benefits to customers looking for high-quality components. Upgrade your projects with the XAM5728AABCXE and elevate your performance to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the microprocessor easy to handle and resistant to damage.

Surface Mount: YES

Surface-mount technology allows for easy and efficient installation on circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage: 1.2 V

The low maximum supply voltage helps to minimize power consumption and heat generation, making the microprocessor energy-efficient.

Address Bus Width: 16

A wider address bus allows for faster data transfer and processing, improving overall performance.

No. of Terminals: 760

Having a large number of terminals provides plenty of connectivity options and flexibility for integration into various systems.

Minimum Operating Temperature: 0 °C

The ability to operate at low temperatures ensures reliable performance even in challenging environmental conditions.

Maximum Clock Frequency: 38.4 MHz

A high clock frequency enables rapid data processing and execution of instructions, making the microprocessor suitable for demanding applications.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a Reduced Instruction Set Computing (RISC) microprocessor type, it offers simplified instructions for efficient and fast processing of data.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor (CMOS) technology provides low power consumption and high noise immunity, enhancing the efficiency of the microprocessor.

Speed: 1500 rpm

The high speed of operation allows for quick data processing and responsiveness, making the microprocessor ideal for high-performance computing tasks.

Technical Specifications

Microprocessors XAM5728AABCXE attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

16

Boundary Scan:

YES

Maximum Clock Frequency:

38.4 MHz

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B760

JESD-609 Code:

e1

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

760

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

250

Maximum Seated Height:

2.55 mm

Speed:

1500 rpm

Maximum Supply Voltage:

1.2 V

Minimum Supply Voltage:

1.11 V

Nominal Supply Voltage:

1.15 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

23 mm

Peripheral IC Type:

Trade Compliance

XAM5728AABCXE Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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