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CP3BT26G18NEP/NOPB

Texas Instruments

CP3BT26G18NEP/NOPB by Texas Instruments

CP3BT26G18NEP/NOPB by Texas Instruments is a 16-bit microprocessor with 23-bit address bus width, operating at 2.25-2.75V. Ideal for industrial applications, it features ROM words of 262144, RAM bytes of 32768, and operates in low power mode at speeds up to 24 rpm.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,480 parts In-Stock

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5,480

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Digiode

USA . 1,097 parts In-Stock

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1,097

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Anansix

USA . 1,043 parts In-Stock

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1,043

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Distributors (Availability)

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AZTECH Wire

Italy . 845 parts In-Stock

1+ parts

$18.935

100+ parts

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845

$18.935

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One Stop Electronics

USA . 430 parts In-Stock

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$32.000

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430

$32.000

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Parana Technologies

USA . 730 parts In-Stock

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$66.994

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730

$66.994

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ChromeModa Solutions

Germany . 3,754 parts In-Stock

1+ parts

$75.274

100+ parts

$61.725

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3,754

$75.274

$61.725

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IDEA Electronic Components Group

UK . 622 parts In-Stock

1+ parts

$75.274

100+ parts

$71.510

1k+ parts

$67.747

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622

$75.274

$71.510

$67.747

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Component Stockers USA

USA . 659 parts In-Stock

1+ parts

$99.990

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659

$99.990

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Native Components

USA . 28 parts In-Stock

1+ parts

$647.340

100+ parts

$634.393

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$627.920

10k+ parts

$621.446

28

$647.340

$634.393

$627.920

$621.446

Northwest PG Solutions

USA . 2,210 parts In-Stock

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$712.074

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2,210

$712.074

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Corphita

USA . 2,550 parts In-Stock

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2,550

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DigiPath Technology Company

USA . 1,357 parts In-Stock

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$67.867

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1,357

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$67.867

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Microchip USA

USA . 428 parts In-Stock

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428

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Overview

Unleash the power of cutting-edge technology with the CP3BT26G18NEP/NOPB microprocessor by Texas Instruments. Designed with precision and expertise, this high-quality product offers unparalleled performance and reliability for a wide range of applications. Whether you're looking to enhance your industrial processes or streamline your consumer electronics, this microprocessor delivers seamless operation and efficiency. Trust in Texas Instruments to provide innovative solutions that elevate your products to the next level. Experience the difference with the CP3BT26G18NEP/NOPB - where quality meets excellence.

Feature Benefit Bullets

Package Body Material PLASTIC/EPOXY

This material provides a good balance between durability and cost-effectiveness, making the product suitable for a wide range of applications.

Surface Mount YES

Being surface mountable allows for easier and more efficient PCB assembly, saving time and reducing production costs.

Maximum Supply Voltage 2.75 V

This voltage range is suitable for low power applications, contributing to energy efficiency and potentially longer battery life.

Address Bus Width 23

The wide address bus width allows for efficient memory addressing and data access, improving overall performance.

Package Shape RECTANGULAR

The rectangular shape is space-efficient and easy to integrate into various system designs.

Bit Size 16

The 16-bit architecture provides a good balance between performance and complexity, suitable for a wide range of applications.

Power Supplies (V) 2.5,2.5/3.3

The multiple power supply options provide flexibility in voltage requirements, making the product versatile and compatible with different systems.

No. of Terminals 128

The high number of terminals allows for more connectivity options and integration with other components, enhancing overall functionality.

Package Style (Meter) FLATPACK, LOW PROFILE, FINE PITCH

The package styles offer different form factors and mounting options, making it easier to fit the product into various system configurations.

Minimum Supply Voltage 2.25 V

The low minimum supply voltage allows for operation in low power situations while maintaining stability and performance.

Maximum Operating Temperature 85 °C

The high operating temperature range ensures reliability and performance in various environmental conditions.

CPU Family CR16C

The specific CPU family offers optimized performance and features for specific applications, ensuring efficient operation.

Minimum Operating Temperature -40 °C

The low minimum operating temperature allows for reliable operation even in extreme cold environments.

Terminal Position QUAD

The quad terminal position provides stable and secure connections, reducing the risk of disconnections or signal interference.

ROM Words 262144

The large ROM capacity allows for storing a significant amount of program data and instructions, enabling complex functionalities.

Maximum Seated Height 1.6 mm

The low seated height makes the product suitable for compact designs where space is limited.

Width 14 mm

The compact width allows for easy integration into tight spaces or small form factor devices.

Boundary Scan YES

The boundary scan feature allows for efficient testing and debugging of the product, improving overall reliability and maintenance.

External Data Bus Width 16

The 16-bit external data bus width enables faster data transfer speeds and improved system performance.

Maximum Time At Peak Reflow Temperature (s) 30

The short reflow time reduces the risk of heat damage during assembly, ensuring product reliability.

Peak Reflow Temperature °C 260

The high peak reflow temperature allows for efficient soldering and assembly processes, ensuring strong and reliable connections.

Length 20 mm

The compact length makes the product suitable for space-constrained applications without sacrificing performance.

Temperature Grade INDUSTRIAL

The industrial temperature grade ensures reliable operation in rugged environments with varying temperature conditions.

Peripheral IC Type MICROPROCESSOR, RISC

The RISC architecture offers efficient and streamlined processing, making the product suitable for high-performance applications.

RAM Bytes 32768

The high RAM capacity allows for efficient data storage and processing, enabling complex computations and multitasking.

Technology CMOS

The CMOS technology offers low power consumption and high speed, making the product energy efficient and reliable.

Terminal Form GULL WING

The gull wing terminal form provides secure connections and easy soldering, ensuring reliable operation and assembly.

Maximum Supply Current 20 mA

The low supply current requirement contributes to energy efficiency and extended battery life in portable devices.

Nominal Supply Voltage 2.5 V

The stable nominal supply voltage ensures consistent and reliable operation in various conditions.

ROM Programmability FLASH

The flash ROM programmability allows for easy and fast updates and modifications to the program data, improving flexibility and usability.

Terminal Pitch 0.5 mm

The small terminal pitch enables high-density mounting and connections, making the product suitable for compact designs.

Format FIXED POINT

The fixed-point format simplifies arithmetic operations and improves efficiency in certain applications like signal processing.

Moisture Sensitivity Level (MSL) 3

The moderate moisture sensitivity level allows for safe handling and storage of the product in typical manufacturing environments.

Speed 24 rpm

The 24 rpm speed rating indicates the processing capabilities of the product, suitable for various real-time and high-speed applications.

Low Power Mode YES

The low power mode feature enables energy-efficient operation and extends battery life in portable devices.

Technical Specifications

Microprocessors CP3BT26G18NEP/NOPB attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

23

Bit Size:

16

Boundary Scan:

YES

CPU Family:

CR16C

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PQFP-G128

Length:

20 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

128

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP128,.63X.87,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

24 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

20 mA

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

CP3BT26G18NEP/NOPB Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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