Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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CP3BT26G18NEP/NOPB by Texas Instruments is a 16-bit microprocessor with 23-bit address bus width, operating at 2.25-2.75V. Ideal for industrial applications, it features ROM words of 262144, RAM bytes of 32768, and operates in low power mode at speeds up to 24 rpm.
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This material provides a good balance between durability and cost-effectiveness, making the product suitable for a wide range of applications.
Being surface mountable allows for easier and more efficient PCB assembly, saving time and reducing production costs.
This voltage range is suitable for low power applications, contributing to energy efficiency and potentially longer battery life.
The wide address bus width allows for efficient memory addressing and data access, improving overall performance.
The rectangular shape is space-efficient and easy to integrate into various system designs.
The 16-bit architecture provides a good balance between performance and complexity, suitable for a wide range of applications.
The multiple power supply options provide flexibility in voltage requirements, making the product versatile and compatible with different systems.
The high number of terminals allows for more connectivity options and integration with other components, enhancing overall functionality.
The package styles offer different form factors and mounting options, making it easier to fit the product into various system configurations.
The low minimum supply voltage allows for operation in low power situations while maintaining stability and performance.
The high operating temperature range ensures reliability and performance in various environmental conditions.
The specific CPU family offers optimized performance and features for specific applications, ensuring efficient operation.
The low minimum operating temperature allows for reliable operation even in extreme cold environments.
The quad terminal position provides stable and secure connections, reducing the risk of disconnections or signal interference.
The large ROM capacity allows for storing a significant amount of program data and instructions, enabling complex functionalities.
The low seated height makes the product suitable for compact designs where space is limited.
The compact width allows for easy integration into tight spaces or small form factor devices.
The boundary scan feature allows for efficient testing and debugging of the product, improving overall reliability and maintenance.
The 16-bit external data bus width enables faster data transfer speeds and improved system performance.
The short reflow time reduces the risk of heat damage during assembly, ensuring product reliability.
The high peak reflow temperature allows for efficient soldering and assembly processes, ensuring strong and reliable connections.
The compact length makes the product suitable for space-constrained applications without sacrificing performance.
The industrial temperature grade ensures reliable operation in rugged environments with varying temperature conditions.
The RISC architecture offers efficient and streamlined processing, making the product suitable for high-performance applications.
The high RAM capacity allows for efficient data storage and processing, enabling complex computations and multitasking.
The CMOS technology offers low power consumption and high speed, making the product energy efficient and reliable.
The gull wing terminal form provides secure connections and easy soldering, ensuring reliable operation and assembly.
The low supply current requirement contributes to energy efficiency and extended battery life in portable devices.
The stable nominal supply voltage ensures consistent and reliable operation in various conditions.
The flash ROM programmability allows for easy and fast updates and modifications to the program data, improving flexibility and usability.
The small terminal pitch enables high-density mounting and connections, making the product suitable for compact designs.
The fixed-point format simplifies arithmetic operations and improves efficiency in certain applications like signal processing.
The moderate moisture sensitivity level allows for safe handling and storage of the product in typical manufacturing environments.
The 24 rpm speed rating indicates the processing capabilities of the product, suitable for various real-time and high-speed applications.
The low power mode feature enables energy-efficient operation and extends battery life in portable devices.
Microprocessors CP3BT26G18NEP/NOPB attributes and parameters. Explore more Microprocessors devices from Texas Instruments
Address Bus Width:
Bit Size:
Boundary Scan:
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External Data Bus Width:
Format:
Integrated Cache:
JESD-30 Code:
Length:
Low Power Mode:
Moisture Sensitivity Level (MSL):
No. of Terminals:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
Package Code:
Package Equivalence Code:
Package Shape:
Package Style (Meter):
Peak Reflow Temperature (C):
Power Supplies (V):
Qualification:
RAM Bytes:
ROM Words:
ROM Programmability:
Maximum Seated Height:
Speed:
Sub-Category:
Maximum Supply Current:
Maximum Supply Voltage:
Minimum Supply Voltage:
Nominal Supply Voltage:
Surface Mount:
Technology:
Temperature Grade:
Terminal Form:
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Maximum Time At Peak Reflow Temperature (s):
Width:
Peripheral IC Type:
CP3BT26G18NEP/NOPB Peripheral ICs trade compliance attributes, and parameters.
HTS
8542.31.00.01
SB
8542.31.00.00
Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.
President, CEO
Haviv Ilan
Chairman
Richard K. Templeton
Senior VP, CFO
Rafael R. Lizardi
M - Fab
Fabrication
Fab Initiation
1997
USA
South Portland
Wafer Capacity
32,000
D - FAB
1966
Dallas
42,000
D MOS - 6
2002
25,000
D MOS - 5
1995
75,000
Miho - 8
1980
Japan
Inashiki
43,000
S FAB 1
Sherman
91,000
F - FAB
2001
Germany
Freising
37,000
R Fab 1
2010
Richardson
40,000
D HC Line
1999
2,000
JV3
Aizu Wakamatsu
45,000
C - FAB
2007
China
Chengdu
30,000
L - Fab
2015
Lehi
70,000
R - Fab 2
2022
S - FAB 2
2025
S - FAB 3
2028
SMBJ18CA
Forward International Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Nominal Breakdown Voltage: 21.05 V; Maximum Clamping Voltage: 29.2 V; Maximum Repetitive Peak Reverse Voltage: 18 V; Polarity: BIDIRECTIONAL;
2N2222A
Cobham Plc
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Collector Current (IC): .8 A; Minimum DC Current Gain (hFE): 100; Maximum Turn Off Time (toff): 300 ns;
C0603C104K5RACTU
KEMET Corporation
KEMET C0603C104K5RACTU is a ceramic capacitor with 0.1uF capacitance and 50V URdc. It has X7R temperature characteristics, -55 to 125 °C operating range, and ±10% tolerance. Ideal for SMT applications requiring compact size and reliable performance in various electronic circuits.
Continental Device India
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
SS495ASP
Micro Switch
The Micro Switch SS495ASP is an analog circuit IC with a supply voltage range of 4.5V to 10.5V, suitable for automotive applications. Its package body material is plastic/epoxy, and it has a rectangular shape with three terminals. Operating temperature ranges from -40°C to 125°C, making it ideal for various automotive sensor and control systems.
2N7002
Vishay Intertechnology
2N7002 by Vishay Intertechnology is a N-CHANNEL FET with 60V DS Breakdown Voltage, 0.115A Drain Current, and 7.5 ohm On Resistance. Ideal for SWITCHING applications due to its SINGLE configuration with BUILT-IN DIODE. Operates in ENHANCEMENT MODE, suitable for surface mount with GULL WING terminals.
LM555CN
Texas Instruments
LM555CN by Texas Instruments is an Analog Waveform Generation IC with a supply voltage range of 4.5V to 16V. It operates b/w 0°C to 70°C, making it suitable for commercial applications. This rectangular package IC has dual terminals and uses bipolar technology for pulse generation in various electronic circuits.
Sensitron Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
OHN3140U
Optek Technology
MAGNETIC FIELD SENSOR,HALL EFFECT; Mounting Feature: THROUGH HOLE MOUNT; No. of Terminals: 3; Output Type: ANALOG CURRENT; Package Shape or Style: RECTANGULAR; Output Range: 25mA;
LM317T
Onsemi
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Terminal Form: THROUGH-HOLE; JESD-30 Code: R-PSFM-T3; Adjustability: ADJUSTABLE; Package Equivalence Code: SIP3,.1TB;
LM358N
Silicon Group
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
1N4148
Philips Semiconductors
RECTIFIER DIODE; Surface Mount: NO; Terminal Finish: MATTE TIN; Maximum Operating Temperature: 200 Cel; Maximum Output Current: .15 A; JESD-609 Code: e3;
RECTIFIER DIODE; Surface Mount: NO; Maximum Output Current: .15 A; Maximum Reverse Recovery Time: .004 us; Maximum Operating Temperature: 200 Cel; No. of Phases: 1;
M24308/2-1F
Souriau-sunbank Connection Technologies
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Body Length: 1.228 inch; Mounting Type: CABLE AND PANEL; Termination Type: CRIMP;
BSS84-7-F
SPC TECHNOLOGY/ MULTICOMP
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Package Shape: RECTANGULAR; Transistor Element Material: SILICON;
Uniohm
BSS138
Weitron Technology
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .225 W; Terminal Form: GULL WING; Terminal Position: DUAL;
MBR0520LT1G
MBR0520LT1G by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.385V and output current of 0.5A. It operates b/w -65°C to 125°C, has a peak reflow temperature of 260°C, and a repetitive peak reverse voltage of 20V. This diode is ideal for applications requiring high-speed switching in compact electronic devices.
Space Power Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
Diotec Electronics
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
P1010NXE5FFB
NXP Semiconductors
The NXP Semiconductors P1010NXE5FFB microprocessor features a 32-bit external data bus width, 16-bit address bus width, and integrated cache. Ideal for industrial applications, it operates at speeds up to 667 rpm with a temperature range of -40 to 105°C.
DM388AAAR11F
Texas Instruments DM388AAAR11F microprocessor features 32-bit architecture, 609 terminals, and 655360 RAM words. With a clock frequency of 30 MHz, it is suitable for applications requiring high-speed processing such as embedded systems and IoT devices. The processor's low power mode and integrated cache make it ideal for energy-efficient designs in various industries.
ATSAMA5D21C-CU
Microchip Technology
ATSAMA5D21C-CU by Microchip Technology is a 32-bit microprocessor with 131072 RAM words, 24 MHz clock frequency, and 196 terminals. It is ideal for industrial applications requiring low power mode, floating-point format, and boundary scan capability.
DM3730CUS100
DM3730CUS100 by Texas Instruments is a 32-bit microprocessor with integrated cache and 26-bit address bus width. It operates at a max clock frequency of 54 MHz, suitable for low power applications in various industries like automotive and industrial automation. The package style is grid array, low profile, fine pitch with a terminal pitch of 0.65 mm.
AM6442BSDGGAALV
AM6442BSDGGAALV by Texas Instruments is a Microprocessor with 64-bit architecture, 16-bit data RAM width, and 25 MHz clock frequency. It is ideal for applications requiring high-speed processing and low power consumption, such as embedded systems, IoT devices, and industrial automation.
MPC880ZP133
Freescale Semiconductor
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 357; Package Code: BGA; Package Shape: SQUARE; JESD-609 Code: e0;
MPC8377VRAGDA
The NXP Semiconductors MPC8377VRAGDA microprocessor features a 32-bit architecture with integrated cache and 64-bit external data bus width. It operates at speeds up to 400 rpm, suitable for low power mode applications. With a max supply voltage of 1.05 V and boundary scan capability, it is ideal for high-performance embedded systems requiring efficient processing.
MCF5307AI66B
NXP Semiconductors' MCF5307AI66B microprocessor features 32-bit address and external data bus width, with a max clock frequency of 33.33 MHz. Ideal for commercial applications, it offers integrated cache, low power mode, and operates at temperatures ranging from 0 to 70°C.
MPC852TVR100A
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; Package Equivalence Code: BGA256,16X16,50;
XAM6234ATCGGAALW
XAM6234ATCGGAALW by Texas Instruments is a 64-bit microprocessor with 8-bit on-chip data RAM and 16-bit external data bus width. It operates at a max clock frequency of 26 MHz, suitable for low power mode applications in various devices due to its CMOS technology and integrated cache feature. The package style is grid array with very thin profile, making it ideal for compact designs requiring high processing speeds.
MC7455ARX1000LG
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 483; Package Code: BGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY;
ATSAMA5D31A-CUR
Atmel
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 324; Package Code: LFBGA; Package Shape: SQUARE;
MPC8270CZUQLDA
The NXP Semiconductors MPC8270CZUQLDA microprocessor features a 32-bit address bus width, 64-bit external data bus width, and max clock frequency of 83.33 MHz. It is commonly used in applications requiring high-speed processing and integrated cache memory for improved performance.
MCIMX537CVP8C2
MCIMX537CVP8C2 by NXP Semiconductors is a 32-bit microprocessor with 147456 RAM words, 27 MHz clock frequency, and 1.15 V max supply voltage. Ideal for automotive applications due to its RISC technology, floating-point format, and low power mode capabilities.
FS32R372SCK0MMMT
MICROPROCESSOR, RISC; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260;
MCF54451CVM180
NXP Semiconductors' MCF54451CVM180 microprocessor features 32-bit address and external data bus width, with a max clock frequency of 60 MHz. Ideal for industrial applications, it operates at temperatures ranging from -40 to 85 °C and offers low power mode for efficient performance.
AM3359BZCZA80
AM3359BZCZA80 by Texas Instruments is a 32-bit microprocessor with 8-bit RAM width and 28-bit address bus. It operates at a max clock frequency of 26 MHz, suitable for industrial applications requiring low power mode and boundary scan capability. The package style is grid array with a terminal pitch of 0.8 mm, making it ideal for compact designs in harsh environments.
APQ-8016E-1-760NSP-TR-01-0
Qualcomm
Qualcomm's APQ-8016E-1-760NSP-TR-01-0 microprocessor features 760 terminals, operates b/w -30 to 60 °C, and has a peak reflow temp of 255C. Ideal for applications requiring a CMOS RISC processor with a very thin profile and fine pitch grid array package style.
MIMXRT595SFFOCR
MICROPROCESSOR, RISC; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260;
AM3352BZCZ30
AM3352BZCZ30 by Texas Instruments is a 32-bit microprocessor with integrated cache and 131072 RAM words. It features a max clock frequency of 26 MHz, suitable for low power mode applications. With a package style of grid array and terminal finish of tin silver copper, it is ideal for peripheral IC type microprocessor RISC technology.
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DRV8316RRGFR
DRV8316RRGFR by Texas Instruments is a motion control IC with a rectangular package and a terminal form of gull wing. It has a max output current of 8A and can operate at temperatures ranging from -40 to 125°C. This IC is commonly used as a brushless DC motor controller in automotive applications.
UCC27284DRCR
UCC27284DRCR by Texas Instruments is a MOSFET gate driver with 2 channels, capable of handling a max output current of 3.5A. It operates in automotive-grade temperatures (-40 to 125°C) and has a turn-on/off time of 30µs. This chip carrier package with very thin profile is suitable for high side driver applications requiring fast switching speeds.
CC2662R1FTWRGZRQ1
CC2662R1FTWRGZRQ1 by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU, 48 MHz clock frequency, and 81920 bytes of RAM. Ideal for industrial applications, it features 8 ADC channels, 32 DMA channels, and peripherals like AES and PWM for efficient system integration.
DRV3255EPAPRQ1
DRV3255EPAPRQ1 by Texas Instruments is a Motion Control IC with 64 terminals, operating at -40 to 150°C. It is an AEC-Q100 compliant automotive-grade IC for Brushless DC Motor control, supporting supply voltages from 5V to 90V and output currents up to 3.5A. The package style includes a flatpack with heat sink/slug, suitable for surface mount applications in automotive systems.
DS160PT801ACBR
DS160PT801ACBR by Texas Instruments is a bus controller IC with 339 terminals, operating at -40 to 85°C. It supports PCI bus compatibility with a data transfer rate of 2000 MBps. This CMOS technology device has a thin profile and fine pitch package suitable for industrial applications.
TPS7A4301DGQR
TPS7A4301DGQR by Texas Instruments is an adjustable positive single output LDO regulator with a max output voltage of 14.5V and a dropout voltage of 0.6V. It operates in temperatures ranging from -40 to 125°C, making it suitable for various applications requiring precise voltage regulation in compact spaces.
LMR43610MSC3RPERQ1
LMR43610MSC3RPERQ1 by Texas Instruments is a 9-terminal switching regulator with a max output voltage of 32V and max output current of 1A. Ideal for automotive applications, it operates b/w -40 to 150°C, featuring a buck switcher config and PWM control mode at up to 2200kHz frequency.
CP3BT26Y98ADK/NOPB
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE;
CP3BT26Y98ADKX/NOPB
CP3BT26Y98ACKX/NOPB
CP3BT10K38Y
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: QCCN; Package Shape: SQUARE;
CP3BT26G18ABKX/NOPB
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 128; Package Code: LFQFP; Package Shape: RECTANGULAR;
CP3BT26Y98ACK/NOPB
CP3BT23Y98AWM/NOPB
CP3BT23Y98AWMX/NOPB
CP3BT10G38X
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 100; Package Code: LFQFP; Package Shape: SQUARE;
CP3BT26G18AWM/NOPB
CP3BT23G18AWM/NOPB
CP3BT26G18AWMX/NOPB
CP3BT26Y98AAD/NOPB
CP3BT23G18NEP/NOPB
CP3BT10K38X
CP3BT10G38
CP3BT10K38/NOPB
MICROPROCESSOR, RISC; Peak Reflow Temperature (C): 260; Technology: CMOS; Moisture Sensitivity Level (MSL): 4; Maximum Time At Peak Reflow Temperature (s): 30;
CP3BT23G18AWMX/NOPB
CP3BT26G18NEPX/NOPB
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