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CP3BT26G18NEPX/NOPB

Texas Instruments

CP3BT26G18NEPX/NOPB by Texas Instruments

CP3BT26G18NEPX/NOPB by Texas Instruments is a 16-bit microprocessor with 23-bit address bus width, operating at temperatures from -40 to 85°C. It features ROM words of 262144 and RAM bytes of 32768, suitable for industrial applications requiring low power consumption and high-speed processing. With a max supply voltage of 2.75V, it offers boundary scan capability and flash ROM programmability in a compact package style ideal for surface mount assembly.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 9,039 parts In-Stock

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Digiode

USA . 4,295 parts In-Stock

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4,295

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Anansix

USA . 334 parts In-Stock

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334

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Distributors (Availability)

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Native Components

USA . 162 parts In-Stock

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$1.980

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162

$1.980

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Northwest PG Solutions

USA . 218 parts In-Stock

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$2.178

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$2.178

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Parana Technologies

USA . 2,074 parts In-Stock

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$13.311

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$13.818

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DigiPath Technology Company

USA . 1,091 parts In-Stock

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$14.657

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$13.484

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$14.657

$13.484

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AZTECH Wire

Italy . 384 parts In-Stock

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$14.735

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ChromeModa Solutions

Germany . 4,317 parts In-Stock

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$14.956

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$12.264

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IDEA Electronic Components Group

UK . 283 parts In-Stock

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$14.956

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$14.208

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$13.460

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One Stop Electronics

USA . 255 parts In-Stock

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$15.000

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QUARKTWIN TECHNOLOGY LTD

USA . 27,141 parts In-Stock

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Microchip USA

USA . 4,476 parts In-Stock

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Corphita

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Overview

Experience the ultimate in performance and reliability with the CP3BT26G18NEPX/NOPB microprocessor by Texas Instruments. As a leader in cutting-edge technology, Texas Instruments has crafted this processor to deliver seamless operation and unparalleled efficiency in a wide range of applications. From industrial automation to consumer electronics, this microprocessor offers unmatched value, benefits, and advantages to customers seeking top-notch quality and innovation. Upgrade your devices today with the CP3BT26G18NEPX/NOPB and experience a new level of excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight, durable, and cost-effective, making the product suitable for various applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, saving space and increasing reliability.

Maximum Supply Voltage: 2.75 V

The lower maximum supply voltage helps in reducing power consumption and heat generation, contributing to energy efficiency.

Address Bus Width: 23

A wider address bus allows for efficient memory addressing, improving overall performance and data handling capabilities.

Package Shape: RECTANGULAR

Rectangular package shape is easy to handle and integrate into existing designs, providing versatility and compatibility.

Bit Size: 16

Having a 16-bit architecture enables the processor to handle larger chunks of data at once, enhancing processing speed and efficiency.

Power Supplies (V): 2.5,2.5/3.3

Having multiple power supply options allows for flexibility in different operating scenarios, ensuring stable power delivery.

No. of Terminals: 128

The higher number of terminals facilitates better connectivity and signal transfer between the processor and other components in the system.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The variety of package styles offers different form factors for integration, catering to diverse requirements and space constraints.

Minimum Supply Voltage: 2.25 V

The lower minimum supply voltage ensures the processor's stability and operation under varying voltage conditions, enhancing reliability.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the processor can withstand harsh environmental conditions and maintain performance in demanding applications.

CPU Family: CR16C

Belonging to the CR16C family indicates a proven track record of reliable performance, compatibility, and support for various software applications.

Minimum Operating Temperature: -40 °C

The wide operating temperature range allows the processor to function in extreme cold conditions, making it suitable for rugged environments.

Terminal Position: QUAD

Quad terminal position offers secure connections and efficient signal routing, ensuring stable performance and reduced signal interference.

ROM Words: 262144

Having a large ROM capacity provides ample storage for firmware, software programs, and data, enabling complex applications to run smoothly.

Width: 14 mm

The compact width of the processor allows for space-saving integration in tight layouts or small devices, maximizing design flexibility.

Boundary Scan: YES

Boundary scan capability simplifies testing, debugging, and production processes, enhancing quality control and overall product reliability.

External Data Bus Width: 16

Having a 16-bit external data bus facilitates efficient data transfer between the processor and external memory or devices, improving system performance.

Maximum Time At Peak Reflow Temperature (s): 30

The specified reflow time ensures proper soldering and handling during manufacturing processes, preventing damage to the processor.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance indicates the processor's robust construction and reliability under thermal stress during assembly.

Length: 20 mm

The moderate length of the processor allows for efficient placement on circuit boards and compatibility with standard mounting configurations.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, the processor can withstand harsh operating conditions, including temperature variations and environmental hazards.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a RISC-based microprocessor offers advantages such as simplified instruction set, high performance, and energy efficiency in processing tasks.

RAM Bytes: 32768

Having a substantial RAM capacity allows for efficient data storage, retrieval, and processing, improving multitasking and overall system performance.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and noise immunity, making the processor energy-efficient and reliable for various applications.

Terminal Form: GULL WING

Gull wing terminal form provides secure soldering connections and mechanical strength, ensuring robust electrical connectivity in the system.

Maximum Supply Current: 20 mA

The low maximum supply current requirement indicates low power consumption, extending battery life and reducing overall energy costs.

Nominal Supply Voltage: 2.5 V

A stable nominal supply voltage ensures consistent performance and reliability of the processor in different operating conditions.

ROM Programmability: FLASH

Flash ROM programmability allows for easy firmware updates, software modifications, and customization, enhancing the processor's versatility and adaptability.

Terminal Pitch: 0.5 mm

Having a fine terminal pitch enables compact design, high-density packaging, and seamless integration of the processor in space-constrained applications.

Format: FIXED POINT

Fixed-point format simplifies arithmetic operations and improves computational efficiency, making the processor suitable for real-time processing tasks.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates moderate moisture sensitivity, requiring standard handling procedures during manufacturing and storage to prevent damage.

Speed: 24 rpm

The specified speed rating denotes the processor's processing capabilities in executing instructions, calculations, and data manipulation tasks efficiently.

Low Power Mode: YES

The low power mode feature allows the processor to operate in energy-efficient states, conserving power and prolonging battery life in portable devices.

Technical Specifications

Microprocessors CP3BT26G18NEPX/NOPB attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

23

Bit Size:

16

Boundary Scan:

YES

CPU Family:

CR16C

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PQFP-G128

Length:

20 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

128

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP128,.63X.87,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

24 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

20 mA

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

CP3BT26G18NEPX/NOPB Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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