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CP3BT10K38X

Texas Instruments

CP3BT10K38X by Texas Instruments

CP3BT10K38X by Texas Instruments is a 16-bit microprocessor with 22-bit address bus width. It operates at temperatures ranging from -40 to 85°C, making it suitable for industrial applications. With low power mode and boundary scan features, it offers efficient performance in various electronic systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,583 parts In-Stock

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Digiode

USA . 2,373 parts In-Stock

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Anansix

USA . 715 parts In-Stock

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Native Components

USA . 33 parts In-Stock

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$1.650

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Northwest PG Solutions

USA . 1,617 parts In-Stock

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$1.815

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AZTECH Wire

Italy . 447 parts In-Stock

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$15.684

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One Stop Electronics

USA . 752 parts In-Stock

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$29.000

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Parana Technologies

USA . 2,148 parts In-Stock

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$48.745

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DigiPath Technology Company

USA . 1,905 parts In-Stock

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$53.675

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$49.381

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IDEA Electronic Components Group

UK . 1,920 parts In-Stock

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$54.770

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$52.032

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$49.293

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ChromeModa Solutions

Germany . 1,467 parts In-Stock

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$54.770

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$44.911

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Corphita

USA . 1,131 parts In-Stock

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Overview

Experience the cutting-edge technology of the CP3BT10K38X by Texas Instruments, a high-quality microprocessor that delivers unrivaled performance and efficiency. Manufactured by the industry leader in semiconductor solutions, this chip offers endless possibilities in various applications. From industrial automation to consumer electronics, this versatile microprocessor provides value, benefits, and advantages that will exceed your expectations. Upgrade your devices with the CP3BT10K38X and unlock a world of endless possibilities.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and convenient installation on circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage: 2.75 V

Allows for a higher supply voltage which can result in better performance and processing capabilities.

Address Bus Width: 22

Wide address bus width enables efficient data transfer and memory addressing, making it suitable for handling complex tasks and large datasets.

Package Shape: SQUARE

Square package shape provides a compact footprint and efficient use of PCB space.

Bit Size: 16

16-bit architecture offers a good balance between performance and power efficiency for a wide range of applications.

No. of Terminals: 48

Higher number of terminals allow for more connectivity options and expansion capabilities.

Package Style (Meter): CHIP CARRIER

Chip carrier package style provides good protection for the microprocessor and enables easy handling during assembly.

Minimum Supply Voltage: 2.25 V

Low minimum supply voltage helps in reducing power consumption and extending battery life in portable devices.

Maximum Operating Temperature: 85 °C

High maximum operating temperature tolerance ensures reliable performance in harsh environments or under heavy workloads.

Minimum Operating Temperature: -40 °C

Wide operating temperature range makes the microprocessor suitable for use in both extreme cold and hot conditions.

Terminal Position: QUAD

Quad terminal position allows for easy and secure connections with other components on the circuit board.

Maximum Seated Height: 1.1 mm

Low profile design with maximum seated height of 1.1mm enables compact and space-saving PCB layouts.

Width: 7 mm

Narrow width of 7mm makes the microprocessor suitable for applications where space is limited.

Boundary Scan: YES

Boundary scan feature allows for efficient testing and debugging of the circuitry, ensuring high quality and reliability.

External Data Bus Width: 16

16-bit external data bus width enables faster data transfer rates and efficient communication with external devices.

Length: 7 mm

Compact length of 7mm contributes to a small overall footprint and easy integration into tight spaces.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable performance in harsh industrial environments with wide temperature variations.

Peripheral IC Type: MICROPROCESSOR, RISC

RISC architecture is known for its simplicity, efficiency, and high performance, making it an ideal choice for microprocessor applications.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and good noise immunity, making the microprocessor energy-efficient and reliable.

Terminal Form: NO LEAD

No lead terminal form provides better electrical performance, reliability, and environmental friendliness compared to traditional leaded packages.

Nominal Supply Voltage: 2.5 V

Stable nominal supply voltage of 2.5V ensures consistent and reliable operation of the microprocessor.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm allows for high-density mounting and compact PCB designs.

Format: FIXED POINT

Fixed-point format simplifies arithmetic operations and calculations, making the microprocessor suitable for real-time processing and control applications.

Speed: 24 rpm

High speed of 24 revolutions per minute allows for rapid data processing and efficient execution of instructions.

Low Power Mode: YES

Low power mode capability helps in reducing power consumption during idle or low-load conditions, extending battery life and energy efficiency.

Technical Specifications

Microprocessors CP3BT10K38X attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

22

Bit Size:

16

Boundary Scan:

YES

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-XQCC-N48

Length:

7 mm

Low Power Mode:

YES

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Maximum Seated Height:

1.1 mm

Speed:

24 rpm

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Trade Compliance

CP3BT10K38X Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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