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CP3BT26G18AWM/NOPB

Texas Instruments

CP3BT26G18AWM/NOPB by Texas Instruments

CP3BT26G18AWM/NOPB by Texas Instruments is a 16-bit microprocessor with 23-bit address bus width, operating at 2.25-2.75V. Ideal for industrial applications, it features ROM words of 262144, RAM bytes of 32768, and operates in low power mode at speeds up to 24 rpm.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,749 parts In-Stock

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Digiode

USA . 3,727 parts In-Stock

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Anansix

USA . 2,145 parts In-Stock

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Native Components

USA . 696 parts In-Stock

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$2.010

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Northwest PG Solutions

USA . 1,681 parts In-Stock

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One Stop Electronics

USA . 907 parts In-Stock

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907

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AZTECH Wire

Italy . 689 parts In-Stock

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Parana Technologies

USA . 189 parts In-Stock

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IDEA Electronic Components Group

UK . 470 parts In-Stock

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ChromeModa Solutions

Germany . 72 parts In-Stock

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Microchip USA

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DigiPath Technology Company

USA . 2,334 parts In-Stock

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Corphita

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Overview

Unleash the power of cutting-edge technology with the CP3BT26G18AWM/NOPB microprocessor by Texas Instruments. Crafted with precision and expertise, this high-quality product offers unparalleled performance for a wide range of applications. From industrial automation to consumer electronics, this microprocessor delivers reliability, efficiency, and innovation like never before. Elevate your projects to new heights with the superior value and benefits that only Texas Instruments can provide. Experience the difference with the CP3BT26G18AWM/NOPB and unlock endless possibilities in the world of microprocessors.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microprocessor.

Surface Mount: YES

Allows for easy installation on circuit boards.

Maximum Supply Voltage: 2.75 V

Optimal voltage for efficient performance.

Address Bus Width: 23

Allows for a large memory address space.

Bit Size: 16

Provides a good balance between performance and complexity.

Power Supplies (V): 2.5,2.5/3.3

Offers flexibility in power input.

No. of Terminals: 128

Provides ample connectivity options.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Enhances versatility in mounting options.

Minimum Supply Voltage: 2.25 V

Ensures stable operation even at lower voltages.

Maximum Operating Temperature: 85 °C

Suitable for industrial environments with varying temperatures.

CPU Family: CR16C

Belongs to a reliable and well-established processor family.

Minimum Operating Temperature: -40 °C

Allows for operation in cold environments without compromising performance.

Terminal Position: QUAD

Facilitates easy connection to other components.

ROM Words: 262144

Large ROM capacity for storing program instructions.

Maximum Seated Height: 1.6 mm

Compact size for space-efficient designs.

Width: 14 mm

Slim profile for integration into various systems.

Boundary Scan: YES

Enables efficient testing and debugging.

External Data Bus Width: 16

Suitable for handling data processing tasks efficiently.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper soldering during assembly.

Peak Reflow Temperature °C: 260

Withstands high reflow temperatures during manufacturing processes.

Length: 20 mm

Compact form factor for space-constrained applications.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial settings.

Peripheral IC Type: MICROPROCESSOR, RISC

Suitable for high-speed data processing tasks.

RAM Bytes: 32768

Sufficient RAM capacity for data storage and retrieval.

Technology: CMOS

Provides low power consumption and high noise immunity.

Terminal Form: GULL WING

Facilitates easy soldering and connectivity.

Maximum Supply Current: 20 mA

Low power consumption for energy-efficient operation.

Nominal Supply Voltage: 2.5 V

Stable voltage input for consistent performance.

ROM Programmability: FLASH

Allows for easy reprogramming of ROM.

Terminal Pitch: 0.5 mm

Fine pitch for compact designs and high-density interconnections.

Format: FIXED POINT

Suitable for applications requiring fixed-point arithmetic.

Moisture Sensitivity Level (MSL): 3

Moderate sensitivity to moisture for standard handling precautions.

Speed: 24 rpm

Offers fast processing speed for real-time applications.

Low Power Mode: YES

Provides energy-saving options for power-sensitive applications.

Technical Specifications

Microprocessors CP3BT26G18AWM/NOPB attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

23

Bit Size:

16

Boundary Scan:

YES

CPU Family:

CR16C

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PQFP-G128

Length:

20 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

128

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP128,.63X.87,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

24 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

20 mA

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

CP3BT26G18AWM/NOPB Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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