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CP3BT23Y98AWMX/NOPB

Texas Instruments

CP3BT23Y98AWMX/NOPB by Texas Instruments

CP3BT23Y98AWMX/NOPB by Texas Instruments is a 16-bit microprocessor with 23-bit address bus width, operating at temperatures from -40 to 85°C. It features a low power mode and flash ROM programmability, making it ideal for industrial applications requiring high-speed processing in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,086 parts In-Stock

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Digiode

USA . 3,919 parts In-Stock

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3,919

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Anansix

USA . 2,536 parts In-Stock

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2,536

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Distributors (Availability)

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Native Components

USA . 243 parts In-Stock

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$0.153

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$0.147

243

$0.153

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$0.147

Northwest PG Solutions

USA . 1,119 parts In-Stock

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$0.168

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$0.148

1,119

$0.168

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$0.148

AZTECH Wire

Italy . 798 parts In-Stock

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$10.141

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798

$10.141

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One Stop Electronics

USA . 1,366 parts In-Stock

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$34.000

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1,366

$34.000

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Parana Technologies

USA . 1,814 parts In-Stock

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$50.767

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$50.767

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DigiPath Technology Company

USA . 1,203 parts In-Stock

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$55.901

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$51.429

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$55.901

$51.429

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IDEA Electronic Components Group

UK . 2,117 parts In-Stock

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$57.042

100+ parts

$54.190

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$51.338

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2,117

$57.042

$54.190

$51.338

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ChromeModa Solutions

Germany . 366 parts In-Stock

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$57.042

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$46.774

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366

$57.042

$46.774

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Corphita

USA . 2,197 parts In-Stock

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Microchip USA

USA . 118 parts In-Stock

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Overview

Experience the power of innovation with the CP3BT23Y98AWMX/NOPB by Texas Instruments. As a leader in microprocessor technology, Texas Instruments delivers top-quality products that exceed expectations. Ideal for industrial applications, this microprocessor provides reliable performance and efficiency. With features like low power mode and flash ROM programmability, customers can trust this product to meet their needs. Trust Texas Instruments to bring cutting-edge technology to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the microprocessor easy to handle and long-lasting.

Surface Mount: YES

The surface mount feature allows for easy installation on circuit boards, making the product efficient and convenient to use.

Maximum Supply Voltage: 2.75 V

The low maximum supply voltage ensures that the microprocessor operates efficiently without consuming too much power.

Address Bus Width: 23

Having a wider address bus width allows for faster data processing and handling of larger memory capacities.

Package Shape: SQUARE

The square package shape allows for easy placement and accurate alignment on circuit boards.

Bit Size: 16

The 16-bit size enables the microprocessor to handle data in chunks of 16 bits, enhancing processing speed and efficiency.

Power Supplies (V): 2.5,2.5/3.3

The multiple power supply options provide flexibility in powering the microprocessor according to different needs and requirements.

No. of Terminals: 144

The high number of terminals allows for efficient connectivity and communication with other components in a circuit.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The various package styles offer versatility in installation and compatibility with different types of circuit boards.

Minimum Supply Voltage: 2.25 V

The low minimum supply voltage ensures that the microprocessor can operate reliably even under low power conditions.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range allows the microprocessor to function in a wide variety of environmental conditions.

CPU Family: CR16C

Being part of the CR16C family ensures compatibility with other CR16C processors and peripherals, making it a reliable choice for certain applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature range ensures that the microprocessor can function in extreme cold conditions without any issues.

Terminal Finish: MATTE TIN

The matte tin finish provides a good soldering surface for reliable connections and longevity of the product.

Terminal Position: QUAD

The quad terminal position allows for easy insertion and removal of the microprocessor from the circuit board, making maintenance and upgrades hassle-free.

ROM Words: 262144

Having a large ROM capacity allows for storing a significant amount of data and programming instructions, making the microprocessor versatile and capable of handling complex tasks.

Maximum Seated Height: 1.6 mm

The low seated height of the package ensures that the microprocessor can fit in compact spaces and slim devices without compromising on performance.

Width: 20 mm

The compact width of the microprocessor allows for efficient use of space on circuit boards and in electronic devices.

Boundary Scan: YES

The boundary scan feature allows for quick and efficient testing and debugging of the microprocessor, ensuring reliability and quality control.

External Data Bus Width: 8

The 8-bit external data bus width enables fast data transfer between the microprocessor and external memory or peripherals, enhancing overall performance.

Maximum Time At Peak Reflow Temperature (s): 30

The short time required at peak reflow temperature during installation ensures that the microprocessor is not exposed to excessive heat, minimizing the risk of damage.

Peak Reflow Temperature °C: 260

The high peak reflow temperature allows for secure soldering and bonding of the microprocessor to the circuit board, ensuring reliability and stability.

Length: 20 mm

The compact length of the microprocessor allows for efficient placement and installation on circuit boards without taking up too much space.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures that the microprocessor can operate reliably in harsh industrial environments with varying temperature conditions.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a RISC microprocessor allows for fast and efficient data processing, making it suitable for high-performance applications.

RAM Bytes: 32768

Having a large RAM capacity enables the microprocessor to handle multiple tasks and operations simultaneously, enhancing overall performance.

Technology: CMOS

The CMOS technology used in the microprocessor allows for low power consumption and high-speed operation, making it energy-efficient and reliable.

Terminal Form: GULL WING

The gull wing terminal form provides a secure and reliable electrical connection, ensuring stable performance and longevity of the microprocessor.

Maximum Supply Current: 20 mA

The low maximum supply current ensures that the microprocessor operates efficiently without drawing excessive power, prolonging battery life in portable devices.

Nominal Supply Voltage: 2.5 V

The stable nominal supply voltage ensures consistent and reliable performance of the microprocessor under normal operating conditions.

ROM Programmability: FLASH

Having flash ROM programmability allows for easy and quick updates and modifications to the microprocessor's firmware, providing flexibility and adaptability.

Terminal Pitch: 0.5 mm

The small terminal pitch enables high-density mounting of the microprocessor on circuit boards, saving space and allowing for compact device designs.

Format: FIXED POINT

The fixed-point format allows for precise and accurate calculations, making the microprocessor suitable for applications that require high computational accuracy.

Moisture Sensitivity Level (MSL): 3

The low moisture sensitivity level indicates that the microprocessor is resistant to moisture-related damage, ensuring long-term reliability in various environmental conditions.

Speed: 24 rpm

The high speed of the microprocessor allows for rapid data processing and task execution, making it ideal for applications that require real-time responsiveness.

Low Power Mode: YES

The low power mode feature allows for energy-efficient operation, reducing power consumption and extending the battery life of devices powered by the microprocessor.

Technical Specifications

Microprocessors CP3BT23Y98AWMX/NOPB attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

23

Bit Size:

16

Boundary Scan:

YES

CPU Family:

CR16C

External Data Bus Width:

8

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e3

Length:

20 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

144

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

24 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

20 mA

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

20 mm

Peripheral IC Type:

Trade Compliance

CP3BT23Y98AWMX/NOPB Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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