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CP3BT23Y98AWM/NOPB

Texas Instruments

CP3BT23Y98AWM/NOPB by Texas Instruments

CP3BT23Y98AWM/NOPB by Texas Instruments is a 16-bit microprocessor with 23-bit address bus width, operating at temperatures from -40 to 85°C. It features a max supply voltage of 2.75V and is suitable for industrial applications requiring low power consumption and high-speed processing capabilities. The CPU family CR16C chip has a ROM programmability of FLASH, making it ideal for embedded systems that demand efficient data processing in compact form factors.

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Vyrian

USA . 4,923 parts In-Stock

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Anansix

USA . 1,543 parts In-Stock

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Digiode

USA . 379 parts In-Stock

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AZTECH Wire

Italy . 642 parts In-Stock

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$18.743

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One Stop Electronics

USA . 675 parts In-Stock

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Parana Technologies

USA . 1,756 parts In-Stock

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DigiPath Technology Company

USA . 1,608 parts In-Stock

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IDEA Electronic Components Group

UK . 2,298 parts In-Stock

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$59.082

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$55.973

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ChromeModa Solutions

Germany . 1,870 parts In-Stock

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Corphita

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Native Components

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Northwest PG Solutions

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Microchip USA

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Overview

Upgrade your devices with the CP3BT23Y98AWM/NOPB by Texas Instruments, a high-quality microprocessor that offers unbeatable performance and reliability. Designed by a trusted manufacturer in the industry, this product is perfect for a wide range of applications, from industrial machinery to consumer electronics. With its advanced technology and efficient design, this microprocessor ensures seamless operation and optimal functionality. Experience the value and benefits of Texas Instruments' CP3BT23Y98AWM/NOPB and take your projects to the next level with ease.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material ensures the reliability and longevity of the microprocessor.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and space during manufacturing.

Maximum Supply Voltage: 2.75 V

Operates efficiently within a safe voltage range, enhancing the product's performance and lifespan.

Address Bus Width: 23

Provides a large address space for memory storage, allowing for more data processing capabilities.

Bit Size: 16

Offers a high level of processing power and efficiency for various applications.

Power Supplies (V): 2.5,2.5/3.3

Compatible with different power supplies, making it versatile for use in various electronic devices.

No. of Terminals: 144

Provides ample connectivity options for interfacing with other components and peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Allows for a compact and efficient design, ideal for space-constrained applications.

Minimum Supply Voltage: 2.25 V

Can operate at lower voltages, saving energy and reducing heat generation.

Maximum Operating Temperature: 85 °C

Capable of operating in high-temperature environments without compromising performance.

CPU Family: CR16C

Belongs to a reliable and proven CPU family known for its performance and stability.

Minimum Operating Temperature: -40 °C

Can withstand extreme cold temperatures, ensuring functionality in harsh environments.

Terminal Finish: MATTE TIN

Provides a durable and corrosion-resistant finish for the terminals, enhancing the product's longevity.

Peripheral IC Type: MICROPROCESSOR, RISC

Incorporates RISC architecture for efficient data processing and improved performance.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high-speed processing.

Speed: 24 rpm

Offers a high clock speed for fast data processing, suitable for demanding applications.

Technical Specifications

Microprocessors CP3BT23Y98AWM/NOPB attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

23

Bit Size:

16

Boundary Scan:

YES

CPU Family:

CR16C

External Data Bus Width:

8

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e3

Length:

20 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

144

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

24 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

20 mA

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

20 mm

Peripheral IC Type:

Trade Compliance

CP3BT23Y98AWM/NOPB Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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