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CP3BT26G18ABKX/NOPB

Texas Instruments

CP3BT26G18ABKX/NOPB by Texas Instruments

CP3BT26G18ABKX/NOPB by Texas Instruments is a 16-bit microprocessor with 23-bit address bus width, operating at 2.25-2.75V. Ideal for industrial applications, it features ROM words of 262144, RAM bytes of 32768, and operates in low power mode at a speed of 24 rpm.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,771 parts In-Stock

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7,771

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Digiode

USA . 3,621 parts In-Stock

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3,621

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Distributors (Availability)

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Native Components

USA . 590 parts In-Stock

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$0.437

100+ parts

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$0.420

590

$0.437

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$0.420

Northwest PG Solutions

USA . 2,358 parts In-Stock

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$0.481

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$0.424

2,358

$0.481

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$0.424

AZTECH Wire

Italy . 843 parts In-Stock

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$18.992

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843

$18.992

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One Stop Electronics

USA . 1,242 parts In-Stock

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$24.000

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$24.000

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Parana Technologies

USA . 1,607 parts In-Stock

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$34.593

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1,607

$34.593

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ChromeModa Solutions

Germany . 6,558 parts In-Stock

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$38.868

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$31.872

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6,558

$38.868

$31.872

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IDEA Electronic Components Group

UK . 364 parts In-Stock

1+ parts

$38.868

100+ parts

$36.925

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$34.981

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364

$38.868

$36.925

$34.981

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Corphita

USA . 3,615 parts In-Stock

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Microchip USA

USA . 280 parts In-Stock

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DigiPath Technology Company

USA . 192 parts In-Stock

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$35.043

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$35.043

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Overview

Experience the next level of performance with the CP3BT26G18ABKX/NOPB by Texas Instruments, a leading manufacturer in the industry. This microprocessor offers unparalleled quality and reliability, making it the ideal choice for a wide range of applications. With a focus on efficiency and innovation, this product delivers exceptional value to customers looking for cutting-edge solutions. Upgrade your technology with Texas Instruments and unlock endless possibilities for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and resistance to heat, making the microprocessor reliable for long-term use.

Surface Mount: YES

Surface mount capability allows for easy installation on circuit boards, saving space and simplifying the assembly process.

Maximum Supply Voltage: 2.75 V

Operates efficiently with a maximum supply voltage, ensuring stable performance within the specified range.

Address Bus Width: 23

Wide address bus width allows for efficient data transfer and handling of large memory spaces.

Package Shape: RECTANGULAR

Rectangular shape is easy to integrate into various electronic devices, optimizing space usage.

Bit Size: 16

16-bit architecture enables faster processing speeds and higher data throughput.

Power Supplies (V): 2.5,2.5/3.3

Multiple power supply options provide flexibility for different voltage requirements, enhancing compatibility with various systems.

No. of Terminals: 128

Having 128 terminals allows for a high level of connectivity and interface options for external components.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Various package styles offer versatility in mounting options and compatibility with different circuit board layouts.

Minimum Supply Voltage: 2.25 V

With a low minimum supply voltage, the microprocessor can operate efficiently even in low-power scenarios.

Maximum Operating Temperature: 85 °C

High maximum operating temperature tolerance ensures reliable performance in various environmental conditions.

CPU Family: CR16C

Part of the CR16C CPU family known for its efficient and reliable processing capabilities.

Minimum Operating Temperature: -40 °C

Able to operate in extremely cold temperatures, making it suitable for a wide range of applications.

Terminal Position: QUAD

Quad terminal position design enables secure connections and efficient signal transmission.

ROM Words: 262144

Large ROM word capacity allows for storing extensive program instructions and data.

Maximum Seated Height: 1.6 mm

Low profile design with a small seated height enables compact and space-saving installations.

Width: 14 mm

Narrow width makes the microprocessor suitable for applications where space is limited.

Boundary Scan: YES

Boundary scan feature allows for efficient testing and debugging of the microprocessor during production and operation.

External Data Bus Width: 16

16-bit external data bus width provides high-speed data transfer and processing capabilities.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperature for a specified time without affecting its performance or integrity.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance ensures soldering processes can be carried out effectively without damaging the microprocessor.

Length: 20 mm

Compact length allows for easy integration into various electronic devices without taking up excessive space.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable performance in challenging environments.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a RISC-based microprocessor, it offers enhanced performance and efficiency for computing tasks.

RAM Bytes: 32768

Generous RAM capacity allows for efficient data storage and processing during operation.

Technology: CMOS

CMOS technology offers low power consumption and high-speed processing capabilities, making the microprocessor energy-efficient.

Terminal Form: GULL WING

Gull wing terminal form provides secure connections and ease of soldering during the assembly process.

Maximum Supply Current: 20 mA

Low maximum supply current requirement helps in reducing power consumption and heat generation.

Nominal Supply Voltage: 2.5 V

Stable nominal supply voltage ensures consistent and reliable performance under normal operating conditions.

ROM Programmability: FLASH

Flash ROM programmability allows for easy updates and modifications to the microprocessor's firmware.

Terminal Pitch: 0.5 mm

Narrow terminal pitch facilitates compact design and allows for high-density mounting on circuit boards.

Format: FIXED POINT

Fixed-point format simplifies arithmetic operations and enhances processing speed for numerical calculations.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates the microprocessor is moderately sensitive to moisture, suitable for typical storage and operating conditions.

Speed: 24 rpm

High speed operation at 24 RPM enables rapid data processing and execution of instructions.

Low Power Mode: YES

Low power mode feature allows for energy-efficient operation and extended battery life in portable devices.

Technical Specifications

Microprocessors CP3BT26G18ABKX/NOPB attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

23

Bit Size:

16

Boundary Scan:

YES

CPU Family:

CR16C

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PQFP-G128

Length:

20 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

128

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP128,.63X.87,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

24 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

20 mA

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

CP3BT26G18ABKX/NOPB Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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