Loading...

CP3BT23G18AWM/NOPB

Texas Instruments

CP3BT23G18AWM/NOPB by Texas Instruments

CP3BT23G18AWM/NOPB by Texas Instruments is a 16-bit microprocessor with ROM of 262144 words and RAM of 32768 bytes. It operates at temperatures from -40 to 85°C, suitable for industrial applications. With low power mode and flash ROM programmability, it offers efficient processing in compact devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 9,679 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

9,679

-

-

-

-

Digiode

USA . 3,235 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,235

-

-

-

-

Anansix

USA . 678 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

678

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 594 parts In-Stock

1+ parts

$1.000

100+ parts

-

1k+ parts

-

10k+ parts

-

594

$1.000

-

-

-

AZTECH Wire

Italy . 555 parts In-Stock

1+ parts

$9.827

100+ parts

-

1k+ parts

-

10k+ parts

-

555

$9.827

-

-

-

Parana Technologies

USA . 1,881 parts In-Stock

1+ parts

$73.402

100+ parts

$6,816.476

1k+ parts

$66.062

10k+ parts

-

1,881

$73.402

$6,816.476

$66.062

-

DigiPath Technology Company

USA . 52 parts In-Stock

1+ parts

$80.825

100+ parts

-

1k+ parts

-

10k+ parts

-

52

$80.825

-

-

-

ChromeModa Solutions

Germany . 3,225 parts In-Stock

1+ parts

$82.474

100+ parts

$67.629

1k+ parts

-

10k+ parts

-

3,225

$82.474

$67.629

-

-

IDEA Electronic Components Group

UK . 2,273 parts In-Stock

1+ parts

$82.474

100+ parts

$78.350

1k+ parts

$74.227

10k+ parts

-

2,273

$82.474

$78.350

$74.227

-

Corphita

USA . 2,879 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,879

-

-

-

-

Northwest PG Solutions

USA . 2,213 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$4.132

10k+ parts

-

2,213

-

-

$4.132

-

Native Components

USA . 449 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$4.089

10k+ parts

-

449

-

-

$4.089

-

Microchip USA

USA . 299 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

299

-

-

-

-

Overview

Experience unparalleled performance and reliability with the CP3BT23G18AWM/NOPB by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-notch quality in their microprocessors, making them ideal for a wide range of applications. From industrial automation to consumer electronics, this cutting-edge product offers unmatched value, benefits, and advantages to customers. Say goodbye to compromises and hello to seamless functionality with the CP3BT23G18AWM/NOPB.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the microprocessor, ensuring a longer lifespan.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards.

Maximum Supply Voltage: 2.75 V

Operates within a safe voltage range to prevent damage to the microprocessor.

Package Shape: RECTANGULAR

Rectangular shape provides a compact design for space-efficient integration into electronic devices.

Bit Size: 16

16-bit architecture allows for processing of data in larger chunks, improving overall performance.

Power Supplies (V): 2.5,2.5/3.3

Supports multiple power supply options, providing flexibility for different system requirements.

No. of Terminals: 128

Ample number of terminals ensure connectivity to various external components for enhanced functionality.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Various package styles offer versatility in mounting options to suit different design preferences.

Minimum Supply Voltage: 2.25 V

Low minimum supply voltage allows for efficient power usage, reducing energy consumption.

Maximum Operating Temperature: 85 °C

High maximum operating temperature tolerance ensures reliable performance even in demanding environments.

CPU Family: CR16C

Part of a reputable CPU family known for high-quality and efficient processing capabilities.

Minimum Operating Temperature: -40 °C

Wide temperature range for operation enables use in both hot and cold conditions without performance issues.

Terminal Position: QUAD

Quad terminal position facilitates easy connectivity and integration into circuit boards.

ROM Words: 262144

Large ROM capacity allows for storing complex programs and data for advanced computing tasks.

Maximum Seated Height: 1.6 mm

Low profile design with maximum seated height enables slim and compact electronic device designs.

Width: 14 mm

Compact width dimension enables space-saving integration in electronic applications.

Boundary Scan: YES

Boundary scan feature allows for efficient testing and debugging of the microprocessor during development and production.

Maximum Time At Peak Reflow Temperature (s): 30

Optimal reflow temperature duration ensures proper soldering during assembly for reliable connections.

Peak Reflow Temperature °C: 260

High peak reflow temperature capability for reliable soldering and secure connections during manufacturing processes.

Length: 20 mm

Compact length dimension facilitates space-efficient placement on circuit boards.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures stable performance in harsh environmental conditions.

Peripheral IC Type: MICROPROCESSOR, RISC

RISC architecture for efficient processing and handling of peripheral functionalities.

RAM Bytes: 32768

Ample RAM capacity for storing and accessing data quickly, enhancing overall system performance.

Technology: CMOS

CMOS technology provides low power consumption and high speed processing for energy-efficient operation.

Terminal Form: GULL WING

Gull wing terminal form allows for easy and secure soldering onto circuit boards for reliable connections.

Maximum Supply Current: 20 mA

Low maximum supply current requirement for efficient power usage and reduced heat generation.

Nominal Supply Voltage: 2.5 V

Stable nominal supply voltage ensures consistent and reliable operation of the microprocessor.

ROM Programmability: FLASH

Flash ROM programmability for easy and quick updates of firmware and software.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density mounting on circuit boards for compact designs.

Format: FIXED POINT

Fixed-point format for accurate numerical computations and efficient data processing.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate sensitivity to moisture, requiring standard handling procedures during assembly.

Speed: 24 rpm

High processing speed of 24 rpm for quick execution of instructions and tasks.

Low Power Mode: YES

Low power mode feature enables energy-saving operation for improved efficiency and longer battery life.

Technical Specifications

Microprocessors CP3BT23G18AWM/NOPB attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

CR16C

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PQFP-G128

Length:

20 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

128

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP128,.63X.87,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

24 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

20 mA

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

CP3BT23G18AWM/NOPB Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20