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AM1705BPTP4

Texas Instruments

AM1705BPTP4 by Texas Instruments

AM1705BPTP4 by Texas Instruments is a 32-bit microprocessor with integrated cache, operating at max 50 MHz. It has an address bus width of 13 and external data bus width of 16. Ideal for low power applications requiring high-speed processing in compact designs.

Median Price

$13.130

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 87 parts In-Stock

1+ parts

$13.130

100+ parts

$9.342

1k+ parts

-

10k+ parts

-

87

$13.130

$9.342

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 456 parts In-Stock

1+ parts

$9.082

100+ parts

-

1k+ parts

-

10k+ parts

-

456

$9.082

-

-

-

Vyrian

USA . 6,018 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,018

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,002 parts In-Stock

1+ parts

$8.604

100+ parts

-

1k+ parts

-

10k+ parts

-

1,002

$8.604

-

-

-

Parana Technologies

USA . 2,169 parts In-Stock

1+ parts

$21.040

100+ parts

-

1k+ parts

$21.275

10k+ parts

-

2,169

$21.040

-

$21.275

-

DigiPath Technology Company

USA . 1,382 parts In-Stock

1+ parts

$23.167

100+ parts

$21.314

1k+ parts

-

10k+ parts

-

1,382

$23.167

$21.314

-

-

ChromeModa Solutions

Germany . 6,220 parts In-Stock

1+ parts

$23.640

100+ parts

$19.385

1k+ parts

-

10k+ parts

-

6,220

$23.640

$19.385

-

-

IDEA Electronic Components Group

UK . 387 parts In-Stock

1+ parts

$23.640

100+ parts

$22.458

1k+ parts

$21.276

10k+ parts

-

387

$23.640

$22.458

$21.276

-

Microchip USA

USA . 344 parts In-Stock

1+ parts

$26.490

100+ parts

$26.110

1k+ parts

$25.920

10k+ parts

$25.730

344

$26.490

$26.110

$25.920

$25.730

Native Components

USA . 335 parts In-Stock

1+ parts

$56.985

100+ parts

-

1k+ parts

-

10k+ parts

$54.706

335

$56.985

-

-

$54.706

Northwest PG Solutions

USA . 861 parts In-Stock

1+ parts

$62.684

100+ parts

-

1k+ parts

-

10k+ parts

-

861

$62.684

-

-

-

Robosynatics

Brazil . 900 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

900

-

-

-

-

Lucentia Tech

USA . 900 parts In-Stock

1+ parts

-

100+ parts

$25.914

1k+ parts

$23.996

10k+ parts

$23.996

900

-

$25.914

$23.996

$23.996

Overview

Experience the power of cutting-edge technology with the AM1705BPTP4 from Texas Instruments. As a leader in microprocessor innovation, Texas Instruments delivers exceptional quality and reliability in every product. Ideal for a wide range of applications, this microprocessor boasts integrated cache and low power mode for optimal performance. With a sleek package design and advanced features like boundary scan and external data bus width of 16, the AM1705BPTP4 provides unmatched value and benefits to customers looking for top-notch processing capabilities. Elevate your projects with the AM1705BPTP4 and experience the difference that Texas Instruments can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the product lightweight and durable, ideal for portable devices.

Integrated Cache: YES

Integrated cache helps in improving the speed and efficiency of the processor by storing frequently accessed data.

Surface Mount: YES

Surface mount feature makes it easy to install and saves space on the motherboard.

Maximum Supply Voltage: 1.32 V

Operating at a maximum voltage of 1.32V ensures energy efficiency and reduces power consumption.

Address Bus Width: 13

A wider address bus width allows for efficient data transfer and processing capability.

Package Shape: SQUARE

Square package shape provides a compact design for easy integration into various devices.

Bit Size: 32

A 32-bit architecture allows for processing larger chunks of data, enhancing overall performance.

Power Supplies (V): 1.3,1.8/3.3

Multiple voltage options provide flexibility in power consumption and compatibility with different systems.

No. of Terminals: 176

Having 176 terminals enables seamless connectivity and communication with other components.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

Various package styles offer versatility in installation and compatibility with different setups.

Minimum Supply Voltage: 1.14 V

Operating at a minimum voltage of 1.14V ensures stable performance even under low power conditions.

Maximum Operating Temperature: 90 °C

Operating at a maximum temperature of 90°C ensures reliability and stability under high-load conditions.

Minimum Operating Temperature: 0 °C

Being able to operate at a minimum temperature of 0°C ensures functionality in various environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel, palladium, and gold terminal finish provide excellent conductivity and corrosion resistance for long-term reliability.

Terminal Position: QUAD

Quad terminal position ensures robust connectivity and stability during operation.

Maximum Seated Height: 1.6 mm

A low seated height of 1.6mm facilitates sleek and compact designs for devices.

Width: 24 mm

A width of 24mm provides a balance between compactness and space for efficient heat dissipation.

Boundary Scan: YES

Boundary scan feature allows for efficient testing and debugging of the processor during manufacturing.

External Data Bus Width: 16

A wider external data bus width of 16 enhances data transfer speeds and overall performance.

Maximum Clock Frequency: 50 MHz

Operating at a maximum clock frequency of 50MHz enables fast processing and responsiveness.

Maximum Time At Peak Reflow Temperature (s): 30

The ability to withstand peak reflow temperatures for 30 seconds ensures reliability during manufacturing processes.

Peak Reflow Temperature °C: 260

Peak reflow temperature of 260°C ensures proper soldering and assembly of the processor.

Length: 24 mm

A length of 24mm provides a compact form factor for easy integration into various devices.

Peripheral IC Type: MICROPROCESSOR, RISC

Microprocessor with RISC architecture offers high performance and efficiency for computing tasks.

Technology: CMOS

CMOS technology provides low power consumption and high-speed operation for energy-efficient performance.

Terminal Form: GULL WING

Gull wing terminal form offers strong mechanical support and easy soldering during installation.

Nominal Supply Voltage: 1.2 V

Operating at a nominal voltage of 1.2V ensures stability and compatibility with various systems.

Terminal Pitch: 0.5 mm

A small terminal pitch of 0.5mm allows for compact design and efficient PCB layout.

Format: FIXED POINT

Fixed-point format provides precision and accuracy in mathematical calculations and data processing.

Moisture Sensitivity Level (MSL): 4

MSL 4 designation indicates that the processor has moderate sensitivity to moisture, ensuring reliability during storage and operation.

Speed: 456 rpm

Operating at a speed of 456 rpm ensures fast data processing and responsiveness for computing tasks.

Low Power Mode: YES

Low power mode feature helps in reducing energy consumption and heat generation, ideal for battery-powered devices.

Technical Specifications

Microprocessors AM1705BPTP4 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

13

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G176

JESD-609 Code:

e4

Length:

24 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

176

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP176,1.0SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.3,1.8/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Speed:

456 rpm

Sub-Category:

Microprocessors

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

24 mm

Peripheral IC Type:

Trade Compliance

AM1705BPTP4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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