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AM1707BZKB3

Texas Instruments

AM1707BZKB3 by Texas Instruments

The Texas Instruments AM1707BZKB3 microprocessor features 32-bit architecture, 16-bit address and data bus width, with integrated cache. Operating at a max clock frequency of 20 MHz, it is suitable for low power applications requiring a supply voltage range of 1.14-1.32 V. The package style is grid array with fine pitch terminals, making it ideal for compact designs in various electronic devices.

Median Price

$9.300

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 227 parts In-Stock

1+ parts

-

100+ parts

$7.440

1k+ parts

$6.660

10k+ parts

$6.260

227

-

$7.440

$6.660

$6.260

DigiKey

USA . 227 parts In-Stock

1+ parts

-

100+ parts

$9.790

1k+ parts

-

10k+ parts

-

227

-

$9.790

-

-

Verical

USA . 227 parts In-Stock

1+ parts

-

100+ parts

$9.300

1k+ parts

$8.325

10k+ parts

$7.825

227

-

$9.300

$8.325

$7.825

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,440 parts In-Stock

1+ parts

$7.856

100+ parts

-

1k+ parts

-

10k+ parts

-

1,440

$7.856

-

-

-

Vyrian

USA . 8,811 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,811

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,190 parts In-Stock

1+ parts

$7.443

100+ parts

-

1k+ parts

-

10k+ parts

-

4,190

$7.443

-

-

-

Microchip USA

USA . 291 parts In-Stock

1+ parts

$23.830

100+ parts

$23.490

1k+ parts

$23.320

10k+ parts

$23.150

291

$23.830

$23.490

$23.320

$23.150

Parana Technologies

USA . 1,001 parts In-Stock

1+ parts

$32.886

100+ parts

-

1k+ parts

$114.439

10k+ parts

-

1,001

$32.886

-

$114.439

-

DigiPath Technology Company

USA . 1,489 parts In-Stock

1+ parts

$36.212

100+ parts

$33.315

1k+ parts

-

10k+ parts

-

1,489

$36.212

$33.315

-

-

ChromeModa Solutions

Germany . 1,427 parts In-Stock

1+ parts

$36.951

100+ parts

$30.300

1k+ parts

-

10k+ parts

-

1,427

$36.951

$30.300

-

-

IDEA Electronic Components Group

UK . 1,191 parts In-Stock

1+ parts

$36.951

100+ parts

$35.103

1k+ parts

$33.256

10k+ parts

-

1,191

$36.951

$35.103

$33.256

-

Native Components

USA . 510 parts In-Stock

1+ parts

$53.470

100+ parts

-

1k+ parts

-

10k+ parts

$51.331

510

$53.470

-

-

$51.331

Northwest PG Solutions

USA . 420 parts In-Stock

1+ parts

$58.817

100+ parts

-

1k+ parts

-

10k+ parts

-

420

$58.817

-

-

-

A-Z Elektronik GmbH

Germany . 5,220 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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5,220

-

-

-

-

Alle Elektronik GmbH

Germany . 3,480 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,480

-

-

-

-

Perfect Parts

USA . 586 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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586

-

-

-

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Kepictronics

USA . 78 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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78

-

-

-

-

Overview

Experience the cutting-edge technology of the AM1707BZKB3 microprocessor by Texas Instruments. Manufactured with precision and expertise, this powerful chip is ideal for a wide range of applications. From consumer electronics to industrial automation, its integrated cache and high-quality components ensure top-notch performance. With low power consumption and advanced features, this microprocessor offers unmatched value and efficiency, making it the perfect choice for your next project. Elevate your designs with the reliability and innovation of Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microprocessor, ensuring a longer lifespan.

Integrated Cache: YES

Having an integrated cache improves processing speed and efficiency, making the microprocessor suitable for high-performance tasks.

Maximum Supply Voltage: 1.32 V

The maximum supply voltage allows for reliable and stable operation of the microprocessor within safe limits.

Address Bus Width: 16

With a wide address bus width, the microprocessor can handle larger amounts of data more efficiently.

Package Shape: SQUARE

The square package shape provides easy handling and installation of the microprocessor in various devices.

Bit Size: 32

With a 32-bit size, the microprocessor can perform complex calculations and operations effectively.

Power Supplies (V): 1.2,1.8/3.3

The multiple power supply options allow flexibility in different applications and power requirements.

No. of Terminals: 256

Having a high number of terminals enhances connectivity and integration with other components in a device.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a microprocessor with Reduced Instruction Set Computing (RISC) architecture, it offers efficient performance for specific tasks.

Technology: CMOS

CMOS technology ensures low power consumption and high reliability in the microprocessor.

Technical Specifications

Microprocessors AM1707BZKB3 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

16

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

20 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Length:

17 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

256

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA256,16X16,40

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,1.8/3.3

Qualification:

Not Qualified

Maximum Seated Height:

2.05 mm

Speed:

375 rpm

Sub-Category:

Microprocessors

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

17 mm

Peripheral IC Type:

Trade Compliance

AM1707BZKB3 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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