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AM1707BZKB4

Texas Instruments

AM1707BZKB4 by Texas Instruments

The Texas Instruments AM1707BZKB4 microprocessor features a 32-bit architecture with integrated cache and 16-bit address bus width. It operates at a max clock frequency of 20 MHz, making it suitable for low power applications in various industries such as automotive and industrial automation. The package style is grid array with a terminal pitch of 0.5 mm, offering high performance in a compact form factor.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,686 parts In-Stock

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6,686

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Digiode

USA . 3,126 parts In-Stock

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Prism Electronics

USA . 70 parts In-Stock

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70

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AZTECH Wire

Italy . 272 parts In-Stock

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$15.094

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272

$15.094

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Parana Technologies

USA . 352 parts In-Stock

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$16.582

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$16.855

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352

$16.582

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$16.855

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DigiPath Technology Company

USA . 383 parts In-Stock

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$18.259

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$16.799

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383

$18.259

$16.799

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ChromeModa Solutions

Germany . 6,900 parts In-Stock

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$18.632

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$15.278

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6,900

$18.632

$15.278

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IDEA Electronic Components Group

UK . 154 parts In-Stock

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$18.632

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$17.700

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$16.769

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154

$18.632

$17.700

$16.769

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One Stop Electronics

USA . 905 parts In-Stock

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$34.000

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905

$34.000

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A-Z Elektronik GmbH

Germany . 7,365 parts In-Stock

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Lixinc

USA . 7,258 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,910 parts In-Stock

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Corphita

USA . 1,087 parts In-Stock

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Native Components

USA . 479 parts In-Stock

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Microchip USA

USA . 234 parts In-Stock

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Kepictronics

USA . 147 parts In-Stock

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Futuretech Components

Singapore . 147 parts In-Stock

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Northwest PG Solutions

USA . 29 parts In-Stock

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Overview

Discover the innovative AM1707BZKB4 microprocessor by Texas Instruments, setting the standard for quality and reliability in the industry. This powerful chip is versatile, with applications ranging from consumer electronics to industrial automation. With its integrated cache and low power mode, this microprocessor offers unmatched efficiency and performance. Trust in Texas Instruments to deliver cutting-edge technology that adds value to your projects. Experience the benefits of top-notch engineering and superior functionality with the AM1707BZKB4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microprocessor, making it resilient to various environmental conditions.

Integrated Cache: YES

Having integrated cache allows for faster access to frequently used data, improving the overall performance of the microprocessor.

Maximum Supply Voltage: 1.32 V

The higher maximum supply voltage ensures stable operation of the microprocessor under varying voltage conditions.

Address Bus Width: 16

A wider address bus allows for increased memory addressing capability, enabling the microprocessor to access larger amounts of data.

Package Shape: SQUARE

The square package shape makes it easier to mount and install the microprocessor on circuit boards, ensuring efficient use of space.

Bit Size: 32

With a larger bit size, the microprocessor can process more data at once, leading to improved performance and faster processing speeds.

Power Supplies (V): 1.3,1.8/3.3

Having multiple power supply options allows for flexibility in different system configurations, making the microprocessor versatile for various applications.

No. of Terminals: 256

A higher number of terminals provide more connectivity options for the microprocessor, allowing for greater integration with other components in the system.

Maximum Operating Temperature: 90 °C

The high maximum operating temperature ensures reliable performance in demanding environments with elevated temperatures.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature allows the microprocessor to function effectively even in cold conditions, ensuring consistent performance.

Technical Specifications

Microprocessors AM1707BZKB4 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

16

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

20 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Length:

17 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

256

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA256,16X16,40

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.3,1.8/3.3

Qualification:

Not Qualified

Maximum Seated Height:

2.05 mm

Speed:

456 rpm

Sub-Category:

Microprocessors

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

17 mm

Peripheral IC Type:

Trade Compliance

AM1707BZKB4 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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