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AM1705CPTPA3

Texas Instruments

AM1705CPTPA3 by Texas Instruments

AM1705CPTPA3 by Texas Instruments is a 32-bit microprocessor with 13-bit address bus width, 16-bit external data bus width, and 50 MHz max clock frequency. Ideal for industrial applications requiring low power mode and integrated cache for efficient processing.

Median Price

$9.450

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 900 parts In-Stock

1+ parts

-

100+ parts

$9.450

1k+ parts

-

10k+ parts

-

900

-

$9.450

-

-

Rochester

USA . 850 parts In-Stock

1+ parts

-

100+ parts

$8.180

1k+ parts

$7.320

10k+ parts

$6.890

850

-

$8.180

$7.320

$6.890

Verical

USA . 850 parts In-Stock

1+ parts

-

100+ parts

$10.225

1k+ parts

$9.150

10k+ parts

$8.613

850

-

$10.225

$9.150

$8.613

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,536 parts In-Stock

1+ parts

$8.636

100+ parts

-

1k+ parts

-

10k+ parts

-

4,536

$8.636

-

-

-

Vyrian

USA . 7,851 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,851

-

-

-

-

Semi Source

USA . 20 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

20

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,279 parts In-Stock

1+ parts

$8.181

100+ parts

-

1k+ parts

-

10k+ parts

-

4,279

$8.181

-

-

-

Parana Technologies

USA . 2,024 parts In-Stock

1+ parts

$76.535

100+ parts

-

1k+ parts

-

10k+ parts

-

2,024

$76.535

-

-

-

DigiPath Technology Company

USA . 528 parts In-Stock

1+ parts

$84.274

100+ parts

$77.532

1k+ parts

-

10k+ parts

-

528

$84.274

$77.532

-

-

ChromeModa Solutions

Germany . 5,857 parts In-Stock

1+ parts

$85.994

100+ parts

$70.515

1k+ parts

-

10k+ parts

-

5,857

$85.994

$70.515

-

-

IDEA Electronic Components Group

UK . 905 parts In-Stock

1+ parts

$85.994

100+ parts

$81.694

1k+ parts

$77.395

10k+ parts

-

905

$85.994

$81.694

$77.395

-

Native Components

USA . 806 parts In-Stock

1+ parts

$90.908

100+ parts

-

1k+ parts

-

10k+ parts

$87.271

806

$90.908

-

-

$87.271

Northwest PG Solutions

USA . 1 parts In-Stock

1+ parts

$99.999

100+ parts

-

1k+ parts

-

10k+ parts

-

1

$99.999

-

-

-

Microchip USA

USA . 111 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

111

-

-

-

-

Overview

Unlock the power of cutting-edge technology with the AM1705CPTPA3 by Texas Instruments. As a leader in microprocessor innovation, Texas Instruments ensures top-quality products that meet the highest industry standards. Ideal for a wide range of applications, this microprocessor offers unmatched reliability and performance. Experience seamless operation and enhanced efficiency with the AM1705CPTPA3, delivering exceptional value and benefits to customers looking for top-of-the-line solutions. Elevate your projects to the next level with this advanced microprocessor from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making it ideal for portable devices.

Integrated Cache: YES

Integrated cache helps improve the performance of the microprocessor by storing frequently accessed data for quick retrieval.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly of the microprocessor onto circuit boards.

Address Bus Width: 13

A wider address bus allows for efficient memory access and data storage, enhancing the overall processing speed of the microprocessor.

Package Shape: SQUARE

A square package shape helps in efficient placement and mounting of the microprocessor on the circuit board.

Bit Size: 32

A 32-bit architecture allows the microprocessor to handle larger chunks of data at a time, improving overall processing speed and efficiency.

Power Supplies (V): 1.2,1.8/3.3

Support for multiple power supply voltages allows for flexibility in power management and compatibility with different systems.

No. of Terminals: 176

Having a high number of terminals enables the microprocessor to interface with a wide range of external devices and components.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

The variety of package styles available offer flexibility in design and mounting options for different types of applications.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature ensures reliability and stability even in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for use in a wide range of temperature environments without compromising performance.

Terminal Finish: NICKEL PALLADIUM GOLD

This terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable connections.

Terminal Position: QUAD

The quad terminal position offers a secure and stable connection to the circuit board, preventing signal interference and data loss.

Maximum Seated Height: 1.6 mm

A low seated height allows for compact and space-efficient design, making it suitable for slim and portable devices.

Width: 24 mm

The moderate width of the microprocessor makes it compatible with standard board layouts and mounting options.

Boundary Scan: YES

Boundary scan capability allows for efficient testing and diagnosis of the microprocessor during production and maintenance.

External Data Bus Width: 16

A wider external data bus width enables faster data transfer between the microprocessor and external devices, enhancing overall performance.

Maximum Clock Frequency: 50 MHz

A high maximum clock frequency allows for fast processing and data throughput, making it suitable for high-performance applications.

Maximum Time At Peak Reflow Temperature (s): 30

The short time at peak reflow temperature ensures proper soldering and assembly of the microprocessor without causing damage.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures reliable and secure solder joints, improving the durability and longevity of the microprocessor.

Length: 24 mm

The compact length of the microprocessor allows for efficient placement and mounting on the circuit board.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable operation in demanding industrial environments with varying temperature conditions.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a RISC-based microprocessor, it offers efficient data processing and reduced instruction complexity, improving overall performance.

Technology: CMOS

CMOS technology offers low power consumption and high-speed performance, making it suitable for energy-efficient devices.

Terminal Form: GULL WING

The gull wing terminal form provides secure and reliable connections to the circuit board, preventing signal loss and data corruption.

Nominal Supply Voltage: 1.2 V

A low nominal supply voltage ensures energy efficiency and reduces power consumption, making it ideal for battery-operated devices.

Terminal Pitch: 0.5 mm

A fine terminal pitch allows for compact and space-efficient design, enabling high-density mounting on the circuit board.

Format: FIXED POINT

Fixed-point format simplifies arithmetic operations and improves overall processing speed and accuracy.

Moisture Sensitivity Level (MSL): 4

MSL 4 rating indicates that the microprocessor is capable of withstanding moderate exposure to moisture during handling and assembly.

Speed: 375 rpm

With a high speed of 375 rpm, the microprocessor can handle data processing tasks quickly and efficiently, making it suitable for high-performance applications.

Low Power Mode: YES

The low power mode feature helps optimize power consumption and extends battery life in portable devices.

Technical Specifications

Microprocessors AM1705CPTPA3 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

13

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G176

JESD-609 Code:

e4

Length:

24 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

176

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP176,1.0SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,1.8/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Speed:

375 rpm

Sub-Category:

Microprocessors

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

24 mm

Peripheral IC Type:

Trade Compliance

AM1705CPTPA3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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