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AM1707CZKB3

Texas Instruments

AM1707CZKB3 by Texas Instruments

AM1707CZKB3 by Texas Instruments is a 32-bit microprocessor with integrated cache and 13-bit address bus width. It operates at a max clock frequency of 50 MHz, suitable for low power mode applications in various industries like automotive and industrial automation.

Median Price

$9.550

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 17 parts In-Stock

1+ parts

$9.550

100+ parts

-

1k+ parts

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17

$9.550

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,044 parts In-Stock

1+ parts

$9.082

100+ parts

-

1k+ parts

-

10k+ parts

-

1,044

$9.082

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Vyrian

USA . 8,377 parts In-Stock

1+ parts

-

100+ parts

-

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8,377

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,346 parts In-Stock

1+ parts

$8.604

100+ parts

-

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-

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2,346

$8.604

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Component Stockers USA

USA . 18 parts In-Stock

1+ parts

$9.260

100+ parts

-

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18

$9.260

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Microchip USA

USA . 206 parts In-Stock

1+ parts

$26.490

100+ parts

$26.110

1k+ parts

$25.920

10k+ parts

$25.730

206

$26.490

$26.110

$25.920

$25.730

Parana Technologies

USA . 1,447 parts In-Stock

1+ parts

$43.997

100+ parts

-

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1,447

$43.997

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DigiPath Technology Company

USA . 1,715 parts In-Stock

1+ parts

$48.446

100+ parts

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1,715

$48.446

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ChromeModa Solutions

Germany . 3,799 parts In-Stock

1+ parts

$49.435

100+ parts

$40.537

1k+ parts

-

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3,799

$49.435

$40.537

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IDEA Electronic Components Group

UK . 245 parts In-Stock

1+ parts

$49.435

100+ parts

$46.963

1k+ parts

$44.492

10k+ parts

-

245

$49.435

$46.963

$44.492

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Northwest PG Solutions

USA . 777 parts In-Stock

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777

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Native Components

USA . 188 parts In-Stock

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188

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Overview

Experience unmatched performance and reliability with the AM1707CZKB3 from Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality microprocessors that are perfect for a wide range of applications. Whether you're looking to enhance your system's speed, efficiency, or overall performance, this product offers exceptional value and benefits to meet your needs. Upgrade to the AM1707CZKB3 today and unlock a world of possibilities for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material is lightweight and durable, making the microprocessor easy to handle and resistant to damage during handling and installation.

Integrated Cache: YES

Integrated cache helps in reducing memory latency and improving overall performance of the microprocessor by storing frequently accessed data and instructions for quick access.

Maximum Supply Voltage: 1.32 V

Operating within the specified maximum supply voltage ensures the longevity and proper functioning of the microprocessor without risking damage due to overvoltage.

Address Bus Width: 13

A wider address bus width allows the microprocessor to access a larger memory space and handle more data, enhancing its performance in processing complex tasks.

Power Supplies (V): 1.2,1.8/3.3

Support for multiple power supply voltages makes the microprocessor versatile and compatible with different systems, ensuring it can be used in various applications.

Maximum Clock Frequency: 50 MHz

With a high maximum clock frequency, the microprocessor can execute instructions at a faster rate, resulting in quicker processing speeds and improved overall performance.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor (CMOS) technology provides low power consumption and high noise immunity, making the microprocessor energy-efficient and reliable for long-term use.

Technical Specifications

Microprocessors AM1707CZKB3 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

13

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Length:

17 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

256

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA256,16X16,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,1.8/3.3

Qualification:

Not Qualified

Maximum Seated Height:

2.05 mm

Speed:

375 rpm

Sub-Category:

Microprocessors

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

17 mm

Peripheral IC Type:

Trade Compliance

AM1707CZKB3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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