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T1042NSE7MQB

NXP Semiconductors

T1042NSE7MQB by NXP Semiconductors

The NXP Semiconductors T1042NSE7MQB microprocessor features a 32-bit architecture with 64-bit external data bus width and integrated cache. With a max clock frequency of 133.3 MHz, it is suitable for high-speed computing applications requiring low power mode operation. The package style is grid array, fine pitch, making it ideal for compact designs in various electronic devices.

Median Price

$111.957

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 98 parts In-Stock

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$176.310

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$138.138

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Verical

USA . 9,960 parts In-Stock

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Rochester

USA . 222 parts In-Stock

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$97.950

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$87.640

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$82.490

222

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$87.640

$82.490

Flip Electronics (Authorized)

USA . 186 parts In-Stock

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Digiode

USA . 4,977 parts In-Stock

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$103.408

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Vyrian

USA . 1,950 parts In-Stock

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$108.850

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Anansix

USA . 2,321 parts In-Stock

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Nova Conductors

Japan . 500 parts In-Stock

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500

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Flip Electronics

USA . 219 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 1,141 parts In-Stock

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$45.753

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Ampacity Inc.

Singapore . 158 parts In-Stock

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$92.520

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Corphita

USA . 168 parts In-Stock

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$97.965

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Microchip USA

USA . 2,749 parts In-Stock

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$210.090

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UNI Independent Distributors

Spain . 7,972 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Continental Prestige Electronics

USA . 1,132 parts In-Stock

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Netroflash

USA . 500 parts In-Stock

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Perfect Parts

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Argo Parts USA

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Overview

Unlock the power of cutting-edge technology with the NXP Semiconductors T1042NSE7MQB microprocessor. Backed by a renowned manufacturer, this high-quality product offers unparalleled performance and reliability in a wide range of applications. From enhanced processing speeds to energy-efficient design, this microprocessor delivers value and benefits that cater to the diverse needs of customers. Experience seamless functionality and top-notch efficiency with the T1042NSE7MQB - the ultimate choice for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microprocessor, ensuring longevity and reliability.

Integrated Cache: YES

Having integrated cache improves the performance of the microprocessor by reducing memory access times, making it a faster and more efficient choice.

Maximum Supply Voltage: 1.03 V

Operating within this voltage range ensures stable performance and prevents damage to the microprocessor, making it a safe and reliable option.

Address Bus Width: 16

With a wider address bus width, the microprocessor can handle larger amounts of memory and data, improving its capability and versatility.

Package Shape: SQUARE

The square shape of the package allows for efficient and compact placement within electronic devices, optimizing space and design.

Bit Size: 32

A larger bit size allows the microprocessor to handle more complex calculations and tasks, making it suitable for demanding applications.

No. of Terminals: 780

Having a high number of terminals enables the microprocessor to interface with various external components and peripherals, increasing its connectivity and functionality.

Minimum Supply Voltage: 0.97 V

Operating at a low minimum supply voltage helps in reducing power consumption and heat generation, making it energy-efficient.

Terminal Finish: TIN SILVER COPPER

This terminal finish provides good conductivity and corrosion resistance, ensuring reliable connections and long-term performance.

Periperhal IC Type: MICROPROCESSOR, RISC

A RISC (Reduced Instruction Set Computing) architecture allows for faster execution of instructions, making the microprocessor efficient for various tasks and applications.

Technology: CMOS

CMOS technology offers low power consumption and high speed operation, making the microprocessor suitable for battery-powered devices and high-performance applications.

Technical Specifications

Microprocessors T1042NSE7MQB attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Address Bus Width:

16

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

133.3 MHz

External Data Bus Width:

64

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B780

JESD-609 Code:

e1

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

780

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

250

Maximum Seated Height:

2.07 mm

Speed:

1200 rpm

Maximum Supply Voltage:

1.03 V

Minimum Supply Voltage:

.97 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

23 mm

Peripheral IC Type:

Trade Compliance

T1042NSE7MQB Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.1

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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