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P1010NXN5HFB

NXP Semiconductors

P1010NXN5HFB by NXP Semiconductors

The NXP Semiconductors P1010NXN5HFB microprocessor features a 32-bit external data bus width, 16-bit address bus width, and integrated cache. Ideal for industrial applications, it operates b/w -40 to 105°C with a max supply voltage of 1.05V. With a grid array package style and fine pitch, this CMOS technology-based processor offers high performance in compact designs.

Median Price

$46.270

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 191 parts In-Stock

1+ parts

$42.800

100+ parts

$34.860

1k+ parts

-

10k+ parts

-

191

$42.800

$34.860

-

-

DigiKey

USA . 84 parts In-Stock

1+ parts

$50.190

100+ parts

$44.864

1k+ parts

$40.658

10k+ parts

-

84

$50.190

$44.864

$40.658

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Rochester

USA . 680 parts In-Stock

1+ parts

-

100+ parts

$46.270

1k+ parts

$41.400

10k+ parts

$38.970

680

-

$46.270

$41.400

$38.970

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,637 parts In-Stock

1+ parts

$48.840

100+ parts

-

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1,637

$48.840

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Nova Conductors

Japan . 39 parts In-Stock

1+ parts

$57.778

100+ parts

-

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39

$57.778

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-

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Flip Electronics

USA . 1,680 parts In-Stock

1+ parts

-

100+ parts

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1,680

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-

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Vyrian

USA . 1,579 parts In-Stock

1+ parts

-

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1,579

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Anansix

USA . 793 parts In-Stock

1+ parts

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793

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,462 parts In-Stock

1+ parts

$43.700

100+ parts

-

1k+ parts

-

10k+ parts

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1,462

$43.700

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-

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Ampacity Inc.

Singapore . 1,431 parts In-Stock

1+ parts

$43.700

100+ parts

-

1k+ parts

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1,431

$43.700

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Corphita

USA . 1,146 parts In-Stock

1+ parts

$46.269

100+ parts

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1,146

$46.269

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Continental Prestige Electronics

USA . 5,687 parts In-Stock

1+ parts

$57.778

100+ parts

-

1k+ parts

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10k+ parts

$56.622

5,687

$57.778

-

-

$56.622

Bastille Electronics

Australia . 120 parts In-Stock

1+ parts

$57.780

100+ parts

$54.891

1k+ parts

-

10k+ parts

$51.424

120

$57.780

$54.891

-

$51.424

Vigor

Singapore . 940 parts In-Stock

1+ parts

$92.540

100+ parts

-

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940

$92.540

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Microchip USA

USA . 311 parts In-Stock

1+ parts

$157.386

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311

$157.386

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Lixinc

USA . 9,347 parts In-Stock

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9,347

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

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5,000

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Argo Parts USA

USA . 1,153 parts In-Stock

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1,153

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UNI Independent Distributors

Spain . 550 parts In-Stock

1+ parts

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550

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Overview

Unleash the power of cutting-edge technology with the P1010NXN5HFB by NXP Semiconductors. Designed for excellence, this microprocessor offers unmatched performance and reliability for a variety of applications. From industrial automation to embedded systems, this product delivers exceptional value and benefits, ensuring seamless operation and efficiency. Trust in NXP Semiconductors' expertise and innovation to take your projects to the next level. Experience the difference with the P1010NXN5HFB.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ensuring the longevity of the microprocessor.

Integrated Cache: YES

Having integrated cache improves the performance of the microprocessor by reducing the time taken to access frequently used data.

Maximum Supply Voltage: 1.05 V

The low maximum supply voltage helps in reducing power consumption and heat generation, making the microprocessor energy efficient.

Address Bus Width: 16

With a wider address bus width, the microprocessor can handle larger amounts of memory efficiently, improving overall performance.

No. of Terminals: 425

Having a high number of terminals allows for more connectivity options, making the microprocessor versatile in various applications.

Package Shape: SQUARE

The square package shape allows for efficient use of space on circuit boards, optimizing the layout and design of electronic devices.

Terminal Finish: TIN SILVER

The use of tin silver terminal finish provides good conductivity and corrosion resistance, ensuring reliable connections in the microprocessor.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperature range makes the microprocessor suitable for rugged environments and extended operating conditions.

Technical Specifications

Microprocessors P1010NXN5HFB attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Address Bus Width:

16

Boundary Scan:

YES

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B425

JESD-609 Code:

e2

Length:

19 mm

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

4

No. of External Interrupts:

4

No. of Terminals:

425

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA425,23X23,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1

Qualification:

Not Qualified

Maximum Seated Height:

1.9 mm

Speed:

800 rpm

Sub-Category:

Microprocessors

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

19 mm

Peripheral IC Type:

Trade Compliance

P1010NXN5HFB Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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