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T1013NSE7PQA

NXP Semiconductors

T1013NSE7PQA by NXP Semiconductors

The NXP Semiconductors T1013NSE7PQA microprocessor features a 64-bit architecture, 16-bit address bus width, and 32-bit external data bus width. It is designed for applications requiring high-speed processing and low power consumption, with integrated cache memory and support for boundary scan testing.

Median Price

$115.188

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 63 parts In-Stock

1+ parts

-

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$102.390

1k+ parts

$91.610

10k+ parts

$86.220

63

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$102.390

$91.610

$86.220

Verical

USA . 55 parts In-Stock

1+ parts

-

100+ parts

$127.987

1k+ parts

$114.513

10k+ parts

$107.775

55

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$127.987

$114.513

$107.775

DigiKey

USA . 43 parts In-Stock

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43

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Flip Electronics (Authorized)

USA . 43 parts In-Stock

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Distributors (In-Stock)

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Digiode

USA . 2,215 parts In-Stock

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$90.060

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-

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2,215

$90.060

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Nova Conductors

Japan . 10 parts In-Stock

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$90.643

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10

$90.643

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Vyrian

USA . 8,780 parts In-Stock

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8,780

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Anansix

USA . 2,451 parts In-Stock

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Flip Electronics

USA . 13 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 849 parts In-Stock

1+ parts

$5.031

100+ parts

-

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849

$5.031

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Ampacity Inc.

Singapore . 56 parts In-Stock

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$80.580

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56

$80.580

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Corphita

USA . 1,244 parts In-Stock

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$85.320

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$85.320

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Netroflash

USA . 100 parts In-Stock

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$90.643

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100

$90.643

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Microchip USA

USA . 2,391 parts In-Stock

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$151.680

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2,391

$151.680

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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10,000

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UNI Independent Distributors

Spain . 1,759 parts In-Stock

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1,759

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Perfect Parts

USA . 94 parts In-Stock

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Overview

Unlock the power of innovation with NXP Semiconductors' T1013NSE7PQA microprocessor. Designed to deliver top-notch performance and efficiency, this cutting-edge technology boasts integrated cache and a wide range of applications. With a focus on quality and reliability, NXP Semiconductors ensures that customers receive the best value for their investment. Experience seamless operation and enhanced functionality with the T1013NSE7PQA, setting new standards in the industry. Elevate your projects and unleash the full potential of your devices with this exceptional microprocessor.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes this microprocessor lightweight and durable, ideal for portable devices.

Integrated Cache: YES

The integrated cache feature enhances the performance of the microprocessor by allowing for faster access to frequently used data, making it a reliable choice for high-speed computation tasks.

Surface Mount: YES

With surface mount capability, this microprocessor is easy to install and saves space on the circuit board, making it suitable for compact electronic devices.

Maximum Supply Voltage: 1.03 V

The maximum supply voltage of 1.03 V ensures efficient power consumption, making this microprocessor energy-efficient and cost-effective.

Address Bus Width: 16

The 16-bit address bus width allows for a large memory address space, making this microprocessor suitable for handling complex data processing tasks.

Package Shape: SQUARE

The square package shape provides a uniform and sturdy design, making this microprocessor easy to handle and install in various electronic devices.

Bit Size: 64

The 64-bit architecture of this microprocessor enables it to handle large amounts of data quickly and efficiently, making it a powerful choice for demanding applications.

No. of Terminals: 525

With 525 terminals, this microprocessor offers a wide range of connectivity options, making it versatile and adaptable to different circuit designs.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array, fine pitch package style allows for high-density mounting, increasing the overall performance and reliability of the microprocessor.

Minimum Supply Voltage: 0.97 V

The minimum supply voltage of 0.97 V ensures stable operation even under low power conditions, making this microprocessor suitable for battery-powered devices.

Technical Specifications

Microprocessors T1013NSE7PQA attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Address Bus Width:

16

Bit Size:

64

Boundary Scan:

YES

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B525

JESD-609 Code:

e1

Length:

19 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

2

No. of External Interrupts:

6

No. of Serial I/Os:

5

No. of Terminals:

525

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA525,23X23,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

2.07 mm

Speed:

1400 rpm

Maximum Supply Current:

5 mA

Maximum Supply Voltage:

1.03 V

Minimum Supply Voltage:

.97 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

19 mm

Peripheral IC Type:

Trade Compliance

T1013NSE7PQA Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.1

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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