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P2010NXE2HFC

NXP Semiconductors

P2010NXE2HFC by NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 689; Package Code: BGA; Package Shape: SQUARE; Minimum Supply Voltage: 1 V;

Median Price

$96.760

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

P2010NXE2HFC by NXP Semiconductors
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Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 171 parts In-Stock

1+ parts

-

100+ parts

$96.760

1k+ parts

$86.570

10k+ parts

$81.480

171

-

$96.760

$86.570

$81.480

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,822 parts In-Stock

1+ parts

$102.134

100+ parts

-

1k+ parts

-

10k+ parts

-

2,822

$102.134

-

-

-

Vyrian

USA . 4,776 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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4,776

-

-

-

-

Flip Electronics

USA . 1,072 parts In-Stock

1+ parts

-

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1k+ parts

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10k+ parts

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1,072

-

-

-

-

Anansix

USA . 627 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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627

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-

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Bristol Electronics

USA . 302 parts In-Stock

1+ parts

-

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302

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Classic Components Corporation

USA . 53 parts In-Stock

1+ parts

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53

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 120 parts In-Stock

1+ parts

$91.380

100+ parts

-

1k+ parts

-

10k+ parts

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120

$91.380

-

-

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Corphita

USA . 1,984 parts In-Stock

1+ parts

$96.759

100+ parts

-

1k+ parts

-

10k+ parts

-

1,984

$96.759

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-

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Microchip USA

USA . 459 parts In-Stock

1+ parts

$129.449

100+ parts

-

1k+ parts

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10k+ parts

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459

$129.449

-

-

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Vigor

Singapore . 449 parts In-Stock

1+ parts

$193.520

100+ parts

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1k+ parts

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10k+ parts

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449

$193.520

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-

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UNI Independent Distributors

Spain . 3,627 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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3,627

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Technical Specifications

Microprocessors P2010NXE2HFC attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Address Bus Width:

16

Boundary Scan:

YES

Maximum Clock Frequency:

100 MHz

External Data Bus Width:

64

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B689

JESD-609 Code:

e2

Length:

31 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

689

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Maximum Seated Height:

2.46 mm

Speed:

800 rpm

Maximum Supply Voltage:

1.1 V

Minimum Supply Voltage:

1 V

Nominal Supply Voltage:

1.05 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

31 mm

Peripheral IC Type:

Trade Compliance

P2010NXE2HFC Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.1

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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