Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
The NXP Semiconductors P2010NSE2MFC microprocessor features 64-bit external data bus width, 16-bit address bus width, and a max clock frequency of 100 MHz. Ideal for applications requiring low power mode and floating point format in a compact grid array package with 689 terminals.
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PLASTIC/EPOXY material provides durability and protection, making the product suitable for various environments.
Integrated cache helps in faster data access and processing, improving overall performance of the microprocessor.
Surface mount capability allows for easy and efficient installation on circuit boards, saving time and effort.
Operates efficiently at low voltage, reducing power consumption and heat generation.
Allows for higher memory addressing capability, enabling efficient data retrieval and storage.
Large number of terminals provide connectivity options for various peripherals and components, enhancing versatility of the product.
Grid array package style offers compact design and high terminal count, making it suitable for space-constrained applications.
RISC architecture is known for its efficiency and high performance in processing complex instructions, making the microprocessor ideal for demanding tasks.
CMOS technology enables low power consumption and high speed operation, ensuring efficient performance of the microprocessor.
Microprocessors P2010NSE2MFC attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors
Address Bus Width:
Boundary Scan:
Maximum Clock Frequency:
External Data Bus Width:
Format:
Integrated Cache:
JESD-30 Code:
JESD-609 Code:
Length:
Low Power Mode:
Moisture Sensitivity Level (MSL):
No. of Terminals:
Package Body Material:
Package Code:
Package Shape:
Package Style (Meter):
Peak Reflow Temperature (C):
Maximum Seated Height:
Speed:
Maximum Supply Voltage:
Minimum Supply Voltage:
Nominal Supply Voltage:
Surface Mount:
Technology:
Terminal Finish:
Terminal Form:
Terminal Pitch:
Terminal Position:
Maximum Time At Peak Reflow Temperature (s):
Width:
Peripheral IC Type:
P2010NSE2MFC Peripheral ICs trade compliance attributes, and parameters.
ECCN
5A002.A.1
ECCN Governance
EAR
HTS
8542.31.00.01
SB
8542.31.00.00
NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.
Executive Director, President, CEO
Kurt Sievers
Executive VP, CFO
Bill Betz
Executive VP, Chief Sales Officer
Ron Martino
ICN8
Fabrication
Fab Initiation
1996
Netherlands
Nijmegen
Wafer Capacity
55,000
ATMC (Austin Tech & Mfg Center)
1995
USA
Austin
30,000
N/A
1989
Germany
Boeblingen
CHD
1993
Chandler
OHTC
1991
24,000
New Expansion Fab
2026
ECHO
2020
10,000
M39029/56-351
Amphenol
CONNECTOR ACCESSORY; Minimum Operating Temperature: -65 Cel; Additional Features: STANDARD: MIL-DTL-38999; Contact Gender: FEMALE; MIL-Connector Accessory Name: CONTACT; Associated Military - Specifications: MIL-DTL-38999;
SMMBT3904LT1G
Onsemi
SMMBT3904LT1G by Onsemi is a NPN BJT with 3 terminals, 0.3W power dissipation, and 40V max collector-emitter voltage. Ideal for small outline applications requiring a transistor with hFE of at least 30, it operates up to 150°C and has a transition frequency of 300MHz.
M24308/2-1F
Positronic Industries
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Mating Info.: MULTIPLE MATING PARTS AVAILABLE; Additional Features: STANDARD: MIL-DTL-24308, POLARIZED; Body or Shell Style: RECEPTACLE;
1N4148
Vishay Intertechnology
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
2N2222A
Boca Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
BAV99
Siemens
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
LM107H/883
Linear Technology
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Technology: BIPOLAR;
1N4148WS
First Components International
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
SS14
Goodwork Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LL4148
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
2N7002
Motorola
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Package Body Material: PLASTIC/EPOXY; Qualification: Not Qualified; Minimum Operating Temperature: -55 Cel;
2N7002 by Vishay Intertechnology is a N-CHANNEL FET with 60V DS Breakdown Voltage, 0.115A Drain Current, and 7.5 ohm On Resistance. Ideal for SWITCHING applications due to its SINGLE configuration with BUILT-IN DIODE. Operates in ENHANCEMENT MODE, suitable for surface mount with GULL WING terminals.
Jiangsu Changjiang Electronics Technology
ULN-2803A
Vishay Sprague
Vishay Sprague's ULN-2803A is an 8-bit peripheral driver with a max supply voltage of 3V. Featuring open-collector output characteristics, it offers built-in transient protections and operates b/w -20°C to 85°C. Ideal for applications requiring sink current flow direction, this rectangular-shaped driver has a terminal pitch of 2.54mm and turn-on/off time of 1us.
08055C104KAT4A
KYOCERA AVX
08055C104KAT4A by KYOCERA AVX is a ceramic capacitor with 0.1uF capacitance, rated for 50V. With X7R temperature characteristics and -55 to 125 °C operating range, it's ideal for SMT applications requiring compact size and high reliability. The wraparound terminals and multi-layer design make it suitable for various electronic circuits.
Vicor
ROHM
RC0805FR-0710RL
Yageo
Yageo's RC0805FR-0710RL is a 10 ohm SMT fixed resistor with 1% tolerance and 0.125 W power dissipation. With a temperature range of -55 to 155 °C, it suits applications requiring precise resistance values in compact surface mount designs.
SMBJ18CA
Mde Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Won-top Electronics
AM3517AZERAC
Texas Instruments
AM3517AZERAC by Texas Instruments is a microprocessor with 16-bit address and data bus width, operating at a max clock frequency of 26 MHz. It features integrated cache, low power mode, and boundary scan capability. Ideal for applications requiring high-speed processing in compact devices like embedded systems and IoT devices.
MPC8280CZUUPEA
NXP Semiconductors
The NXP Semiconductors MPC8280CZUUPEA is a 32-bit microprocessor with integrated cache and 64-bit external data bus width. It operates at a max clock frequency of 100 MHz, suitable for commercial-grade applications requiring high-speed processing. The package style is grid array, low profile, making it ideal for compact electronic devices.
CS80C286-16
Renesas Electronics
CS80C286-16 by Renesas Electronics is a 16 rpm microprocessor with 24-bit address bus width and 16-bit external data bus width. It operates at temperatures b/w 0 to 70 °C, making it suitable for commercial applications requiring low power mode and fixed-point format processing.
P1011NXN2HFB
P1011NXN2HFB by NXP Semiconductors is a 32-bit RISC microprocessor with integrated cache, 16-bit address bus width, and 32-bit external data bus width. It is suitable for applications requiring high-speed processing and features like boundary scan, 4 DMA channels, and a max supply voltage of 1.05V.
MCIMX6U6AVM08AC
Freescale Semiconductor
MICROPROCESSOR, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 2240; Package Code: LFBGA; Package Shape: SQUARE;
T2080NXE8TTB
The NXP Semiconductors T2080NXE8TTB microprocessor features a 64-bit architecture, integrated cache, and operates at speeds up to 1800 rpm. Ideal for industrial applications, this CMOS technology-based processor has a temperature range of -40 to 105°C and comes in a square package with 896 terminals for surface mount assembly.
P4080NSE7PNC
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1295; Package Code: BGA; Package Shape: SQUARE; Maximum Clock Frequency: 133.3 MHz;
MPC880ZP133
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 357; Package Code: BGA; Package Shape: SQUARE; JESD-609 Code: e0;
MCIMX6U6AVM08AC by NXP is a 64-bit microprocessor with 16-bit address bus, operating at max 24 MHz. Ideal for automotive applications, it features low power mode and integrated cache, supporting boundary scan technology. With a temp range of -40 to 125 °C, this CMOS processor has a terminal pitch of 0.8 mm and package style in grid array format.
MCF5206ECAB40
The NXP Semiconductors MCF5206ECAB40 microprocessor features a 32-bit architecture with integrated cache and operates at a max clock frequency of 40 MHz. Ideal for industrial applications, it has a temperature range from -40 to 85°C and supports low power mode for energy efficiency.
MCIMX6X3CVN08AB
MICROPROCESSOR, RISC; Technology: CMOS; Terminal Finish: TIN SILVER COPPER; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e1;
MCF5328CVM240J
MCF5328CVM240J by Freescale Semiconductor is a 32-bit microprocessor with integrated cache, operating at max 80 MHz. It features a 24-bit address bus width and low power mode, suitable for industrial applications requiring high-speed processing in compact devices. The package style is grid array with dimensions of 17mm x 17mm and terminal pitch of 1mm.
MCF54453VP266
MICROPROCESSOR; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 40;
AM3352BZCZA60
AM3352BZCZA60 by Texas Instruments is a 32-bit microprocessor with 131072 RAM words and 16-bit external data bus width. It operates at a max clock frequency of 26 MHz, suitable for industrial applications requiring low power mode and boundary scan capability. With a terminal pitch of 0.8 mm and package style of grid array, it offers high performance in compact designs.
MPC8347ECZQAGDB
MICROPROCESSOR; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 620; Package Code: BGA; Package Shape: SQUARE;
AT91SAM9G45B-CU-999
Microchip Technology
AT91SAM9G45B-CU-999 by Microchip Technology is a 32-bit microprocessor with integrated cache and 8-bit on-chip data RAM. It features a max clock frequency of 50 MHz, suitable for applications requiring high-speed processing. With 37 DMA channels and low power mode, it is ideal for embedded systems needing efficient data transfer and energy-saving capabilities.
LUPXA255A0C200
Intel
Intel LUPXA255A0C200 microprocessor features 32-bit architecture, 26-bit address bus, and operates at a max clock frequency of 3.6864 MHz. Ideal for low power applications with integrated cache and boundary scan capabilities.
MIMXRT1021DAF5A
NXP Semiconductors' MIMXRT1021DAF5A microprocessor features 32-bit architecture, 262144 RAM words, and 24 MHz clock frequency. Ideal for applications requiring low power mode, it offers 57 I/O lines and integrated PWM channels for efficient performance in various embedded systems.
MC7448HX1400ND
MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 360; Package Code: BGA; Package Shape: SQUARE;
AV8063801149203/SR0ND
Intel AV8063801149203/SR0ND microprocessor features 64-bit architecture, 2100 rpm speed, and low power mode. Suitable for various applications due to its CMOS technology, integrated cache, and surface mount package style with 1023 terminals in a grid array format.
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P2010NXN2KFC
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 689; Package Code: BGA; Package Shape: SQUARE; Maximum Supply Voltage: 1.1 V;
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 689; Package Code: BGA; Package Shape: SQUARE; Boundary Scan: YES;
P2010NXN2MHC
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 689; Package Code: BGA; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): 40;
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 689; Package Code: BGA; Package Shape: SQUARE; Terminal Position: BOTTOM;
P2010NXE2MHC
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 689; Package Code: BGA; Package Shape: SQUARE; Bit Size: 32;
P2010NSE2MFC
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 689; Package Code: BGA; Package Shape: SQUARE; Terminal Finish: Tin/Silver (Sn/Ag);
P2010NSN2KFC
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 689; Package Code: BGA; Package Shape: SQUARE; Maximum Clock Frequency: 100 MHz;
P2010NXE2HFC
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 689; Package Code: BGA; Package Shape: SQUARE; Minimum Supply Voltage: 1 V;
P2010NSN2NHC
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 689; Package Code: BGA; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 3;
P2010NSN2HFC
P2010NSE2HHC
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 689; Package Code: BGA; Package Shape: SQUARE; Length: 31 mm;
P2010NXE2KFC
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 689; Package Code: BGA; Package Shape: SQUARE; Format: FLOATING POINT;
P2010NSN2HHC
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 689; Package Code: BGA; Package Shape: SQUARE; Technology: CMOS;
P2010NXE2KHC
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 689; Package Code: BGA; Package Shape: SQUARE; Speed: 1000 rpm;
P2010NSN2KHC
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 689; Package Code: BGA; Package Shape: SQUARE; External Data Bus Width: 64;
P2010NSE2MHC
P2010NSN2KHC,557
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 689; Package Code: BGA; Package Shape: SQUARE; Maximum Seated Height: 2.46 mm;
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