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ADSP-21488KSWZ-3A1

Analog Devices

ADSP-21488KSWZ-3A1 by Analog Devices

Analog Devices' ADSP-21488KSWZ-3A1 microprocessor features 40-bit size, 24-bit address bus width, and 16-bit external data bus width. Ideal for applications requiring a max clock frequency of 25 MHz, such as embedded systems and signal processing tasks.

Median Price

$19.629

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

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Verical

USA . 18 parts In-Stock

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Digiode

USA . 906 parts In-Stock

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$14.260

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Vyrian

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Chip Stock

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Native Components

USA . 493 parts In-Stock

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$2.023

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Northwest PG Solutions

USA . 2,023 parts In-Stock

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Semicontronic

India . 18 parts In-Stock

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$12.760

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$12.441

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$12.377

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Corphita

USA . 846 parts In-Stock

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$13.509

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AZTECH Wire

Italy . 1,111 parts In-Stock

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Vigor

Singapore . 5,000 parts In-Stock

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Parana Technologies

USA . 3,452 parts In-Stock

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IDEA Electronic Components Group

UK . 702 parts In-Stock

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DigiPath Technology Company

USA . 3,452 parts In-Stock

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$95.890

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$92.054

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QUARKTWIN TECHNOLOGY LTD

USA . 15,098 parts In-Stock

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Authorized Procurement Solutions

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RC Electronics

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A-Z Elektronik GmbH

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Kepictronics

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Overview

Unlock the power of cutting-edge technology with the ADSP-21488KSWZ-3A1 from Analog Devices. As a leader in microprocessors, Analog Devices delivers exceptional quality and reliability in every product. This versatile microprocessor is ideal for a wide range of applications, offering seamless integration and superior performance. Experience the value and benefits of this top-of-the-line product, designed to meet your unique needs and exceed your expectations. Elevate your projects with the ADSP-21488KSWZ-3A1 and discover a world of possibilities in digital signal processing.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material helps in providing good insulation and protection for the microprocessor, ensuring durability and reliability.

Integrated Cache: YES

Integrated cache helps in reducing memory access times, improving overall performance of the microprocessor.

Maximum Supply Voltage: 1.15 V

Operating within the specified maximum supply voltage ensures efficient and safe performance of the microprocessor.

Address Bus Width: 24

Having a wider address bus width allows the microprocessor to access larger amounts of memory, enhancing its capabilities.

Package Shape: SQUARE

The square package shape allows for efficient and space-saving integration of the microprocessor into various devices.

Bit Size: 40

A larger bit size enables the microprocessor to handle more complex calculations and processes, making it suitable for demanding tasks.

Power Supplies (V): 1.1,3.3

Having multiple power supply options provides flexibility in design and compatibility with different systems and devices.

No. of Terminals: 100

A higher number of terminals enable effective connectivity and communication with other components, enhancing the functionality of the microprocessor.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

Various package styles offer versatility in mounting and cooling options, catering to different design requirements and environments.

Minimum Supply Voltage: 1.05 V

Operating within the specified minimum supply voltage ensures stable performance and prevents damage to the microprocessor.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, the microprocessor can withstand and operate in demanding thermal conditions.

Minimum Operating Temperature: 0 °C

The ability to operate at low temperatures ensures reliable performance even in cold environments.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish provides good conductivity and solderability, ensuring secure connections and reliable operation.

Terminal Position: QUAD

Quad terminal positioning allows for efficient signal routing and connectivity, optimizing the performance of the microprocessor.

Maximum Seated Height: 1.6 mm

The low maximum seated height enables compact and slim device designs when integrating the microprocessor.

RAM Words: 98304

With a large RAM capacity, the microprocessor can store and process extensive amounts of data efficiently.

Width: 14 mm

Compact width dimensions enable easy integration of the microprocessor into various devices without occupying too much space.

Boundary Scan: YES

Boundary scan feature helps in testing and diagnosing the microprocessor, ensuring reliability and easier troubleshooting.

External Data Bus Width: 16

Having a wider external data bus width allows for faster data transfer rates and efficient communication with external devices.

Maximum Clock Frequency: 25 MHz

Operating at a high clock frequency enables fast processing speeds and real-time responsiveness from the microprocessor.

Length: 14 mm

The compact length dimensions contribute to the overall small form factor of the microprocessor, ideal for space-constrained designs.

Temperature Grade: COMMERCIAL

Designed for commercial use, the microprocessor meets industry standards for reliability and performance in typical operating conditions.

Peripheral IC Type: MICROPROCESSOR

Being a microprocessor, it is specifically designed to handle complex computations and tasks, making it suitable for a wide range of applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, contributing to energy-efficient and reliable operation of the microprocessor.

Terminal Form: GULL WING

Gull wing terminal form provides secure connections and ease of soldering during installation, enhancing the reliability of the microprocessor.

Nominal Supply Voltage: 1.1 V

Operating within the specified nominal supply voltage ensures optimal performance and efficiency of the microprocessor.

Terminal Pitch: 0.5 mm

Having a small terminal pitch allows for high-density mounting and compact PCB layouts when integrating the microprocessor.

Format: FLOATING POINT

The floating-point format allows for precise and efficient handling of decimal numbers and complex mathematical operations by the microprocessor.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate sensitivity to moisture, requiring standard handling procedures to prevent issues during assembly and operation.

Speed: 350 rpm

Operating at a speed of 350 rpm, the microprocessor offers fast response times and processing capabilities for various applications.

Technical Specifications

Microprocessors ADSP-21488KSWZ-3A1 attributes and parameters. Explore more Microprocessors devices from Analog Devices

Specs

Address Bus Width:

24

Bit Size:

40

Boundary Scan:

YES

Maximum Clock Frequency:

25 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

100

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

Power Supplies (V):

1.1,3.3

Qualification:

Not Qualified

RAM Words:

98304

Maximum Seated Height:

1.6 mm

Speed:

350 rpm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.15 V

Minimum Supply Voltage:

1.05 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Trade Compliance

ADSP-21488KSWZ-3A1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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