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AM3703CBCD100

Texas Instruments

AM3703CBCD100 by Texas Instruments

The Texas Instruments AM3703CBCD100 microprocessor features 32-bit architecture, 54 MHz clock frequency, and 65536 RAM words. Ideal for industrial applications requiring a low power mode, this CMOS technology-based processor has a max supply voltage of 1.2 V and operates in temperatures ranging from -40 to 90°C.

Median Price

$33.458

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 119 parts In-Stock

1+ parts

-

100+ parts

$29.740

1k+ parts

$26.610

10k+ parts

$25.040

119

-

$29.740

$26.610

$25.040

DigiKey

USA . 119 parts In-Stock

1+ parts

-

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-

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-

10k+ parts

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119

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Verical

USA . 119 parts In-Stock

1+ parts

-

100+ parts

$37.175

1k+ parts

$33.263

10k+ parts

$31.300

119

-

$37.175

$33.263

$31.300

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 240 parts In-Stock

1+ parts

$27.759

100+ parts

-

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-

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240

$27.759

-

-

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Vyrian

USA . 3,883 parts In-Stock

1+ parts

-

100+ parts

-

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3,883

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DigiKey Marketplace

USA . 119 parts In-Stock

1+ parts

-

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119

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 498 parts In-Stock

1+ parts

$1.180

100+ parts

-

1k+ parts

-

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498

$1.180

-

-

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Northwest PG Solutions

USA . 962 parts In-Stock

1+ parts

$1.298

100+ parts

-

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962

$1.298

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Corphita

USA . 889 parts In-Stock

1+ parts

$26.298

100+ parts

-

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889

$26.298

-

-

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Component Stockers USA

USA . 77 parts In-Stock

1+ parts

$29.770

100+ parts

$27.980

1k+ parts

-

10k+ parts

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77

$29.770

$27.980

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-

Microchip USA

USA . 1,467 parts In-Stock

1+ parts

$73.670

100+ parts

$72.390

1k+ parts

$71.750

10k+ parts

$71.110

1,467

$73.670

$72.390

$71.750

$71.110

Parana Technologies

USA . 1,536 parts In-Stock

1+ parts

$75.789

100+ parts

-

1k+ parts

-

10k+ parts

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1,536

$75.789

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-

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DigiPath Technology Company

USA . 579 parts In-Stock

1+ parts

$83.453

100+ parts

-

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579

$83.453

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-

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ChromeModa Solutions

Germany . 3,262 parts In-Stock

1+ parts

$85.156

100+ parts

$69.828

1k+ parts

-

10k+ parts

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3,262

$85.156

$69.828

-

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IDEA Electronic Components Group

UK . 1,063 parts In-Stock

1+ parts

$85.156

100+ parts

$80.898

1k+ parts

$76.640

10k+ parts

-

1,063

$85.156

$80.898

$76.640

-

Overview

Unlocking endless possibilities with the AM3703CBCD100 by Texas Instruments. Crafted with precision and expertise, this microprocessor offers unparalleled quality and reliability. Perfect for a wide range of applications, this powerhouse delivers exceptional performance and efficiency. Experience seamless operation and enhanced productivity with this cutting-edge technology. Elevate your projects with the AM3703CBCD100 and redefine what's possible.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the microprocessor, ensuring a longer lifespan.

Integrated Cache: YES

Having integrated cache improves the processing speed and efficiency of the microprocessor.

Maximum Supply Voltage: 1.2 V

Operating at a relatively low maximum supply voltage helps in conserving energy and reducing heat generation.

RAM Words: 65536

With a high number of RAM words, the microprocessor can handle and process a larger amount of data effectively.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a RISC-based microprocessor, it can perform complex instructions with high efficiency, resulting in faster processing speeds.

Technical Specifications

Microprocessors AM3703CBCD100 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

26

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

54 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B515

JESD-609 Code:

e1

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

515

On Chip Data RAM Width:

8

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA515,26X26,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.1,1.8

Qualification:

Not Qualified

RAM Words:

65536

Maximum Seated Height:

1 mm

Speed:

1000 rpm

Sub-Category:

Microprocessors

Maximum Supply Current:

900 mA

Maximum Supply Voltage:

1.2 V

Minimum Supply Voltage:

.9 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

AM3703CBCD100 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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