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AM3715CBCA

Texas Instruments

AM3715CBCA by Texas Instruments

AM3715CBCA by Texas Instruments is a 32-bit microprocessor with integrated cache, operating at up to 54 MHz. It features an address bus width of 26 bits and external data bus width of 16 bits. Ideal for industrial applications requiring high-speed processing in a compact package.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,751 parts In-Stock

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Vyrian

USA . 3,655 parts In-Stock

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3,655

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AZTECH Wire

Italy . 739 parts In-Stock

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$12.185

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739

$12.185

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One Stop Electronics

USA . 1,493 parts In-Stock

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$23.000

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Parana Technologies

USA . 398 parts In-Stock

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$50.793

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398

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IDEA Electronic Components Group

UK . 2,239 parts In-Stock

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$57.071

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$54.217

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$51.364

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2,239

$57.071

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$51.364

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ChromeModa Solutions

Germany . 1,635 parts In-Stock

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$57.071

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$46.798

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Microchip USA

USA . 10,384 parts In-Stock

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Northwest PG Solutions

USA . 2,376 parts In-Stock

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Corphita

USA . 2,138 parts In-Stock

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DigiPath Technology Company

USA . 1,016 parts In-Stock

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$51.455

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Native Components

USA . 656 parts In-Stock

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Overview

Unleash the power of innovation with the AM3715CBCA by Texas Instruments. As a leader in microprocessor technology, Texas Instruments delivers top-notch quality and reliability. Designed for a wide range of applications, this microprocessor offers unmatched performance and efficiency. With integrated cache and low power mode, the AM3715CBCA provides exceptional value and benefits to customers looking for cutting-edge solutions. Elevate your projects with the Texas Instruments AM3715CBCA and experience the difference in quality and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body ensures durability and protection for the microprocessor.

Integrated Cache: YES

Having an integrated cache helps in improving the overall performance and efficiency of the microprocessor by reducing memory access times.

Surface Mount: YES

The surface mount capability makes it easier to assemble and install the microprocessor on a circuit board, saving time and effort.

Maximum Supply Voltage: 1.2 V

The maximum supply voltage of 1.2 V ensures safe and stable operation of the microprocessor within the specified range.

Address Bus Width: 26

The 26-bit address bus width allows for efficient memory addressing and data transfer capabilities, enhancing the overall performance of the microprocessor.

Package Shape: SQUARE

The square package shape provides a compact and space-saving design for the microprocessor, making it suitable for various applications with limited space.

Bit Size: 32

With a 32-bit architecture, the microprocessor can handle larger chunks of data at a time, increasing its processing capabilities and speed.

Power Supplies (V): 1.1,1.8

The availability of multiple power supply options (1.1V and 1.8V) gives flexibility in designing and operating the microprocessor in different scenarios and power requirements.

No. of Terminals: 515

The high number of terminals (515) on the microprocessor allow for various connections and interfaces, enabling connectivity with other components in a complex system.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The grid array package style with a very thin profile and fine pitch offers high-density packaging and efficient heat dissipation for the microprocessor, enhancing its reliability and performance.

Minimum Supply Voltage: 0.9 V

The minimum supply voltage of 0.9V ensures the microprocessor can operate efficiently even at low power levels, saving energy and reducing heat generation.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature of 105°C, the microprocessor can withstand elevated temperatures in industrial settings without compromising performance or reliability.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows the microprocessor to function reliably in cold environments or during temperature fluctuations.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin, silver, and copper provides good conductivity, corrosion resistance, and ensures reliable connections for the microprocessor.

Terminal Position: BOTTOM

Having the terminals at the bottom of the microprocessor simplifies the assembly process and allows for easy interface with other components on the circuit board.

Maximum Seated Height: 1 mm

The low maximum seated height of 1mm makes the microprocessor suitable for compact designs and applications where space constraints are a concern.

Width: 14 mm

The width of 14mm provides a compact form factor for the microprocessor, allowing for easy integration into various electronic devices and systems.

Boundary Scan: YES

Having boundary scan capability enables efficient testing and debugging of the microprocessor during the manufacturing process, ensuring high quality and reliability.

External Data Bus Width: 16

With a 16-bit external data bus width, the microprocessor can handle data transfers with external devices efficiently, improving overall system performance.

Maximum Clock Frequency: 54 MHz

The high maximum clock frequency of 54MHz allows the microprocessor to operate at high speeds, delivering responsive performance in demanding applications.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures proper soldering and assembly of the microprocessor on the circuit board, maintaining reliability and stability.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C indicates the temperature at which the microprocessor can be safely soldered onto the circuit board without damage.

Length: 14 mm

The length of 14mm provides a balanced form factor for the microprocessor, making it suitable for various applications while ensuring efficient thermal management.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperature grades, the microprocessor can operate reliably in harsh environments and high-temperature conditions without compromising performance.

Peripheral IC Type: MICROPROCESSOR, RISC

With RISC architecture, the microprocessor offers efficient instruction execution and streamlined processing, making it suitable for embedded systems and high-performance applications.

Technology: CMOS

Using CMOS technology ensures low power consumption, high speed, and reduced heat generation for the microprocessor, making it energy-efficient and reliable.

Terminal Form: BALL

The ball terminal form simplifies the installation and connections of the microprocessor, providing reliable contact points for seamless integration into circuit boards.

Maximum Supply Current: 800 mA

The maximum supply current of 800mA indicates the maximum amount of current the microprocessor can draw from the power supply, ensuring safe and stable operation.

Nominal Supply Voltage: 1.1 V

The nominal supply voltage of 1.1V represents the standard operating voltage for the microprocessor, ensuring compatibility with most power sources.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5mm allows for high-density packaging and precise connections on the microprocessor, enabling efficient signal transmission and performance.

Format: FLOATING POINT

The floating-point format enables the microprocessor to handle complex mathematical calculations and graphics processing with high precision and accuracy, suitable for scientific and multimedia applications.

Moisture Sensitivity Level (MSL): 3

Having a moisture sensitivity level of 3 indicates the level of protection required during storage and handling to prevent moisture-related damage to the microprocessor.

Speed: 800 rpm

The speed of 800rpm indicates the rotational speed of any cooling fans or components required to maintain optimal operating temperatures for the microprocessor.

Low Power Mode: YES

The low power mode capability allows the microprocessor to operate in a power-efficient state when idle or under low processing demands, conserving energy and prolonging battery life.

Technical Specifications

Microprocessors AM3715CBCA attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

26

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

54 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B515

JESD-609 Code:

e1

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

515

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA515,26X26,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.1,1.8

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Speed:

800 rpm

Sub-Category:

Microprocessors

Maximum Supply Current:

800 mA

Maximum Supply Voltage:

1.2 V

Minimum Supply Voltage:

.9 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

AM3715CBCA Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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